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Flatpack (electronics)
Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count. The main vehicle for testing of high reliability flatpack packages has been MIL-PRF-38534 (General Specification for Hybrid Microcircuits). This document outlines the general requirements of fully assembled devices, whether they are single chip, multichip, or of hybrid technology. The test procedures of these requirements are found in MIL-STD-883 (Test Methods and Procedures for Microelectronics) as a listing of test methods. These methods cover various aspects of the minimum requirements that a microelectronics device must be able ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
KL TI SN5451 Logic IC
KL, kL, kl, or kl. may refer to: Businesses and organizations * KLM, a Dutch airline (IATA airline designator KL) * Royal Netherlands Army, Koninklijke Landmacht, the Royal Netherlands Army * Women's List, Kvenna Listin ("Women's List"), a political party in Iceland * KL FM, a Malay language radio station Places * Kaiserslautern, Germany (license plate code KL) * Kerala, India (ISO 3166-2:IN subcode KL) * Kirkland Lake, Ontario, Canada * Kowloon, Hong Kong * Kuala Lumpur, Malaysia Science, technology, and mathematics * KL engine, version of the Mazda K engine * Klepton (kl.), a type of species in zoology * Kiloliter (kL), a unit of volume * Kullback–Leibler divergence in mathematics * KL (gene), a gene which encodes the klotho enzyme in humans Other uses * Jeep Cherokee (KL) * Kalaallisut language (ISO 639 alpha-2 language code "kl") * Kl (digraph), used in the Zulu language to write /kʟ̥ʼ/ or /kxʼ/ * Konzentrationslager, or concentration camp, abbreviated KZ or KL * ''KL â ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Agc Flatp
AGC may refer to: Organizations In business * AGC Inc. (formerly Asahi Glass Co.), a glass manufacturer * Associated General Contractors of America, an association of commercial construction contractors * Australian Guarantee Corporation, a financial company Military * Army Geospatial Center, part of the US Army Corps of Engineers * Adjutant General's Corps, in the British Army * Amphibious Force, Flagship a World War 2 ship. Religious organizations * Apostolic Generation Church, a non-denominational church located in Jakarta, Indonesia * Associated Gospel Churches of Canada, a Canadian evangelical Christian denomination Other organizations * Assyrian General Conference, a political organization in Iraq * Autodefensas Gaitanistas de Colombia (aka The Gulf Clan), a drug cartel and paramilitary group in Colombia Science and technology * Apollo Guidance Computer, for the Apollo program * Atypical Glandular Cells, in the Bethesda system for reporting Pap smear results * A ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Terminal (electronics)
A terminal is the point at which a conductor from a component, device or network comes to an end. ''Terminal'' may also refer to an electrical connector at this endpoint, acting as the reusable interface to a conductor and creating a point where external circuits can be connected. A terminal may simply be the end of a wire or it may be fitted with a connector or fastener. In network analysis, ''terminal'' means a point at which connections can be made to a network in theory and does not necessarily refer to any physical object. In this context, especially in older documents, it is sometimes called a pole. On circuit diagrams, terminals for external connections are denoted by empty circles. They are distinguished from nodes or junctions which are entirely internal to the circuit, and are denoted by solid circles. All electrochemical cells have two terminals (electrodes) which are referred to as the anode and cathode or positive (+) and negative (-). On many dry batteries, t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lead (electronics)
In electronics, a lead () is an electrical connection consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole electronic components are also often called ''pins''; in ball grid array packages, they are in form of small spheres, and are therefore called "balls". Many electrical components such as capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array packages. Integrated circuit pins often either bend under th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MIL-PRF-38534
The MIL-PRF-38534 specification establishes the general performance requirements for hybrid microcircuits (hybrid integrated circuit), multi-chip modules (MCM) and, similar devices and the verification and validation requirements for ensuring that these devices meet the applicable performance requirements. Verification is accomplished through the use of one of two quality programs. The main body of this specification describes the performance requirements and the requirements for obtaining a Qualified Manufacturers List (QML) listing. The appendices of this specification are intended for guidance to aid a manufacturer in developing their verification program. Detail requirements, specific characteristics, and other provisions that are sensitive to the particular intended use should be specified in the applicable device acquisition specification. The intent of this specification is to allow the device manufacturer the flexibility to implement best commercial practices to the maximum e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MIL-STD-883
The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The standard was issued by Department of Defense Department of Defence or Department of Defense may refer to: Current ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flatpack IC On Board
Ready-to-assemble furniture (RTA), also known as knock-down furniture (KD), flat pack furniture, or kit furniture, is a form of furniture that requires customer assembly. The separate components are packed for sale in cartons which also contain assembly instructions and sometimes hardware. The furniture is generally simple to assemble with basic tools such as screwdrivers, which are also sometimes included. Ready-to-assemble furniture is popular with consumers who wish to save money by assembling the product themselves. Producers and merchants benefit from selling ready-to-assemble furniture because furniture is bulky once assembled, and thus more expensive to store and to deliver. Since the assembly work is done by the consumer instead of by the manufacturer, its price can be lower. A furniture assembly service industry has developed, making it easy for consumers to employ someone knowledgeable to assemble their furniture for them. Produced mainly from chipboard or medium den ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Texas Instruments
Texas Instruments Incorporated (TI) is an American technology company headquartered in Dallas, Texas, that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. It is one of the top 10 semiconductor companies worldwide based on sales volume. The company's focus is on developing analog chips and embedded processors, which account for more than 80% of its revenue. TI also produces TI digital light processing technology and education technology products including calculators, microcontrollers, and multi-core processors. The company holds 45,000 patents worldwide as of 2016. Texas Instruments emerged in 1951 after a reorganization of Geophysical Service Incorporated, a company founded in 1930 that manufactured equipment for use in the seismic industry, as well as defense electronics. TI produced the world's first commercial silicon transistor in 1954, and the same year designed and manufactured t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-5
In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The ''TO'' element stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC. The first commercial silicon transistors, the 2N696 and 2N697 from Fairchild Semiconductor, came in a TO-5 package. Construction and orientation The tab is located 45° from pin 1, which is typically the emitter. The typical TO-5 package has a base diameter of , a cap diameter of , a cap height of . The pins are isolated from the package by individual glass-metal seals, or by a single resin potting. Sometimes one pin is connected directly to the metal case. Variants Several variants of the original TO-5 package have the same cap dimensions but differ in the number and length of the leads (wires). Somewhat incorrectly, TO-5 and TO-39 are often used in manufacturer's literature as synonyms for any package with the cap dimensions of TO ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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