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Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs su ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
NXP PCF8577C LCD Driver With I²C (Colour Corrected)
NXP Semiconductors N.V. (NXP) is a Dutch semiconductor manufacturer, semiconductor designer and manufacturer with headquarters in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 30 countries. NXP reported revenue of $11.06 billion in 2021. Originally spun off from Philips in 2006, NXP completed its initial public offering, on August 6, 2010, with shares trading on NASDAQ under the ticker symbol ''NXPI''. On December 23, 2013, NXP Semiconductors was added to the NASDAQ-100, NASDAQ 100. On March 2, 2015, it was announced that NXP would merge with Freescale Semiconductor. The merger was closed on December 7, 2015. On October 27, 2016, it was announced that Qualcomm would try to buy NXP. Because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, the attempt was effectively cancelled on July 26, 2018. Description NXP provides technology solutions targeting the Automotive industry, automotive, industri ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Moore's Law
Moore's law is the observation that the number of transistors in a dense integrated circuit (IC) doubles about every two years. Moore's law is an observation and projection of a historical trend. Rather than a law of physics, it is an empirical relationship linked to gains from experience in production. The observation is named after Gordon Moore, the co-founder of Fairchild Semiconductor and Intel (and former CEO of the latter), who in 1965 posited a doubling every year in the number of components per integrated circuit, and projected this rate of growth would continue for at least another decade. In 1975, looking forward to the next decade, he revised the forecast to doubling every two years, a compound annual growth rate (CAGR) of 41%. While Moore did not use empirical evidence in forecasting that the historical trend would continue, his prediction held since 1975 and has since become known as a "law". Moore's prediction has been used in the semiconductor industry to g ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Werner Jacobi
Werner Jacobi (March 31, 1904 – probably May 3, 1985) was a German physicist and inventor. Life and work Jacobi studied mechanical engineering at the Technical University of Munich and then physics at the Ludwig Maximilian University of Munich, University of Munich. In his dissertation, initially supervised by Wilhelm Wien and after Wein's death by Eduard Rüchardt, he dealt with the charges of the mercury atoms in the canal jet (German: ''Ladungen der Quecksilberatome im Kanalstrahl''). With this work he was awarded a Doctorate of Philosophy. On November 4, 1929, Jacobi joined Siemens & Halske AG. He worked at the Siemens tube factory in Berlin, where he became head of the laboratory in 1934 and quickly rose further, becoming chief engineer in 1937 and authorized representative in 1938. Shortly after his appointment to the authorized signatory in 1941, he was transferred to the ''Wernerwerk für Funktechnik'' in Vienna, where he became department director in 1944. In 1949, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Tax Avoidance
Tax avoidance is the legal usage of the tax regime in a single territory to one's own advantage to reduce the amount of tax that is payable by means that are within the law. A tax shelter is one type of tax avoidance, and tax havens are jurisdictions that facilitate reduced taxes. Tax avoidance should not be confused with tax evasion, which is illegal. Forms of tax avoidance that use legal tax laws in ways not necessarily intended by the government are often criticized in the court of public opinion and by journalists. Many corporations and businesses that take part in the practice experience a backlash from their active customers or online. Conversely, benefiting from tax laws in ways that were intended by governments is sometimes referred to as tax planning. The World Bank's World Development Report 2019 on the future of work supports increased government efforts to curb tax avoidance as part of a new social contract focused on human capital investments and expanded social p ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Loewe 3NF
The Loewe 3NF was an early attempt to combine several functions in one electronic device. Produced by the German Loewe-Audion GmbH as early as 1926, the device consisted of three triode valves (tubes) in a single glass envelope together with two fixed capacitors and four fixed resistors required to make a complete radio receiver. The resistors and capacitors had to be sealed in their own glass tubes to prevent them from contaminating the vacuum. The only other parts required to build a radio receiver were the tuning coil, the tuning capacitor and the loudspeaker. The device was produced not to enter the integrated circuit era several decades early, but to evade German taxes levied on a per valveholder basis. As the Loewe set had only one valveholder, it was able to substantially undercut the competition. The resultant radio receiver required a 90 volt HT plus a 4 volt LT (A and B) battery (the HT battery provided not only 82.5 volts for the HT, but also two grid bias supplies ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Kilby Solid Circuit
Kilby is a village and civil parish in the Blaby district of Leicestershire, England. Kilby is the easternmost village in the district, and is south east of Leicester. Kilby civil parish includes the former parish of Foston and it's deserted medieval village. Nearby places are Countesthorpe , Fleckney , Arnesby , Wistow and Kilby Bridge . In 1870–72, John Marius Wilson's ''Imperial Gazetteer of England and Wales'' described Kilby as follows: History Kilby has had the origins of its name possibly traced back to a Scandinavian form of Old English, being translated to 'children's farm/settlement.' Kilby was mentioned in the Domesday book where it was said to have been originally formed around the parish Church of St. Mary Magdalene. In the Domesday book of 1068 Kilby or Cilebi, as it was spelt, resided in a district called 'Guthlaxton Wapentake' under the ownership of Oger the Breton who was recorded as Tennant-in-chief. Kilby was recorded as having "28 households, containin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hybrid Integrated Circuit
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Overview "Integrated circuit" as the term is currently used refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips. Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits. Hybrid circuits could be enc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thick-film Technology
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. Main manufacturing technique is screen printing (stenciling), which in addition to use in manufacturing electronic devices can also be used for various graphic reproduction targets. It became one of the key manufacturing/miniaturisation techniques of electronic devices/modules during 1950s. Typical film thickness – manufactured with thick film manufacturing processes for electronic devices – is 0.0001 to 0.1 mm. Thick-film circuits/modules are widely used in the automotive industry, both in sensors, e.g. mixture of fuel/air, pressure sensors, engine and gearbox controls, sensor for releasing airbags, ignitors to airbags; common is that high reliability is required, often extended temperature range also along massive thermocycling of circuits without failure. Other application areas ar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thin-film Transistor
A thin-film transistor (TFT) is a special type of field-effect transistor (FET) where the transistor is thin relative to the plane of the device. TFTs are grown on a supporting (but non-conducting) substrate. A common substrate is glass, because the traditional application of TFTs is in liquid-crystal displays (LCDs). This differs from the conventional bulk metal oxide field effect transistor ( MOSFET), where the semiconductor material typically ''is'' the substrate, such as a silicon wafer. Design and Manufacture TFTs can be fabricated with a wide variety of semiconductor materials. Because it is naturally abundant and well understood, amorphous or polycrystalline silicon was historically used as the semiconductor layer. However, because of the low mobility of amorphous silicon and the large device-to-device variations found in polycrystalline silicon, other materials have been studied for use in TFTs. These include cadmium selenide, metal oxides such as indium gallium zin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3D IC
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global ( package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; 3D heterogeneous integration; and 3 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States. JEDEC has over 300 members, including some of the world's largest computer companies. Its scope and past activities includes standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the lead-free manufacturing transition. The origin of JEDEC traces back to 1944, when RMA (subsequently renamed EIA) and NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council. NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became a separate trade association under the current name, but maintained an EIA alliance, until EIA ceased o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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