Hybrid Circuit
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Hybrid Circuit
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Overview "Integrated circuit" as the term is currently used refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips. Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits. Hybrid circuits could be enc ...
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Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ...
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System In A Package
A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die. SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with ...
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Chip On Board
Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly. In some cases, COB construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads. COB effectively merges two levels of electronic packaging: level 1 (components) and level 2 (wiring boards), and may be referred to as "level 1.5".John H. Lau, ''Chip On Board: Technology for Multichip Modules'', Springer Science & Business Media, 1994 pages 1-3 Construction A finished semiconductor wafer is cut into dies. Each die is then physically bonded to the PCB. Three different methods are used to connect the terminal pads of the integrated circuit (or other semicond ...
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Tube Sound
Tube sound (or valve sound) is the characteristic sound associated with a vacuum tube amplifier (valve amplifier in British English), a vacuum tube-based audio amplifier. At first, the concept of ''tube sound'' did not exist, because practically all electronic amplification of audio signals was done with vacuum tubes and other comparable methods were not known or used. After introduction of solid state amplifiers, tube sound appeared as the logical complement of transistor sound, which had some negative connotations due to crossover distortion in early transistor amplifiers. However, solid state amplifiers have been developed to be flawless and the sound is later regarded neutral compared to tube amplifiers. Thus the tube sound now means 'euphonic distortion.' The audible significance of tube amplification on audio signals is a subject of continuing debate among audio enthusiasts. (also found in ) Many electric guitar, electric bass, and keyboard players in several genres also pr ...
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Audio Amplifier
An audio power amplifier (or power amp) is an electronic amplifier that amplifies low-power electronic audio signals, such as the signal from a radio receiver or an electric guitar pickup, to a level that is high enough for driving loudspeakers or headphones. Audio power amplifiers are found in all manner of sound systems including sound reinforcement, public address and home audio systems and musical instrument amplifiers like guitar amplifiers. It is the final electronic stage in a typical audio playback chain before the signal is sent to the loudspeakers. The preceding stages in such a chain are low power audio amplifiers which perform tasks like pre-amplification of the signal (this is particularly associated with record turntable signals, microphone signals and electric instrument signals from pickups, such as the electric guitar and electric bass), equalization (e.g., adjusting the bass and treble), tone controls, mixing different input signals or adding electro ...
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Vacuum Tube
A vacuum tube, electron tube, valve (British usage), or tube (North America), is a device that controls electric current flow in a high vacuum between electrodes to which an electric voltage, potential difference has been applied. The type known as a thermionic tube or thermionic valve utilizes thermionic emission of electrons from a hot cathode for fundamental electronic functions such as signal amplifier, amplification and current rectifier, rectification. Non-thermionic types such as a vacuum phototube, however, achieve electron emission through the photoelectric effect, and are used for such purposes as the detection of light intensities. In both types, the electrons are accelerated from the cathode to the anode by the electric field in the tube. The simplest vacuum tube, the diode (i.e. Fleming valve), invented in 1904 by John Ambrose Fleming, contains only a heated electron-emitting cathode and an anode. Electrons can only flow in one direction through the device—fro ...
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Transistors
upright=1.4, gate (G), body (B), source (S) and drain (D) terminals. The gate is separated from the body by an insulating layer (pink). A transistor is a semiconductor device used to Electronic amplifier, amplify or electronic switch, switch electrical signals and electrical power, power. The transistor is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more are found embedded in integrated circuits. Austro-Hungarian physicist Julius Edgar Lilienfeld proposed the concept of a field-effect transistor in 1926, but it was not possible to actually construc ...
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Hybrid Coil
A hybrid coil (or bridge transformer, or sometimes hybrid) is a transformer that has three windings, and which is designed to be configured as a circuit having four ports that are conjugate in pairs. A signal arriving at one port is divided equally between the two adjacent ports but does not appear at the opposite port. In the schematic diagram, the signal into W splits between X and Z, and no signal passes to Y. Similarly, signals into X split to W and Y with none to Z, etc. Correct operation requires matched characteristic impedance at all four ports. Hybrids are a class of directional coupler in which the input port power is split equally between the two output ports. Forms of hybrid other than transformer coils are possible; any format of directional coupler can be designed to be a hybrid. These formats include transmission lines and waveguides. Explanation The primary use of a voiceband hybrid coil is to convert between 2-wire and 4-wire operation in sequential se ...
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Three-dimensional Space
Three-dimensional space (also: 3D space, 3-space or, rarely, tri-dimensional space) is a geometric setting in which three values (called ''parameters'') are required to determine the position (geometry), position of an element (i.e., Point (mathematics), point). This is the informal meaning of the term dimension. In mathematics, a tuple of Real number, numbers can be understood as the Cartesian coordinates of a location in a -dimensional Euclidean space. The set of these -tuples is commonly denoted \R^n, and can be identified to the -dimensional Euclidean space. When , this space is called three-dimensional Euclidean space (or simply Euclidean space when the context is clear). It serves as a model of the physical universe (when relativity theory is not considered), in which all known matter exists. While this space remains the most compelling and useful way to model the world as it is experienced, it is only one example of a large variety of spaces in three dimensions called ...
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Low Temperature Co-fired Ceramic
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications. Co-fired ceramic devices are fabricated using a multilayer approach. The starting material is composite green tapes, consisting of ceramic particles mixed with polymer binders. The tapes are flexible and can be machined, for example, using cutting, milling, punching and embossing. Metal structures can be added to the layers, commonly using filling and screen printing. Individual tapes are then bonded together in a lamination procedure before the devices are fired in a kiln, wh ...
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