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Alexander Coucoulas
Alexander Coucoulas is an American inventor, research engineer, and author. He was named "father of thermosonic bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, ''Wire Bonding In Microelectronics.Coucoulas, A., Trans. Metallurgical Society of AIME, "Ultrasonic Welding of Aluminum Leads to Tantalum Thin Films", 1966, pp. 587–589. abstract https://sites.google.com/site/coucoulasthermosonicbondaltaCoucoulas, A., "Hot Work Ultrasonic Bonding – A Method Of Facilitating Metal Flow By Restoration Processes", Proc. 20th IEEE Electronic Components Conf. Washington, D.C., May 1970, pp. 549–556.https://sites.google.com/site/hotworkultrasonicbonding A thermosonic bond is formed using a set of parameters which include ultrasonic, thermal and mechanical (force) energies. Thermosonic bonding is widely used to electrically connect silicon integrated circuit microprocessor chipsT.R. Reid, "The Chip ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wire Bonding
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermosonic Bonding
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, ''Wire Bonding In Microelectronics''.Coucoulas, A., Trans. Metallurgical Society Of AIME, "Ultrasonic Welding of Aluminum Leads to Tantalum Thin Films", 1966, pp. 587–589. abstract https://sites.google.com/site/coucoulasthermosonicbondaltaCoucoulas, A., "Hot Work Ultrasonic Bonding – A Method Of Facilitating Metal Flow By Restoration Processes", Proc. 20th IEEE Electronic Components Conf. Washington, D.C., May 1970, pp. 549–556.https://sites.google.com/site/hotworkultrasonicbonding Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of to ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SQUID
True squid are molluscs with an elongated soft body, large eyes, eight arms, and two tentacles in the superorder Decapodiformes, though many other molluscs within the broader Neocoleoidea are also called squid despite not strictly fitting these criteria. Like all other cephalopods, squid have a distinct head, bilateral symmetry, and a mantle. They are mainly soft-bodied, like octopuses, but have a small internal skeleton in the form of a rod-like gladius (cephalopod), gladius or pen, made of chitin. Squid diverged from other cephalopods during the Jurassic and occupy a similar role to teleost fish as open water predators of similar size and behaviour. They play an important role in the open water food web. The two long tentacles are used to grab prey and the eight arms to hold and control it. The beak then cuts the food into suitable size chunks for swallowing. Squid are rapid swimmers, moving by Aquatic locomotion#Jet propulsion, jet propulsion, and largely locate their ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Packaging (microfabrication)
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signal ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Living People
Related categories * :Year of birth missing (living people) / :Year of birth unknown * :Date of birth missing (living people) / :Date of birth unknown * :Place of birth missing (living people) / :Place of birth unknown * :Year of death missing / :Year of death unknown * :Date of death missing / :Date of death unknown * :Place of death missing / :Place of death unknown * :Missing middle or first names See also * :Dead people * :Template:L, which generates this category or death years, and birth year and sort keys. : {{DEFAULTSORT:Living people 21st-century people People by status ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
1933 Births
Events January * January 11 – Sir Charles Kingsford Smith makes the first commercial flight between Australia and New Zealand. * January 17 – The United States Congress votes in favour of Philippines independence, against the wishes of U.S. President Herbert Hoover. * January 28 – "Pakistan Declaration": Choudhry Rahmat Ali publishes (in Cambridge, UK) a pamphlet entitled ''Now or Never; Are We to Live or Perish Forever?'', in which he calls for the creation of a Muslim state in northwest India that he calls " Pakstan"; this influences the Pakistan Movement. * January 30 ** National Socialist German Workers Party leader Adolf Hitler is appointed Chancellor of Germany by President of Germany Paul von Hindenburg. ** Édouard Daladier forms a government in France in succession to Joseph Paul-Boncour. He is succeeded on October 26 by Albert Sarraut and on November 26 by Camille Chautemps. February * February 1 – Adolf Hitler gives his "Proclamation to ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
American Inventors
American(s) may refer to: * American, something of, from, or related to the United States of America, commonly known as the "United States" or "America" ** Americans, citizens and nationals of the United States of America ** American ancestry, people who self-identify their ancestry as "American" ** American English, the set of varieties of the English language native to the United States ** Native Americans in the United States, indigenous peoples of the United States * American, something of, from, or related to the Americas, also known as "America" ** Indigenous peoples of the Americas * American (word), for analysis and history of the meanings in various contexts Organizations * American Airlines, U.S.-based airline headquartered in Fort Worth, Texas * American Athletic Conference, an American college athletic conference * American Recordings (record label), a record label previously known as Def American * American University, in Washington, D.C. Sports teams Soccer * B ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Beam Lead Technology
Beam lead technology is a method of fabricating a semiconductor device. Its original application was to high-frequency silicon switching transistors and high-speed integrated circuits. It eliminated the labor-intensive wire-bonding process used for integrated circuits at the time and allowed automated assembly of semiconductor chips onto larger substrates to produce hybrid integrated circuits. History In the early 1960s, M.P. LepselterPresentation at Electron Devices Meeting, October 29, 1964, Washington, D.C. developed the techniques for fabricating a structure consisting of electroforming an array of thick, self-supporting gold patterns on a thin film Ti- Pt Au base, hence the name "beams", deposited on the surface of a silicon wafer. The excess semiconductor from under the beams was removed, thereby separating the individual devices and leaving them with self-supporting beam leads or internal chiplets cantilevered beyond the semiconductor. The contacts served as electrica ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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