Topic summary
Package-on-package
Extracted from the Wikipedia article Package on a package.
History
In 2001, a Toshiba research team including T. Imoto, M. Matsui and C. Takubo developed a "System Block Module" wafer bonding process for manufacturing 3D integrated circuit (3D IC) packages. The earliest known commercial use of a 3D package-on-package chip was in Sony's PlayStation Portable (PSP) handheld game console, released in 2004. The PSP hardware includes eDRAM (embedded DRAM) memory manufactured by Toshiba in a 3D package chip with two dies stacked vertically. Toshiba called it "semi-embedded DRAM" at the time, before later calling it a stacked "chip-on-chip" (CoC) solution.