Topic summary
HBM2
Extracted from the Wikipedia article High Bandwidth Memory.
HBM2
The second generation of High Bandwidth Memory, HBM2, also specified up to eight dies per stack and doubled pin transfer rates up to 2 GT/s. Retaining 1024‑bit wide access, HBM2 was able to reach 256 GB/s memory bandwidth per package. The HBM2 spec allowed up to 8 GB per package. HBM2 was predicted to be especially useful for performance-sensitive consumer applications such as virtual reality.