Two High Power COB-LEDs with 20W and 10W

Chip on board (COB) is a method of circuit board

manufacturing Manufacturing is the creation or production of goods with the help of equipment, labor, machines, tools, and chemical or biological processing or formulation. It is the essence of secondary sector of the economy. The term may refer to a ...

in which the integrated circuits (e.g.

microprocessor A microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit, or a small number of integrated circuits. The microprocessor contains the arithmetic, logic, and control circu ...

s) are attached (wired, bonded directly) to a

printed circuit board A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich str ...

, and covered by a blob of

epoxy Epoxy is the family of basic components or Curing (chemistry), cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional ...

. By eliminating the packaging of individual

semiconductor device A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivit ...

s, the completed product can be more compact, lighter, and less costly. In some cases, COB construction improves the operation of radio frequency systems by reducing the

inductance Inductance is the tendency of an electrical conductor to oppose a change in the electric current flowing through it. The flow of electric current creates a magnetic field around the conductor. The field strength depends on the magnitude of t ...

and

capacitance Capacitance is the capability of a material object or device to store electric charge. It is measured by the change in charge in response to a difference in electric potential, expressed as the ratio of those quantities. Commonly recognized a ...

of integrated circuit leads. COB effectively merges two levels of electronic packaging: level 1 (components) and level 2 (wiring boards), and may be referred to as "level 1.5".John H. Lau, ''Chip On Board: Technology for Multichip Modules'', Springer Science & Business Media, 1994 pages 1-3

Construction

A finished semiconductor

wafer A wafer is a crisp, often sweet, very thin, flat, light and dry biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. Wafers can also be made into cookies with cream flavoring sandwiched between them. They ...

is cut into

dies Dies may refer to: * Dies (deity), the Roman counterpart of the Greek goddess Hemera, the personification of day, daughter of Nox (Night) and Erebus (Darkness). * Albert Christoph Dies (1755–1822), German painter, composer, and biographer * Jos ...

. Each die is then physically bonded to the PCB. Three different methods are used to connect the terminal pads of the integrated circuit (or other semiconductor device) with the conductive traces of the printed circuit board.

Flip chip

In " flip chip on board", the device is inverted, with the top layer of metallization facing the circuit board. Small balls of

solder Solder (; NA: ) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable ...

are placed on the circuit board traces where connections to the chip are required. The chip and board are passed through a reflow soldering process to make the electrical connections.

Wire bonding

In " wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that an integrated circuit is connected to its lead frame, but instead the chip is wire-bonded directly to the circuit board.

Flexible circuit board

In " tape-automated bonding", thin flat metal tape leads are attached to the semiconductor device pads, then welded to the printed circuit board. In all cases, the chip and connections are covered with an encapsulant to reduce entry of moisture or corrosive gases to the chip, to protect the wire bonds or tape leads from physical damage, and to help dissipate heat. The printed circuit board substrate may be assembled into the final product, for example, as in a pocket calculator, or, in the case of a multi-chip module, the module may be inserted in a socket or otherwise attached to yet another circuit board. The substrate wiring board may include heat-dissipating layers where the mounted devices handle significant power, such as in LED lighting or power semiconductors. Or, the substrate may have low-loss properties required at microwave radio frequencies.

Uses

COBs containing arrays of light-emitting diodes have made

LED lighting An LED lamp or LED light bulb is an electric light that produces light using light-emitting diodes (LEDs). LED lamps are significantly more energy-efficient than equivalent incandescent lamps and can be significantly more efficient than m ...

more efficient. LED COBs include a layer of silicone containing yellow Ce: YAG phosphor that encapsulates the LEDs and turns the blue light of the LEDs into white light. They could be compared with multi chip modules or hybrid integrated circuits since all three can incorporate multiple dies into a single unit. ChipOnBoardToy

Chips on board is widely used in electronics and computing, identifiable by "glob tops" often made of epoxy.

References

{{Reflist Electronics manufacturing Printed circuit board manufacturing