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Heatsink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die tempe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Cooling
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, hard disk drives, and solid state drives (SSDs). Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also other cooling te ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heatsink With Heat Pipes
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die tempe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
2N3055
The 2N3055 is a silicon NPN power transistor intended for general purpose applications. It was introduced in the early 1960s by RCA using a hometaxial power transistor process, transitioned to an epitaxial base in the mid-1970s. Its numbering follows the JEDEC standard. It is a transistor type of enduring popularity. Specifications The exact performance characteristics depend on the manufacturer and date; before the move to the epitaxial base version in the mid-1970s the fT could be as low as 0.8 MHz, for example. Packaged in a TO-3 case style, it is a 15 amp, 60 volt (or more, see below), 115 watt power transistor with a β (forward current gain) of 20 to 70 at a collector current of 4 A (this may be over 100 when testing at lower currents). It often has a transition frequency of around 3.0 MHz and 6 MHz is typical for the 2N3055A; at this frequency the calculated current gain (beta) drops to 1, indicating the transistor can no longer provide us ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Management (electronics)
All electronic devices and Electronic circuit, circuitry generate excess heat and thus require thermal management to improve Reliability engineering, reliability and prevent premature failure. The amount of heat output is equal to the Electric power, power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, Thermoelectric cooling, thermoelectric coolers, forced air systems and Computer fan, fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation. Overview Thermal resistance of devices This is usually quoted as the Thermal resistance in electronics, thermal resistance from p–n junction, junction to case of the semiconductor device. The units are °C/W. For example, a heatsink rated at 10 °C/W will get 10 °C hotter than the surrounding air when it dissipat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Resistance
In heat transfer, thermal engineering, and thermodynamics, thermal conductance and thermal resistance are fundamental concepts that describe the ability of materials or systems to conduct heat and the opposition they offer to the heat current. The ability to manipulate these properties allows engineers to control temperature gradient, prevent thermal shock, and maximize the efficiency of thermal systems. Furthermore, these principles find applications in a multitude of fields, including materials science, mechanical engineering, electronics, and energy management. Knowledge of these principles is crucial in various scientific, engineering, and everyday applications, from designing efficient temperature control, thermal insulation, and thermal management in industrial processes to optimizing the performance of electronic devices. Thermal conductance (''G'') measures the ability of a material or system to conduct heat. It provides insights into the ease with which heat can pa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD Heatsink And Fan
Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and technology company headquartered in Santa Clara, California and maintains significant operations in Austin, Texas. AMD is a Information technology, hardware and Fabless manufacturing, fabless company that designs and develops List of AMD processors, central processing units (CPUs), List of AMD graphics processing units, graphics processing units (GPUs), field-programmable gate arrays (FPGAs), System on a chip, system-on-chip (SoC), and high-performance computing, high-performance computer solutions. AMD serves a wide range of business and consumer markets, including gaming, data centers, artificial intelligence (AI), and embedded systems. AMD's main products include List of AMD microprocessors, microprocessors, motherboard chipsets, embedded processors, and List of AMD graphics processing units, graphics processors for Server (computing), servers, workstations, personal computers, and embedded syst ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lumped Capacitance Model
The lumped-element model (also called lumped-parameter model, or lumped-component model) is a simplified representation of a physical system or circuit that assumes all components are concentrated at a single point and their behavior can be described by idealized mathematical models. The lumped-element model simplifies the system or circuit behavior description into a topology. It is useful in electrical systems (including electronics), mechanical multibody systems, heat transfer, acoustics, etc. This is in contrast to distributed parameter systems or models in which the behaviour is distributed spatially and cannot be considered as localized into discrete entities. The simplification reduces the state space of the system to a finite dimension, and the partial differential equations (PDEs) of the continuous (infinite-dimensional) time and space model of the physical system into ordinary differential equations (ODEs) with a finite number of parameters. Electrical systems ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power Transistor Heat Sinks
Power may refer to: Common meanings * Power (physics), meaning "rate of doing work" ** Engine power, the power put out by an engine ** Electric power, a type of energy * Power (social and political), the ability to influence people or events Mathematics, science and technology Computing * IBM POWER (software), an IBM operating system enhancement package * IBM POWER architecture, a RISC instruction set architecture * Power ISA, a RISC instruction set architecture derived from PowerPC * IBM Power microprocessors, made by IBM, which implement those RISC architectures * Power.org, a predecessor to the OpenPOWER Foundation Mathematics * Exponentiation, "''x'' to the power of ''y''" * Power function * Power of a point * Statistical power Physics * Magnification, the factor by which an optical system enlarges an image * Optical power, the degree to which a lens converges or diverges light Social sciences and politics * Economic power, encompassing several concepts that economists use ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-3
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. ''TO'' stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC. The TO-3 case has a flat surface which can be attached to a heatsink, normally via a thermally conductive but electrically insulating washer. The design originated at Motorola around 1955 from a group headed by Virgil E. Bottom, Dr. Virgil E. Bottom. who was director of research of the Motorola Semiconductor Division. The first use of this design was for the germanium alloy-junction transistor, alloy-junction power transistor 2N176 – the first power transistor to be put into quantity production. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. Typical applications The metal package can be attached to a heat sink, making it suitabl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-92
The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost. History and origin The JEDEC TO-92 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 92. The package is also known by the designation Small-outline transistor#SOT54, SOT54. By 1966 the package was being used by Motorola for their 2N3904 devices among others. Construction and orientation The case is molded around the transistor elements in two parts; the face is flat, usually bearing a machine-printed part number (some early examples had the part number printed on the top surface instead). The back is semi-circularly-shaped. A line of moulding flash from the injection-moulding process can be seen around the case. The leads protrude from the bottom of the case. When looking at the face of the transistor, the leads are commonly configured from left-to- ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
1050 Aluminium Alloy
1050 aluminium alloy is an aluminium-based alloy in the "commercially pure" wrought family (1000 or 1xxx series ). As a wrought alloy, it is not used in castings. Instead, it is usually formed by extrusion or rolling. It is commonly used in the electrical and chemical industries, on account of having high electrical conductivity, corrosion resistance, and workability. 1050 alloy is also sometimes used for the manufacture of heat sinks, since it has a higher thermal conductivity than other alloys. It has low mechanical strength compared to more significantly alloyed metals. It can be strengthened by cold working, but not by heat treatment.Marks' Standard handbook for Mechanical Engineers, 8th Ed., McGraw Hill, p. 6-50 Alternate names and designations include Al99.5, 3.0255, and A91050. It is described in the following standards: [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Aluminium Alloys
An aluminium alloy (British English, UK/International Union of Pure and Applied Chemistry, IUPAC) or aluminum alloy (North American English, NA; see American and British English spelling differences, spelling differences) is an alloy in which aluminium (Al) is the predominant metal. The typical alloying elements are copper, magnesium, manganese, silicon, tin, nickel and zinc. There are two principal classifications, namely casting alloys and wrought alloys, both of which are further subdivided into the categories Heat treating, heat-treatable and non-heat-treatable. About 85% of aluminium is used for wrought products, for example rolled plate, foils and extrusions. Cast aluminium alloys yield cost-effective products due to their low melting points, although they generally have lower Ultimate tensile strength, tensile strengths than wrought alloys. The most important cast aluminium alloy system is Silumin, Al–Si, where the high levels of silicon (4–13%) contribute to give good ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
