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Heatsink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperatur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Cooling
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also more exotic cooling techniques, such as liq ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Management (electronics)
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation. Overview Thermal resistance of devices This is usually quoted as the thermal resistance from junction to case of the semiconductor device. The units are °C/W. For example, a heatsink rated at 10 °C/W will get 10 °C hotter than the surrounding air when it dissipates 1 Watt of heat. Thus, a heatsink with a low °C/W value is more efficient than a heatsink with a high °C/W value. Given two semiconductor device ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
2N3055
The 2N3055 is a silicon NPN power transistor intended for general purpose applications. It was introduced in the early 1960s by RCA using a hometaxial power transistor process, transitioned to an epitaxial base in the mid-1970s. Its numbering follows the JEDEC standard. It is a transistor type of enduring popularity. Specifications The exact performance characteristics depend on the manufacturer and date; before the move to the epitaxial base version in the mid-1970s the fT could be as low as 0.8 MHz, for example. Packaged in a TO-3 case style, it is a 15 amp, 60 volt (or more, see below), 115 watt power transistor with a β (forward current gain) of 20 to 70 at a collector current of 4 A (this may be over 100 when testing at lower currents). It often has a transition frequency of around 3.0 MHz and 6 MHz is typical for the 2N3055A; at this frequency the calculated current gain (beta) drops to 1, indicating the transistor can no longer provide usefu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Resistance
Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. * (Absolute) thermal resistance ''R'' in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. * Specific thermal resistance or thermal resistivity ''Rλ'' in kelvin–metres per watt (K⋅m/W), is a material constant. * Thermal insulance has the units square metre kelvin per watt (m2⋅K/W) in SI units or square foot degree Fahrenheit–hours per British thermal unit (ft2⋅°F⋅h/Btu) in imperial units. It is the thermal resistance of unit area of a material. In terms of insulation, it is measured by the R-value. Absolute thermal resistance Absolute thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time. It is the reciprocal of thermal conductance. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Adhesive
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available. The glue is typically a two-part epoxy resin (usually for paste products) or cyanoacrylate (for tapes). The thermally conductive material can vary including metals, metal oxides, silica or ceramic microspheres. The latter are found in products that have much higher dielectric strength, although this comes at the cost of lower thermal conductivity. End-user modding heatsinks may be supplied with thermal adhesive attached (usually a piece of tape). For products sold through electronic components distributors this is rarely the case; the adhesives are sold separately to professionals. See also * Computer cooling * Hot-melt adhesive Hot-melt adhesive (HMA), also known a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-3
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. ''TO'' stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC. The TO-3 case has a flat surface which can be attached to a heatsink, normally via a thermally conductive but electrically insulating washer. The design originated at Motorola around 1955 from a group headed by Dr. Virgil E. Bottom. who was director of research of the Motorola Semiconductor Division. The first use of this design was for the germanium alloy-junction power transistor 2N176 – the first power transistor to be put into quantity production. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. Typical applications The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Laptop Heatsink
A laptop, laptop computer, or notebook computer is a small, portable personal computer (PC) with a screen and alphanumeric keyboard. Laptops typically have a clam shell form factor with the screen mounted on the inside of the upper lid and the keyboard on the inside of the lower lid, although 2-in-1 PCs with a detachable keyboard are often marketed as laptops or as having a "laptop mode". Laptops are folded shut for transportation, and thus are suitable for mobile use. They are so named because they can be practically placed on a person's lap when being used. Today, laptops are used in a variety of settings, such as at work, in education, for playing games, web browsing, for personal multimedia, and for general home computer use. As of 2022, in American English, the terms ''laptop computer'' and ''notebook computer'' are used interchangeably; in other dialects of English, one or the other may be preferred. Although the terms ''notebook computers'' or ''notebooks'' or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-92
The TO-92 is a widely used style of semiconductor package mainly used for transistors. The case is often made of epoxy or plastic, and offers compact size at a very low cost. History and origin The JEDEC TO-92 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 92. The package is also known by the designation SOT54. By 1966 the package was being used by Motorola for their 2N3904 devices among others. Construction and orientation The case is molded around the transistor elements in two parts; the face is flat, usually bearing a machine-printed part number (some early examples had the part number printed on the top surface instead). The back is semi-circularly-shaped. A line of moulding flash from the injection-moulding process can be seen around the case. The leads protrude from the bottom of the case. When looking at the face of the transistor, the leads are commonly configured from left-to-right as the ''emitter'', ''b ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Aluminium Alloys
An aluminium alloy (or aluminum alloy; see spelling differences) is an alloy in which aluminium (Al) is the predominant metal. The typical alloying elements are copper, magnesium, manganese, silicon, tin, nickel and zinc. There are two principal classifications, namely casting alloys and wrought alloys, both of which are further subdivided into the categories heat-treatable and non-heat-treatable. About 85% of aluminium is used for wrought products, for example rolled plate, foils and extrusions. Cast aluminium alloys yield cost-effective products due to the low melting point, although they generally have lower tensile strengths than wrought alloys. The most important cast aluminium alloy system is Al–Si, where the high levels of silicon (4–13%) contribute to give good casting characteristics. Aluminium alloys are widely used in engineering structures and components where light weight or corrosion resistance is required.I. J. Polmear, ''Light Alloys'', Arnold, 1995 Alloy ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
1050 Aluminium Alloy
1050 aluminium alloy is an aluminium-based alloy in the "commercially pure" wrought family (1000 or 1xxx series). As a wrought alloy, it is not used in castings. Instead, it is usually formed by extrusion or rolling. It is commonly used in the electrical and chemical industries, on account of having high electrical conductivity, corrosion resistance, and workability. 1050 alloy is also sometimes used for the manufacture of heat sinks, since it has a higher thermal conductivity than other alloys. It has low mechanical strength compared to more significantly alloyed metals. It can be strengthened by cold working, but not by heat treatment.Marks' Standard handbook for Mechanical Engineers, 8th Ed., McGraw Hill, p. 6-50 Alternate names and designations include Al99.5, 3.0255, and A91050. It is described in the following standards: [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD Heatsink And Fan
Advanced Micro Devices, Inc. (AMD) is an American multinational company, multinational semiconductor industry, semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going Fabless manufacturing, fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, Graphics processing unit, graphics processors, and FPGAs for server (computing), servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders (businessman), Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fai ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
6061 Aluminium Alloy
6061 ( Unified Numbering System (UNS) designation A96061) is a precipitation-hardened aluminium alloy, containing magnesium and silicon as its major alloying elements. Originally called "Alloy 61S", it was developed in 1935. It has good mechanical properties, exhibits good weldability, and is very commonly extruded (second in popularity only to 6063). It is one of the most common alloys of aluminium for general-purpose use. It is commonly available in pre-tempered grades such as 6061-O (annealed), tempered grades such as 6061-T6 (solutionized and artificially aged) and 6061-T651 (solutionized, stress-relieved stretched and artificially aged). Chemical composition 6061 Aluminium alloy composition by mass: Properties The mechanical properties of 6061 depend greatly on the temper, or heat treatment, of the material. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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