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Wafer-level Package
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where Packaging (microfabrication), packaging components are attached to an integrated circuit (IC) ''before'' the Wafer (electronics), wafer – on which the IC is fabricated – is wafer dicing, diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. As of 2009, there is no single industry-standard method of wafer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Samsung Galaxy Tab 2 10
Samsung Group (; stylised as SΛMSUNG) is a South Korean multinational manufacturing conglomerate headquartered in the Samsung Town office complex in Seoul. The group consists of numerous affiliated businesses, most of which operate under the Samsung brand, and is the largest (business conglomerate) in South Korea. Samsung has the world's fifth-highest brand value. Founded in 1938 by Lee Byung-chul as a trading company, Samsung diversified into various sectors, including food processing, textiles, insurance, securities, and retail, over the next three decades. In the late 1960s, Samsung entered the electronics industry, followed by the construction and shipbuilding sectors in the mid-1970s—areas that would fuel its future growth. After Lee died in 1987, Samsung was divided into five business groups: Samsung Group, Shinsegae Group, CJ Group, Hansol Group, and JoongAng Group. Key affiliates of Samsung include Samsung Electronics, the world's largest information te ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Redistribution Layer
A redistribution layer (RDL) is an extra metal layer on an integrated circuit that makes its Input/output, I/O pads available in other locations of the chip, for better access to the pads where necessary. When an integrated circuit is manufactured, it usually has a set of I/O pads that are Wire bonding, wirebonded to the pins of the package. A redistribution layer is an extra layer of wiring on the chip that enables bond out from different locations on the chip, making chip-to-chip bonding simpler. Another example of the use for RDL is for spreading the contact points around the Die (integrated circuit), die so that solder balls can be applied, and the thermal stress of mounting can be spread. The RDL is often made out of a polyamide, benzocyclobutene (BCB) or polybenzoxazole (PBO) with copper plated on its surface. See also *Semiconductor device fabrication References External links Redistribution tutorial Semiconductor device fabrication Packaging (microfabrication) {{e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Carriers
Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre ... and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s. Overview In microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), the package protects the sensitive internal structures from environmental infl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer-scale Integration
Wafer-scale integration (WSI) is a system of building very-large integrated circuit (commonly called a "chip") networks from an entire wafer (electronics), silicon wafer to produce a single "super-chip". Combining large size and reduced packaging, WSI was expected to lead to dramatically reduced costs for some systems, notably massively parallel supercomputers but is now being employed for deep learning. The name is taken from the term very-large-scale integration, the state of the art when WSI was being developed. Overview In the normal integrated circuit manufacturing process, a single large cylindrical crystal (Boule (crystal), boule) of silicon is produced and then cut into disks known as wafers. The wafers are then cleaned and polished in preparation for the fabrication process. A photographic process is used to pattern the surface where material ought to be deposited on top of the wafer and where not to. The desired material is deposited and the photographic mask is removed ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip-scale Package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for ''chip-size packaging.'' Since only a few packages are chip size, the meaning of the acronym was adapted to ''chip-scale packaging''. According to IPC (electronics), IPC's standard J-STD-012, ''Implementation of Flip Chip and Chip Scale Technology'', in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die (integrated circuit), die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric. The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Electronic Component Packaging Types
Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photoelectric Effect
The photoelectric effect is the emission of electrons from a material caused by electromagnetic radiation such as ultraviolet light. Electrons emitted in this manner are called photoelectrons. The phenomenon is studied in condensed matter physics, solid state, and quantum chemistry to draw inferences about the properties of atoms, molecules and solids. The effect has found use in electronic devices specialized for light detection and precisely timed electron emission. The experimental results disagree with classical electromagnetism, which predicts that continuous light waves transfer energy to electrons, which would then be emitted when they accumulate enough energy. An alteration in the intensity of light would theoretically change the kinetic energy of the emitted electrons, with sufficiently dim light resulting in a delayed emission. The experimental results instead show that electrons are dislodged only when the light exceeds a certain frequency—regardless of the ligh ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flashtube
A flashtube (flashlamp) produces an electrostatic discharge with an extremely intense, incoherent, full-spectrum white light for a very short time. A flashtube is a glass tube with an electrode at each end and is filled with a gas that, when triggered, ionizes and conducts a high-voltage pulse to make light. Flashtubes are used most in photography; they also are used in science, medicine, industry, and entertainment. Construction The lamp consists of a hermetically sealed glass tube which is filled with a noble gas, usually xenon, and electrodes to carry electric current to the gas. Additionally, a high voltage power source is necessary to energize the gas as a trigger event. A charged photoflash capacitor is usually used to supply energy for the flash, so as to allow very speedy delivery of very high electrical current when the lamp is triggered. Glass envelopes The glass envelope is most commonly a thin tube, often made of fused quartz, borosilicate or Pyrex, which ma ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Raspberry Pi 2
Raspberry Pi ( ) is a series of small single-board computers (SBCs) developed in the United Kingdom by the Raspberry Pi Foundation in collaboration with Broadcom. To commercialize the product and support its growing demand, the Foundation established a commercial entity, Raspberry Pi Holdings, a public company that trades on the London Stock Exchange. The Raspberry Pi was originally created to help teach computer science in schools, but gained popularity for many other uses due to its low cost, compact size, and flexibility. It is now used in areas such as industrial automation, robotics, home automation, IoT devices, and hobbyist projects. The company's products range from simple microcontrollers to computers that the company markets as being powerful enough to be used as a general purpose PC. Computers are built around a custom designed system on a chip and offer features such as HDMI video/audio output, USB ports, wireless networking, GPIO pins, and up to 16 GB of RAM ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Epoxy
Epoxy is the family of basic components or Curing (chemistry), cured end products of epoxy Resin, resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called ''epoxy''. The IUPAC name for an epoxide group is an oxirane. Epoxy resins may be reacted (cross-linked) either with themselves through catalytic homopolymerisation, or with a wide range of co-reactants including polyfunctional amines, acids (and acid anhydrides), phenols, alcohols and thiols (sometimes called mercaptans). These co-reactants are often referred to as hardeners or curatives, and the cross-linking reaction is commonly referred to as Curing (chemistry), curing. Reaction of polyepoxides with themselves or with polyfunctional hardeners forms a thermosetting polymer, often with favorable mechanical properties and high thermal and chemical resistance. Epoxy has a wide range of application ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
