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Socket 1156
LGA 1156 (land grid array 1156), also known as Socket H or H1, is an Intel desktop CPU socket. Its incompatible successor is LGA 1155. The last processors supporting it ceased production in 2011. LGA 1156, along with LGA 1366, were designed to replace LGA 775. Whereas LGA 775 processors connect to a northbridge using the Front Side Bus, LGA 1156 processors integrate the features traditionally located on a northbridge within the processor itself. The LGA 1156 socket allows the following connections to be made from the processor to the rest of the system: * PCI-Express 2.0 ×16 for communication with a graphics card. Some processors allow this connection to be divided into two ×8 lanes to connect two graphics cards. Some motherboard manufacturers use Nvidia's NF200 chip to allow even more graphics cards to be used. * DMI for communication with the Platform Controller Hub (PCH). This consists of a PCI-Express 2.0 ×4 connection. * FDI for communication with the PCH. Thi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nvidia
Nvidia CorporationOfficially written as NVIDIA and stylized in its logo as VIDIA with the lowercase "n" the same height as the uppercase "VIDIA"; formerly stylized as VIDIA with a large italicized lowercase "n" on products from the mid 1990s to early-mid 2000s. Though unofficial, second letter capitalization of NVIDIA, i.e. nVidia, may be found within enthusiast communities and publications. ( ) is an American multinational technology company incorporated in Delaware and based in Santa Clara, California. It is a software and fabless company which designs graphics processing units (GPUs), application programming interface (APIs) for data science and high-performance computing as well as system on a chip units (SoCs) for the mobile computing and automotive market. Nvidia is a global leader in artificial intelligence hardware and software. Its professional line of GPUs are used in workstations for applications in such fields as architecture, engineering and construction, media ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Xeon Microprocessors
The following is a list of Intel Xeon microprocessors, by generation. P6-based * Pentium II Xeon 400 * Pentium II Xeon 400 * Pentium II Xeon 450 * Pentium II Xeon 450 * Pentium II Xeon 450 * Pentium III Xeon 500 * Pentium III Xeon 500 * Pentium III Xeon 500 * Pentium III Xeon 550 * Pentium III Xeon 550 * Pentium III Xeon 550 * Pentium III Xeon 600 * Pentium III Xeon 667 * Pentium III Xeon 700 * Pentium III Xeon 700 * Pentium III Xeon 733 * Pentium III Xeon 800 * Pentium III Xeon 866 * Pentium III Xeon 900 * Pentium III Xeon 933 * Pentium III Xeon 1.00 NetBurst-based * Xeon 1.4 * Xeon 1.5 * Xeon 1.7 * Xeon 2.0 * Xeon 1.8 * Xeon 2.0A * Xeon 2.0B * Xeon 2.2 * Xeon 2.4 * Xeon 2.4B * Xeon 2.6 * Xeon 2.66 * Xeon 2.8 * Xeon 2.8B * Xeon 3.0 * Xeon 3.06 * Xeon LV 1.6 * Xeon LV 2.0 * Xeon LV 2.4 * Xeon 2.4B * Xeon 2.8B * Xeon 3.06 * Xeon 3.2 * Xeon 3.2 * Xeon 2.8 * Xeon 2.8D * Xeon 3.0 * Xeon 3.0D * Xeon 3.2 * Xeon 3.4 * Xeon 3. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Xeon
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been mainta ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Core I7 Microprocessors
The following is a list of Intel Core i7 brand microprocessors. Introduced in 2008, the Core i7 line of microprocessors are intended to be used by high-end users. Desktop processors Nehalem microarchitecture (1st generation) "Bloomfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Turbo Boost, Smart Cache. * FSB has been replaced with QPI. * Transistors: 731 million * Die size: 263 mm * Steppings: C0, D0 "Lynnfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, Smart Cache. * Core i7-875K features an unlocked multiplier and does not support Intel TXT and Intel VT-d. * FSB has been replaced with DMI. *Moves the QPI link and PCI ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Core I7
The following is a list of Intel Core i7 brand microprocessors. Introduced in 2008, the Core i7 line of microprocessors are intended to be used by high-end users. Desktop processors Nehalem microarchitecture (1st generation) "Bloomfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Turbo Boost, Smart Cache. * FSB has been replaced with QPI. * Transistors: 731 million * Die size: 263 mm * Steppings: C0, D0 "Lynnfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, Smart Cache. * Core i7-875K features an unlocked multiplier and does not support Intel TXT and Intel VT-d. * FSB has been replaced with DMI. *Moves the QPI link and PCI ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Core I5 Microprocessors
The following is a list of Intel Core i5 brand microprocessors. Introduced in 2009, the Core i5 line of microprocessors are intended to be used by mainstream users. Desktop processors Nehalem microarchitecture (1st generation) "Lynnfield" (45 nm) * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Turbo Boost, Smart Cache.'' * FSB has been replaced with DMI. * Transistors: 774 million * Die size: 296 mm² * Stepping: B1 Westmere microarchitecture (1st generation) " Clarkdale" ( MCP, 32 nm dual-core) * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.'' * Core i5-655K, Core i5-661 does not support ''Intel TXT and Intel VT-d.'' * Core i5-655K fe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Core I5
The following is a list of Intel Core i5 brand microprocessors. Introduced in 2009, the Core i5 line of microprocessors are intended to be used by mainstream users. Desktop processors Nehalem microarchitecture (1st generation) "Lynnfield" (45 nm) * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Turbo Boost, Smart Cache.'' * FSB has been replaced with DMI. * Transistors: 774 million * Die size: 296 mm² * Stepping: B1 Westmere microarchitecture (1st generation) " Clarkdale" ( MCP, 32 nm dual-core) * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.'' * Core i5-655K, Core i5-661 does not support ''Intel TXT and Intel VT-d.'' * Core i5-655K fe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lynnfield (microprocessor)
Lynnfield is the code name for a quad-core processor from Intel released in September 2009. It was sold in varying configurations as Core i5-7xx, Core i7-8xx or Xeon X34xx. Lynnfield uses the Nehalem microarchitecture and replaces the earlier Penryn based Yorkfield processor, using the same 45 nm process technology, but with a new memory and bus interface. The product code for Lynnfield is 80605, its CPUID value identifies it as family 6, model 30 (0106Ex). Lynnfield is related to the earlier Bloomfield and Gainestown microprocessors, which are used in server and high-end desktop systems. The main difference between the two is Lynnfield's use of the LGA 1156 processor socket as opposed to the LGA 1366 socket used by Bloomfield and Gainestown processors. LGA 1156 processors include Direct Media Interface and PCI Express links, which Intel has previously connected to the processor with a dedicated northbridge chip, called the ''memory controller hub'' or ''I/O hub''. The Lynnf ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 1200
LGA 1200 is a zero insertion force flip-chip land grid array (LGA) CPU socket, socket, compatible with Intel desktop Central processing unit, processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020. LGA 1200 is designed as a replacement for the LGA 1151 (known as ''Socket H4''). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips. ASRock, Asus, Biostar, Gigabyte Technology, Gigabyte and Micro-Star International, MSI have confirmed their motherboards based on the Intel Z490 chipset support the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 1151
LGA 1151, also known as Socket H4, zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively. LGA 1151 is designed as a replacement for the LGA 1150 (known as ''Socket H3''). LGA 1151 has 1151 protruding pins to make contact with the pads on the processor. The Fully Integrated Voltage Regulator, i.e. a voltage regulator which integrated on the CPU's die, introduced with Haswell and Broadwell, has again been moved to the motherboard. Most motherboards for the first revision of the socket support solely DDR4 memory, a lesser number support DDR3(L) memory, and the least number have slots for both DDR4 or DDR3(L) but only one memory type can be installed. Some have UniDIMM support, enabling either type of memory to be placed in the same DIMM, rather than having separ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 1150
LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture. It is the successor of LGA 1155 and was itself succeeded by LGA 1151 in 2015. Most motherboards with the LGA 1150 socket support varying video outputs (VGA, DVI or HDMI depending on the model) and Intel Clear Video Technology. Full support of Windows on LGA 1150 platform starts on Windows 7 - official Windows XP support is limited to selected CPUs, chipsets and only for embedded and industrial systems. Intel's Platform Controller Hub (PCH) for the LGA 1150 CPUs is codenamed Lynx Point. Intel Xeon processors for socket LGA 1150 use the Intel C222, C224, and C226 chipsets. Heatsink The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75&nb ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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