|
SPARC64 VIIIfx
The SPARC64 V (''Zeus'') is a SPARC V9 microprocessor designed by Fujitsu. The SPARC64 V was the basis for a series of successive processors designed for servers, and later, supercomputers. The servers series are the SPARC64 V+, VI, VI+, VII, VII+, X, X+ and XII. The SPARC64 VI and its successors up to the VII+ were used in the Fujitsu and Sun (later Oracle) SPARC Enterprise M-Series servers. In addition to servers, a version of the SPARC64 VII was also used in the commercially available Fujitsu FX1 supercomputer. As of October 2017, the SPARC64 XII is the latest server processor, and it is used in the Fujitsu and Oracle M12 servers. The supercomputer series was based on the SPARC64 VII, and are the SPARC64 VIIfx, IXfx, and XIfx. The SPARC64 VIIIfx was used in the K computer, and the SPARC64 IXfx in the commercially available PRIMEHPC FX10. As of July 2016, the SPARC64 XIfx is the latest supercomputer processor, and it is used in the Fujitsu PRIMEHPC FX100 supercomputer. Histor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SPARC64 V
The SPARC64 V (''Zeus'') is a SPARC V9 microprocessor designed by Fujitsu. The SPARC64 V was the basis for a series of successive processors designed for servers, and later, supercomputers. The servers series are the SPARC64 V+, VI, VI+, VII, VII+, X, X+ and XII. The SPARC64 VI and its successors up to the VII+ were used in the Fujitsu and Sun (later Oracle) SPARC Enterprise M-Series servers. In addition to servers, a version of the SPARC64 VII was also used in the commercially available Fujitsu FX1 supercomputer. As of October 2017, the SPARC64 XII is the latest server processor, and it is used in the Fujitsu and Oracle M12 servers. The supercomputer series was based on the SPARC64 VII, and are the SPARC64 VIIfx, IXfx, and XIfx. The SPARC64 VIIIfx was used in the K computer, and the SPARC64 IXfx in the commercially available PRIMEHPC FX10. As of July 2016, the SPARC64 XIfx is the latest supercomputer processor, and it is used in the Fujitsu PRIMEHPC FX100 supercomputer. Histor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SPARC64 V+
The SPARC64 V (''Zeus'') is a SPARC V9 microprocessor designed by Fujitsu. The SPARC64 V was the basis for a series of successive processors designed for servers, and later, supercomputers. The servers series are the SPARC64 V+, VI, VI+, VII, VII+, X, X+ and XII. The SPARC64 VI and its successors up to the VII+ were used in the Fujitsu and Sun (later Oracle) SPARC Enterprise M-Series servers. In addition to servers, a version of the SPARC64 VII was also used in the commercially available Fujitsu FX1 supercomputer. As of October 2017, the SPARC64 XII is the latest server processor, and it is used in the Fujitsu and Oracle M12 servers. The supercomputer series was based on the SPARC64 VII, and are the SPARC64 VIIfx, IXfx, and XIfx. The SPARC64 VIIIfx was used in the K computer, and the SPARC64 IXfx in the commercially available PRIMEHPC FX10. As of July 2016, the SPARC64 XIfx is the latest supercomputer processor, and it is used in the Fujitsu PRIMEHPC FX100 supercomputer. Hi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SPARC64 VII
The SPARC64 V (''Zeus'') is a SPARC V9 microprocessor designed by Fujitsu. The SPARC64 V was the basis for a series of successive processors designed for servers, and later, supercomputers. The servers series are the SPARC64 V+, VI, VI+, VII, VII+, X, X+ and XII. The SPARC64 VI and its successors up to the VII+ were used in the Fujitsu and Sun (later Oracle) SPARC Enterprise M-Series servers. In addition to servers, a version of the SPARC64 VII was also used in the commercially available Fujitsu FX1 supercomputer. As of October 2017, the SPARC64 XII is the latest server processor, and it is used in the Fujitsu and Oracle M12 servers. The supercomputer series was based on the SPARC64 VII, and are the SPARC64 VIIfx, IXfx, and XIfx. The SPARC64 VIIIfx was used in the K computer, and the SPARC64 IXfx in the commercially available PRIMEHPC FX10. As of July 2016, the SPARC64 XIfx is the latest supercomputer processor, and it is used in the Fujitsu PRIMEHPC FX100 supercomputer. Hi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Arithmetic Logic Unit
In computing, an arithmetic logic unit (ALU) is a Combinational logic, combinational digital circuit that performs arithmetic and bitwise operations on integer binary numbers. This is in contrast to a floating-point unit (FPU), which operates on floating point numbers. It is a fundamental building block of many types of computing circuits, including the central processing unit (CPU) of computers, FPUs, and graphics processing units (GPUs). The inputs to an ALU are the data to be operated on, called operands, and a code indicating the operation to be performed; the ALU's output is the result of the performed operation. In many designs, the ALU also has status inputs or outputs, or both, which convey information about a previous operation or the current operation, respectively, between the ALU and external status registers. Signals An ALU has a variety of input and output net (electronics), nets, which are the electrical conductors used to convey Digital signal (electronics), digi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Kibibyte
The byte is a unit of digital information that most commonly consists of eight bits. Historically, the byte was the number of bits used to encode a single character of text in a computer and for this reason it is the smallest addressable unit of memory in many computer architectures. To disambiguate arbitrarily sized bytes from the common 8-bit definition, network protocol documents such as The Internet Protocol () refer to an 8-bit byte as an octet. Those bits in an octet are usually counted with numbering from 0 to 7 or 7 to 0 depending on the bit endianness. The first bit is number 0, making the eighth bit number 7. The size of the byte has historically been hardware-dependent and no definitive standards existed that mandated the size. Sizes from 1 to 48 bits have been used. The six-bit character code was an often-used implementation in early encoding systems, and computers using six-bit and nine-bit bytes were common in the 1960s. These systems often had memory words ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Copper Interconnect
In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with better performance. They were first introduced by IBM, with assistance from Motorola, in 1997. The transition from aluminium to copper required significant developments in fabrication techniques, including radically different methods for patterning the metal as well as the introduction of barrier metal layers to isolate the silicon from potentially damaging copper atoms. Patterning Although some form of volatile copper compound has been known to exist since 1947, with more discovered as the century progressed, none were in industrial use, so copper could not be ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
90 Nanometer
The 90 nm process refers to the level of MOSFET ( CMOS) fabrication process technology that was commercialized by the 2003–2005 timeframe, by leading semiconductor companies like Toshiba, Sony, Samsung, IBM, Intel, Fujitsu, TSMC, Elpida, AMD, Infineon, Texas Instruments and Micron Technology. The origin of the 90 nm value is historical, it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS). The 193 nm wavelength was introduced by many (but not all) companies for lithography of critical layers mainly during the 90 nm node. Yield issues associated with this transition (due to the use of new photoresists) were reflected in the high costs associated with this transition. Even more significantly, the 300 mm wafer size became mainstream at the 90 nm node. The previous wafer size was 200 mm diameter. History A 90nm silicon MOSFET was fabric ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon On Insulator
In semiconductor manufacturing, silicon on insulator (SOI) technology is fabrication of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator, typically silicon dioxide or sapphire (these types of devices are called silicon on sapphire, or SOS). The choice of insulator depends largely on intended application, with sapphire being used for high-performance radio frequency (RF) and radiation-sensitive applications, and silicon dioxide for diminished short-channel effects in other microelectronics devices. The insulating layer and topmost silicon layer also vary widely with application. Industry need SOI technology is one of several manufacturing strategies to allow the continued miniaturization of microelectronic devices, colloquially referred to as ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Complementary Metal–oxide–semiconductor
Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", ) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors (CMOS sensors), data converters, RF circuits (RF CMOS), and highly integrated transceivers for many types of communication. The CMOS process was originally conceived by Frank Wanlass at Fairchild Semiconductor and presented by Wanlass and Chih-Tang Sah at the International Solid-State Circuits Conference in 1963. Wanlass later filed US patent 3,356,858 for CMOS circuitry and it was granted in 1967. commercialized the technology with the trademark "COS-MOS" ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
130 Nanometer
The 130 nanometer (130 nm) process refers to the level of semiconductor process technology that was reached in the 2000–2001 timeframe, by most leading semiconductor companies, like Intel, Texas Instruments, IBM, and TSMC. The origin of the 130 nm value is historical, as it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS). Some of the first CPUs manufactured with this process include Intel Tualatin family of Pentium III processors. Processors using 130 nm manufacturing technology * Motorola PowerPC 7447 and 7457 2002 * IBM Gekko (Nintendo GameCube) * IBM PowerPC G5 970 - October 2002 - June 2003 * Intel Pentium III Tualatin - 2001-06 * Intel Celeron Tualatin-256 - 2001-10-02 * Intel Pentium M Banias - 2003-03-12 * Intel Pentium 4 Northwood - 2002-01-07 * Intel Celeron Northwood-128 - 2002-09-18 * Intel Xeon Prestonia and Gallatin - 2002-02-25 * VIA C3 - 2001 * AMD ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Single Instruction, Multiple Data
Single instruction, multiple data (SIMD) is a type of parallel processing in Flynn's taxonomy. SIMD can be internal (part of the hardware design) and it can be directly accessible through an instruction set architecture (ISA), but it should not be confused with an ISA. SIMD describes computers with multiple processing elements that perform the same operation on multiple data points simultaneously. Such machines exploit data level parallelism, but not concurrency: there are simultaneous (parallel) computations, but each unit performs the exact same instruction at any given moment (just with different data). SIMD is particularly applicable to common tasks such as adjusting the contrast in a digital image or adjusting the volume of digital audio. Most modern CPU designs include SIMD instructions to improve the performance of multimedia use. SIMD has three different subcategories in Flynn's 1972 Taxonomy, one of which is SIMT. SIMT should not be confused with software th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
