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Socket 604
Socket 604 is a 604-pin microprocessor socket designed to interface an Intel Xeon processor to the rest of the computer. It provides both an electrical interface as well as physical support. This socket is designed to support a heatsink. Launched on November 18, 2002, over the year after Socket 603, it was originally used to accommodate most Xeons introduced at the time. It was succeeded by LGA 771 in 2006 for low- and mid-end server ranges, but still stayed in the high-end server range, including 4- and 8-processor configurations, in which the successor - LGA 1567 - appeared in 2010. At the time, LGA 1366 was the primary socket for Xeons in low- and mid-end server ranges, with cheaper configurations still sometimes using the LGA 771 socket. The socket had an unusually long life span, lasting 9 years (2 years longer than consumer-grade LGA 775) until the last processors supporting it ceased production in the 3rd quarter of 2011. Technical specifications Socket 604 was designe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Xeon
Xeon (; ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for error correction code (ECC) memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture (MCA). They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus, which replaced ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 1366
LGA 1366 (land grid array 1366), also known as Socket B, is an Intel CPU socket. This socket supersedes Intel's LGA 775 (Socket T) in the high-end and performance desktop segments. It also replaces the server-oriented LGA 771 (Socket J) in the entry level and is superseded itself by LGA 2011. This socket has 1,366 protruding pins which touch contact points on the underside of the processor (CPU) and accesses up to three channels of DDR3 memory via the processor's internal memory controller. Socket 1366 (Socket B) uses Intel QuickPath Interconnect (QPI) to connect the CPU to a reduced-function northbridge that serves mainly as a PCI-Express controller. A slower DMI is used to connect Intel's most recent northbridge and southbridge components. By comparison, Intel's LGA 1156 (Socket H) moves the QPI link and PCI-Express controller onto the processor itself, using DMI to interface a single-component "chipset" (now called PCH) that serves traditional southbridge functions. The di ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Microprocessors
This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product. Latest 15th generation Core Desktop - Core Ultra Series 2 (codenamed " Arrow Lake") Released on October 24, 2024. It follows on from Meteor Lake which saw Intel move from monolithic silicon to a disaggregated MCM design. Meteor Lake was limited to a mobile release while Arrow Lake includes desktop processors and mobile processors. Desktop - Arrow Lake-S Mobile - Arrow Lake-U Arrow Lake-U uses refreshed Meteor Lake silicon fabricated on the Intel 3 node. Mobile - Arrow Lake-H Mobile - Arrow Lake-HX 13th and 14th generation Core Desktop - Raptor Lake-S Refresh (codenamed "Raptor Lake") (14th Gen) An iterative refresh of Raptor Lake-S desktop processors, called the 14th generation of Intel Core, was launched on October 17, 2023. CPUs in bold below ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Xeon Chipsets
Around the time that the Pentium 4 processor was introduced, Intel's Xeon line diverged from its line of desktop processors, which at the time was using the Pentium branding. The divergence was implemented by using different sockets; since then, the sockets for Xeon chips have tended to remain constant across several generations of implementation. The chipsets contain a 'memory controller hub' and an 'I/O controller hub', which tend to be called 'north bridge' and 'south bridge' respectively. The memory controller hub connects to the processors, memory, high-speed I/O such as PCI Express, and to the I/O controller hub by a proprietary link. The I/O controller hub, on the other hand, connects to lower-speed I/O, such as SATA, PCI, USB, and Ethernet. P6-based Xeon chipsets Dual processor P6-based Xeon chipsets Intel's initial preferred chipset for Pentium III Xeon was the 840. Four processor P6-based Xeon chipsets The Pentium III Xeon bus protocol allowed four proces ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
NetBurst
The NetBurst microarchitecture, called P68 inside Intel, was the successor to the P6 microarchitecture in the x86 family of central processing units (CPUs) made by Intel. The first CPU to use this architecture was the Willamette-core Pentium 4, released on November 20, 2000 and the first of the Pentium 4 CPUs; all subsequent Pentium 4 and Pentium D variants have also been based on NetBurst. In mid-2001, Intel released the ''Foster'' core, which was also based on NetBurst, thus switching the Xeon CPUs to the new architecture as well. Pentium 4-based Celeron CPUs also use the NetBurst architecture. NetBurst was replaced with the Core microarchitecture based on P6, released in July 2006. Technology The NetBurst microarchitecture includes features such as Hyper-threading, Hyper Pipelined Technology, Rapid Execution Engine, Execution Trace Cache, and replay system which all were introduced for the first time in this particular microarchitecture, and some never appeared ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nanometer
330px, Different lengths as in respect to the Molecule">molecular scale. The nanometre (international spelling as used by the International Bureau of Weights and Measures; SI symbol: nm), or nanometer (American spelling Despite the various list of dialects of English, English dialects spoken from country to country and within different regions of the same country, there are only slight regional variations in English orthography, the two most notable variati ...), is a units of measurement, unit of length in the International System of Units (SI), equal to one billionth (short scale) or one thousand million (long scale) of a metre, meter (0.000000001 m) and to 1000 picometres. One nanometre can be expressed in scientific notation as 1 × 10−9 m and as m. History The nanometre was formerly known as the "''millimicrometre''" – or, more commonly, the "''millimicron''" for short – since it is of a micrometre, micrometer. It was often de ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 775
LGA 775 ( land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU). Intel started selling LGA 775 (Socket T) CPUs with the 64-bit version of their 90 nm "Prescott"-based Pentium 4 HT. The socket had an unusually long life span, lasting 7 years until the last processors supporting it ceased production in 2011. The socket was superseded by the LGA 1156 (Socket H) and LGA 1366 (Socket B) sockets. LGA 775 processors (Note: Some of the processors listed here might not work on newer Intel based chipsets; see "LGA 775 compatibility" below.) * Pentium 4 * Pentium 4 Extreme Edition * Pentium D * Celeron/ Celeron D * Pentium Dual-Core * Pentium Extreme Edition * Core 2 Duo/ Core 2 Quad * Core 2 Extreme Heatsink design For LGA 775, the distance between the screw ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR2 SDRAM
Double Data Rate 2 Synchronous Dynamic Random-Access Memory (DDR2 SDRAM) is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. DDR2 succeeded the original DDR SDRAM specification, and was itself succeeded by DDR3 SDRAM in 2007. DDR2 DIMMs are neither forward compatible with DDR3 nor backward compatible with DDR. In addition to double pumping the data bus as in DDR SDRAM (transferring data on the rising and falling edges of the bus clock signal), DDR2 allows higher bus speed and requires lower power by running the internal clock at half the speed of the data bus. The two factors combine to produce a total of four data transfers per internal clock cycle. Since the DDR2 internal clock runs at half the DDR external clock rate, DDR2 memory operating at the same external data bus clock rate as DDR results in DDR2 being able to provide the same bandwidth but with better la ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microprocessor
A microprocessor is a computer processor (computing), processor for which the data processing logic and control is included on a single integrated circuit (IC), or a small number of ICs. The microprocessor contains the arithmetic, logic, and control circuitry required to perform the functions of a computer's central processing unit (CPU). The IC is capable of interpreting and executing program instructions and performing arithmetic operations. The microprocessor is a multipurpose, Clock signal, clock-driven, Processor register, register-based, digital integrated circuit that accepts binary code, binary data as input, processes it according to instruction (computing), instructions stored in its computer memory, memory, and provides results (also in binary form) as output. Microprocessors contain both combinational logic and sequential logic, sequential digital logic, and operate on numbers and symbols represented in the binary number system. The integration of a whole CPU on ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Grid Array
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the Through-hole technology, through hole method or inserted into a CPU socket, socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). Chip mounting The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by wire bonding or through flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages contain multiple dies, for example Zen 2 and Zen 3 Ryzen CPUs for the Socket AM4, AM4 socket. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
