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SMARC
Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. Specification The SMARC hardware specification V1.0 was published by the Standardization Group for Embedded Technologies (SGeT). SGeT had its first meeting in 2012, headed by Engelbert Hörmannsdorfer. The specification is freely available as a download on the SGeT website. Generally, SMARC modules are based on ARM architecture processors, they can, however, also be fitted with other low-power system on a chip (SoC) architectures, like, for example, ones based on x86 processors. Typically, SMARC modules' power requirement is in the range of a few watts. Computer-on-modules integrate the core function of a bootable computer, as well as additional circuitry, including DRAM, boot-flash, voltage distribution, Ethernet and display transmitter. The modules are ...
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Mobile PCI Express Module
Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades. Generations Smaller graphics modules can be inserted into larger slots, but type I and II heatsinks will not fit type III and above or vice versa. Dell's Alienware m5700 platform uses a heatsink that will fit Type I, II, & III cards without modification. MXM 3.1 was released in March 2012 and added PCIe 3.0 support. First generation modules are ''not'' compatible with second generation (MXM 3) modules and vice versa. First generation modules I to IV are fully backwards compatible. Some MXM cards have different mounting screw hole configurations, always check the mounting holes of the MXM card and verify that they match ...
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Computer-on-module
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of System on a chip, system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with random-access memory, RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense pa ...
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COM Express
COM Express is a form factor for computer-on-modules (COMs), which are highly integrated and compact computers that can be used in design applications much like integrated circuit components. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics (PCI Express, PEG), and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach. The COM modules plug into a baseboard that is typically customized to the application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions. COM Express is commonly used in Industrial, military, aerospace, gaming, medical, transportation, Internet of things, and general computing embedded applications. History The COM Express standard was first released in 2005 by the PCI Industrial Computer Manufacturers Group (PICMG). It defined five module types, each ...
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Qseven
Qseven, a computer-on-module (COM) form factor, is a small, highly integrated computer module that can be used in a design application much like an integrated circuit component. It is smaller than other computer-on-module standards such as COM Express, ETX or XTX and is limited to very low power consuming CPUs. The maximum power consumption should be no more than 12 watts. Specification The name comes from the word "quadratic" due to the square shape of the original module, 70 mm on a side. Qseven was specified by Congatec, MSC and SECO in July 2008 as an independent standard for industry-level applications. Other companies based in Europe such as Kontron adopted the standard, but after a few years it had not yet been popular in the USA. The Qseven specification is hosted by the Standardization Group for Embedded Technologies (SGeT), which took over from the original Qseven consortium in 2013. The revision 2.0 was released 9 September 2012, and 2.1 on 25 February 2016. ...
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System On A Chip
A system on a chip (SoC) is an integrated circuit that combines most or all key components of a computer or Electronics, electronic system onto a single microchip. Typically, an SoC includes a central processing unit (CPU) with computer memory, memory, input/output, and computer data storage#Secondary storage, data storage control functions, along with optional features like a graphics processing unit (GPU), Wi-Fi connectivity, and radio frequency processing. This high level of integration minimizes the need for separate, discrete components, thereby enhancing Performance per watt, power efficiency and simplifying device design. High-performance SoCs are often paired with dedicated memory, such as LPDDR, and flash storage chips, such as Universal Flash Storage, eUFS or eMMC, which may be stacked directly on top of the SoC in a Package on a package, package-on-package (PoP) configuration or placed nearby on the motherboard. Some SoCs also operate alongside specialized chips, such ...
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Ethernet
Ethernet ( ) is a family of wired computer networking technologies commonly used in local area networks (LAN), metropolitan area networks (MAN) and wide area networks (WAN). It was commercially introduced in 1980 and first standardized in 1983 as IEEE 802.3. Ethernet has since been refined to support higher bit rates, a greater number of nodes, and longer link distances, but retains much backward compatibility. Over time, Ethernet has largely replaced competing wired LAN technologies such as Token Ring, FDDI and ARCNET. The original 10BASE5 Ethernet uses a thick coaxial cable as a shared medium. This was largely superseded by 10BASE2, which used a thinner and more flexible cable that was both less expensive and easier to use. More modern Ethernet variants use Ethernet over twisted pair, twisted pair and fiber optic links in conjunction with Network switch, switches. Over the course of its history, Ethernet data transfer rates have been increased from the original to the lates ...
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Kontron
Kontron AG is a German-based multinational company that designs and manufactures embedded systems, modules and boards, and provides software products for Internet of Things and 5G technologies. The company operates in various industrial segments (including industrial automation, communications, transportation, energy, avionics, medical, automotive, and military), manufacturing and selling its products worldwide. Kontron is a premier member of the Intel Embedded Alliance. The corporate group was originally headquartered in Augsburg and consisted of the ''Kontron Europe GmbH'', with its main sites in Ismaning, Augsburg, Deggendorf, and Saarbrücken (other locations included San Diego, Fremont, California, Montreal, Plzeň, Toulon, Bangalore, Taipei, Tokyo and Beijing). Kontron acquired Dolch in 2005. At the 2007 Embedded World trade exhibition in Nuremberg, Kontron introduced a product called UGM-M72, a modular graphics card for Computer-on-Module systems, which was based on U ...
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Printed Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or Electrical wiring, "wire" Electronic component, components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds Via (electronics), vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all e ...
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ARM Architecture
ARM (stylised in lowercase as arm, formerly an acronym for Advanced RISC Machines and originally Acorn RISC Machine) is a family of reduced instruction set computer, RISC instruction set architectures (ISAs) for central processing unit, computer processors. Arm Holdings develops the ISAs and licenses them to other companies, who build the physical devices that use the instruction set. It also designs and licenses semiconductor intellectual property core, cores that implement these ISAs. Due to their low costs, low power consumption, and low heat generation, ARM processors are useful for light, portable, battery-powered devices, including smartphones, laptops, and tablet computers, as well as embedded systems. However, ARM processors are also used for desktop computer, desktops and server (computing), servers, including Fugaku (supercomputer), Fugaku, the world's fastest supercomputer from 2020 to 2022. With over 230 billion ARM chips produced, , ARM is the most widely used ...
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Serial Peripheral Interface
Serial Peripheral Interface (SPI) is a de facto standard (with many variants) for synchronous serial communication, used primarily in embedded systems for short-distance wired communication between integrated circuits. SPI follows a master–slave architecture, where a master device orchestrates communication with one or more slave devices by driving the clock and chip select signals. Some devices support changing master and slave roles on the fly. Motorola's original specification (from the early 1980s) uses four logic signals, aka lines or wires, to support full duplex communication. It is sometimes called a ''four-wire'' serial bus to contrast with three-wire variants which are half duplex, and with the ''two-wire'' I²C and 1-Wire serial buses. Typical applications include interfacing microcontrollers with peripheral chips for Secure Digital cards, liquid crystal displays, analog-to-digital and digital-to-analog converters, flash and EEPROM memory, and various ...
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