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Pin (electronics)
In electronics, a lead () or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole electronic components are also often called ''pins''; in ball grid array packages, they are in form of small spheres, and are therefore called "balls". Many electrical components such as capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array packages. Integrated circuit pins often either bend u ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lead Wires
Lead () is a chemical element; it has symbol Pb (from Latin ) and atomic number 82. It is a heavy metal that is denser than most common materials. Lead is soft and malleable, and also has a relatively low melting point. When freshly cut, lead is a shiny gray with a hint of blue. It tarnishes to a dull gray color when exposed to air. Lead has the highest atomic number of any stable element and three of its isotopes are endpoints of major nuclear decay chains of heavier elements. Lead is a relatively unreactive post-transition metal. Its weak metallic character is illustrated by its amphoteric nature; lead and lead oxides react with acids and bases, and it tends to form covalent bonds. Compounds of lead are usually found in the +2 oxidation state rather than the +4 state common with lighter members of the carbon group. Exceptions are mostly limited to organolead compounds. Like the lighter members of the group, lead tends to bond with itself; it can form chains and polyhedra ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components are etched onto a small, flat piece ("chip") of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discre ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Inductance
Inductance is the tendency of an electrical conductor to oppose a change in the electric current flowing through it. The electric current produces a magnetic field around the conductor. The magnetic field strength depends on the magnitude of the electric current, and therefore follows any changes in the magnitude of the current. From Faraday's law of induction, any change in magnetic field through a circuit induces an electromotive force (EMF) (voltage) in the conductors, a process known as electromagnetic induction. This induced voltage created by the changing current has the effect of opposing the change in current. This is stated by Lenz's law, and the voltage is called ''back EMF''. Inductance is defined as the ratio of the induced voltage to the rate of change of current causing it. It is a proportionality constant that depends on the geometry of circuit conductors (e.g., cross-section area and length) and the magnetic permeability of the conductor and nearby materials. An ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Capacitance
Capacitance is the ability of an object to store electric charge. It is measured by the change in charge in response to a difference in electric potential, expressed as the ratio of those quantities. Commonly recognized are two closely related notions of capacitance: ''self capacitance'' and ''mutual capacitance''. An object that can be electrically charged exhibits self capacitance, for which the electric potential is measured between the object and ground. Mutual capacitance is measured between two components, and is particularly important in the operation of the capacitor, an elementary linear electronic component designed to add capacitance to an electric circuit. The capacitance between two conductors depends only on the geometry; the opposing surface area of the conductors and the distance between them; and the permittivity of any dielectric material between them. For many dielectric materials, the permittivity, and thus the capacitance, is independent of the potential ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Frequency
Frequency is the number of occurrences of a repeating event per unit of time. Frequency is an important parameter used in science and engineering to specify the rate of oscillatory and vibratory phenomena, such as mechanical vibrations, audio signals (sound), radio waves, and light. The interval of time between events is called the period. It is the reciprocal of the frequency. For example, if a heart beats at a frequency of 120 times per minute (2 hertz), its period is one half of a second. Special definitions of frequency are used in certain contexts, such as the angular frequency in rotational or cyclical properties, when the rate of angular progress is measured. Spatial frequency is defined for properties that vary or cccur repeatedly in geometry or space. The unit of measurement of frequency in the International System of Units (SI) is the hertz, having the symbol Hz. Definitions and units For cyclical phenomena such as oscillations, waves, or for examp ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coefficient Of Thermal Expansion
Thermal expansion is the tendency of matter to increase in length, area, or volume, changing its size and density, in response to an increase in temperature (usually excluding phase transitions). Substances usually contract with decreasing temperature (thermal contraction), with rare exceptions within limited temperature ranges ('' negative thermal expansion''). Temperature is a monotonic function of the average molecular kinetic energy of a substance. As energy in particles increases, they start moving faster and faster, weakening the intermolecular forces between them and therefore expanding the substance. When a substance is heated, molecules begin to vibrate and move more, usually creating more distance between themselves. The relative expansion (also called strain) divided by the change in temperature is called the material's coefficient of linear thermal expansion and generally varies with temperature. Prediction If an equation of state is available, it can be used t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Invar
Invar, also known generically as FeNi36 (64FeNi in the US), is a nickel–iron alloy notable for its uniquely low coefficient of thermal expansion (CTE or α). The name ''Invar'' comes from the word ''invariable'', referring to its relative lack of expansion or contraction with temperature changes, and is a registered trademark of ArcelorMittal. The discovery of the alloy was made in 1895 by Swiss physicist Charles Édouard Guillaume for which he received the Nobel Prize in Physics in 1920. It enabled improvements in scientific instruments. Properties Like other nickel/iron compositions, Invar is a solid solution; that is, it is a Phase (matter), single-phase alloy. In one commercial grade called Invar 36 it consists of approximately 36% nickel and 64% iron, has a melting point of , a density of and a resistivity of . The invar range was described by Westinghouse scientists in 1961 as "30–45 Mole fraction, atom per cent nickel". Common grades of Invar have a coefficient o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad Flat No-leads Package
Flat no-leads packages such as quad-flat no-leads (QFN''and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the ''surfaces'' of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). Flat no-lead cross-section The figure shows the cross section of a flat no-lead package with ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'', Wiley VCH, 2000, , page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL) is an Semiconductor package, electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole technology, through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild Semiconductor, Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually refer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad Flat Package
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The first QFPs were introduced in Japan in 1977 in order to provide more pins on a small package to allow a greater number of digits on electronic calculators. It soon spread to other consumer electronics in that country. The QPF only became common in Europe and United States during the early nineties. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simpli ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
