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Norbit
In electronics, the NORBIT family of modules is a very early form (since 1960) of Digital electronics, digital logic developed by Philips (and also provided through and Mullard) that uses modules containing discrete components to build logic function blocks in resistor–transistor logic (RTL) or diode–transistor logic (DTL) technology. Overview The system was originally conceived as building blocks for solid-state (electronics), solid-state hard-wired programmed logic controllers (the predecessors of programmable logic controllers (PLC)) to replace electro-mechanical relay logic in industrial control systems for process control and automation applications, similar to early Telefunken/AEG (German company), AEG Logistat, Siemens Simatic, Brown, Boveri & Cie, Brown, Boveri & Cie, ACEC (company), ACEC Logacec or Estacord systems. Each available logical function was recognizable by the color of its plastic container, black, blue, red, green, violet, etc. The most important circ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL) is an Semiconductor package, electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole technology, through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild Semiconductor, Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually refer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Resistor–transistor Logic
Resistor–transistor logic (RTL), sometimes also known as transistor–resistor logic (TRL), is a class of digital circuits built using resistors as the input network and bipolar junction transistors (BJTs) as switching devices. RTL is the earliest class of transistorized digital logic circuit; it was succeeded by diode–transistor logic (DTL) and transistor–transistor logic (TTL). RTL circuits were first constructed with discrete components, but in 1961 it became the first digital logic family to be produced as a monolithic integrated circuit. RTL integrated circuits were used in the Apollo Guidance Computer, whose design began in 1961 and which first flew in 1966. Implementation RTL inverter A bipolar Transistor#Transistor as a switch, transistor switch is the simplest RTL gate (Inverter (logic gate), inverter or NOT gate) implementing logical negation. It consists of a Common emitter, common-emitter stage with a base resistor connected between the base and the input v ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Diode–transistor Logic
Diode–transistor logic (DTL) is a class of digital circuits that is the direct ancestor of transistor–transistor logic. It is called so because the logic gating functions AND and OR are performed by diode logic, while logical inversion (NOT) and amplification (providing signal restoration) is performed by a transistor (in contrast with resistor–transistor logic (RTL) and transistor–transistor logic (TTL). Implementations The DTL circuit shown in the first picture consists of three stages: an input diode logic stage (D1, D2 and R1), an intermediate level shifting stage (R3 and R4), and an output common-emitter amplifier stage (Q1 and R2). If both inputs A and B are high (logic 1; near V+), then the diodes D1 and D2 are reverse biased. Resistors R1 and R3 will then supply enough current to turn on Q1 (drive Q1 into saturation) and also supply the current needed by R4. There will be a small positive voltage on the base of Q1 (VBE, about 0.3 V for germanium an ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Single In-line Package
In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins, and some ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
ACEC (company)
SA Ateliers de Constructions Electriques de Charleroi (ACEC) was a Belgian manufacturer of electrical generation, transmission, transport, lighting and industrial equipment, with origins dating to the late 19th century as a successor to the Société Électricité et Hydraulique founded by . After World War II the company expanded into electronics, and became a contractor to the nuclear industry. The company was acquired by Westinghouse in 1970; in 1985 Westinghouse's share was acquired by Société Générale de Belgique (SGB) and Compagnie Générale d'Electricité (CGE). The company operated at a loss during the 1980s, and was split and sold; Alstom and its affiliates acquired the majority of the company, along with ABB and Alcatel Bell and others. The remnants of the company were merged into Union Minière in 1989, forming ''ACEC Union Minière''. History Background, 1878–1904 In 1878 Julien Dulait (1855–1926), son of steelworks engineer Jules Dulait began experi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Thyristor
A thyristor (, from a combination of Greek language ''θύρα'', meaning "door" or "valve", and ''transistor'' ) is a solid-state semiconductor device which can be thought of as being a highly robust and switchable diode, allowing the passage of current in one direction but not the other, often under control of a gate electrode, that is used in high power applications like inverters and radar generators. It usually consists of four layers of alternating P- and N-type materials. It acts as a bistable switch (or a latch). There are two designs, differing in what triggers the conducting state. In a three-lead thyristor, a small current on its gate lead controls the larger current of the anode-to-cathode path. In a two-lead thyristor, conduction begins when the potential difference between the anode and cathode themselves is sufficiently large (breakdown voltage). The thyristor continues conducting until the voltage across the device is reverse-biased or the voltage is removed (b ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Planar Transistor
A diffused junction transistor is a transistor formed by diffusing dopants into a semiconductor substrate. The diffusion process was developed later than the alloy-junction and grown junction processes for making bipolar junction transistors (BJTs). Bell Labs developed the first prototype diffused junction bipolar transistors in 1954. Diffused-base transistor The earliest diffused junction transistors were diffused-base transistors. These transistors still had alloy emitters and sometimes alloy collectors like the earlier alloy-junction transistors. Only the base was diffused into the substrate. Sometimes the substrate formed the collector, but in transistors like Philco's micro-alloy diffused transistors the substrate was the bulk of the base. Double diffusion At Bell Labs Calvin Souther Fuller produced basic physical understanding of a means of directly forming the emitter, base, and collector by double diffusion. The method was summarized in a history of science at Bel ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Silicon
Silicon is a chemical element; it has symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic lustre, and is a tetravalent metalloid (sometimes considered a non-metal) and semiconductor. It is a member of group 14 in the periodic table: carbon is above it; and germanium, tin, lead, and flerovium are below it. It is relatively unreactive. Silicon is a significant element that is essential for several physiological and metabolic processes in plants. Silicon is widely regarded as the predominant semiconductor material due to its versatile applications in various electrical devices such as transistors, solar cells, integrated circuits, and others. These may be due to its significant band gap, expansive optical transmission range, extensive absorption spectrum, surface roughening, and effective anti-reflection coating. Because of its high chemical affinity for oxygen, it was not until 1823 that Jöns Jakob Berzelius was first able to p ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Alloy Transistor
The germanium alloy-junction transistor, or alloy transistor, was an early type of bipolar junction transistor, developed at General Electric and RCA in 1951 as an improvement over the earlier grown-junction transistor. The usual construction of an alloy-junction transistor is a germanium crystal forming the base, with emitter and collector alloy beads fused on opposite sides. Indium and antimony were commonly used to form the alloy junctions on a bar of N-type germanium. The collector junction pellet would be about 50 mils (thousandths of an inch) in diameter, and the emitter pellet about 20 mils. The base region would be on the order of 1 mil (0.001 inches, 25 μm) thick. There were several types of improved alloy-junction transistors developed over the years that they were manufactured. All types of alloy-junction transistors became obsolete in the early 1960s, with the introduction of the planar transistor which could be mass-produced easily while alloy-junction transistor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Germanium
Germanium is a chemical element; it has Symbol (chemistry), symbol Ge and atomic number 32. It is lustrous, hard-brittle, grayish-white and similar in appearance to silicon. It is a metalloid or a nonmetal in the carbon group that is chemically similar to silicon. Like silicon, germanium naturally Chemical reaction, reacts and forms complexes with oxygen in nature. Because it seldom appears in high concentration, germanium was found comparatively late in the Timeline of chemical element discoveries, discovery of the elements. Germanium ranks 50th Abundance of elements in Earth's crust, in abundance of the elements in the Earth's crust. In 1869, Dmitri Mendeleev Mendeleev's predicted elements, predicted its existence and some of its Chemical property, properties from its position on his periodic table, and called the element ekasilicon. On February 6, 1886, Clemens Winkler at Freiberg University found the new element, along with silver and sulfur, in the mineral argyrodite. Winkle ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Printed Circuit Board
A printed circuit board (PCB), also called printed wiring board (PWB), is a Lamination, laminated sandwich structure of electrical conduction, conductive and Insulator (electricity), insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or Electrical wiring, "wire" Electronic component, components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds Via (electronics), vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side. Printed circuit boards are used in nearly all e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
Potting (electronics)
In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as corona discharge in high-voltage assemblies. Potting has also been used to protect against reverse engineering or to protect parts of cryptography processing cards. When such materials are used only on single components instead of entire assemblies, the process is referred to as encapsulation. Thermosetting plastics or silicone rubber gels are often used, though epoxy resins are also very common. When epoxy resins are used, low chloride grades are usually specified. Many sites recommend using a potting product to protect sensitive electronic components from impact, vibration, and loose wires. In the potting process, an electronic assembly is placed inside a mold (the "pot") which is then filled with an insulating ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] [Amazon] |
