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Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or Lead (electronics), "pins") where multiple integrated circuits (ICs or "chips"), semiconductor Die (integrated circuit), dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dies all on the same module. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power5
The POWER5 is a microprocessor developed and fabricated by IBM. It is an improved version of the POWER4. The principal improvements are support for simultaneous multithreading (SMT) and an on-die memory controller. The POWER5 is a dual-core microprocessor, with each core supporting one physical Thread (computing), thread and two logical threads, for a total of two physical threads and four logical threads. History Technical details of the microprocessor were first presented at the 2003 Hot Chips (symposium), Hot Chips conference. A more complete description was given at Microprocessor Forum 2003 on 14 October 2003. The POWER5 was not sold openly and was used exclusively by IBM and their partners. Systems using the microprocessor were introduced in 2004. The POWER5 competed in the high-end enterprise server market, mostly against the Intel Itanium 2 and to a lesser extent, the Sun Microsystems UltraSPARC IV and the Fujitsu SPARC64 V. It was superseded in 2005 by an improve ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3D Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global ( package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); 3D heterogeneous integration; and 3D systems integration; a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SD Card
Secure Digital (SD) is a proprietary, non-volatile, flash memory card format developed by the SD Association (SDA). Owing to their compact size, SD cards have been widely adopted in a variety of portable consumer electronics, including digital cameras, camcorders, video game consoles, mobile phones, action cameras, and camera drones. The SD format was introduced in August 1999 by SanDisk, Panasonic (then known as Matsushita), and Kioxia (then part of Toshiba). It was designed as a successor to the MultiMediaCard (MMC) format, introducing several improvements aimed at enhancing usability, durability, and performance, which contributed to its rapid emergence as an industry standard. To manage the licensing and intellectual property rights related to the format, the three companies established SD-3C, LLC. In January 2000, they also founded the SDA, a non-profit organization dedicated to developing and promoting SD card standards. As of 2023, the SDA includes approxima ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Crystalwell
Intel Graphics Technology (GT) is the collective name for a series of integrated graphics processors (IGPs) produced by Intel that are manufactured on the same package or die as the central processing unit (CPU). It was first introduced in 2010 as Intel HD Graphics and renamed in 2017 as Intel UHD Graphics. Intel Iris Graphics and Intel Iris Pro Graphics are the IGP series introduced in 2013 with some models of Haswell processors as the high-performance versions of HD Graphics. Iris Pro Graphics was the first in the series to incorporate embedded DRAM. Since 2016 Intel refers to the technology as Intel Iris Plus Graphics with the release of Kaby Lake. In the fourth quarter of 2013, Intel integrated graphics represented, in units, 65% of all PC graphics processor shipments. However, this percentage does not represent actual adoption as a number of these shipped units end up in systems with discrete graphics cards. History Before the introduction of Intel HD Graphics, Intel i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Kaby Lake-G
Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous " tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer process–architecture–optimization model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, with its desktop chips officially launched in January 2017. In August 2017, Intel announced Kaby Lake Refresh (Kaby Lake R) marketed as the 8th generation mobile CPUs, breaking the long cycle where architectures matched the corresponding generations of CPUs and meanwhile also supporting Windows 11. Skylake was anticipated to be succeeded by the 10 nanometer Cannon Lake, but it was announced in July 2015 that Cannon Lake had been delayed until the second half of 2017. In the meantime, Intel released a fourth 1 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Arrandale
Arrandale is the code name for a family of mobile Intel processors, sold as mobile Intel Core i3, i5 and i7 as well as Celeron and Pentium. It is closely related to the desktop Clarkdale processor; both use dual-core dies based on the '' Westmere'' 32 nm die shrink of the Nehalem microarchitecture, and have integrated Graphics as well as PCI Express and DMI links. Arrandale is the successor of the 45 nm Core-microarchitecture-based Penryn processor that is used in many of the mobile Core 2, Celeron and Pentium Dual-Core processors. While Penryn typically used both a north bridge and a south bridge, Arrandale already contains the major northbridge components, which are the memory controller, PCI Express bus for external graphics, integrated graphics, and the DMI interface, making it possible to build more compact systems. The Arrandale processor package contains two dies: the 32 nm processor die with the I/O connections, and the 45 nm Intel HD Graphic ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Clarkdale (microprocessor)
Clarkdale is the codename for Intel's first-generation Core i5, i3 and Pentium dual-core desktop processors. It is closely related to the mobile Arrandale processor; both use dual-core dies based on the 32 nm Westmere microarchitecture and have integrated Graphics, PCI Express and DMI links built-in. Clarkdale is the successor of the Wolfdale used in desktop Intel Core 2, Celeron and Pentium Dual-Core processors. Unlike its predecessor, Clarkdale already contains the major north bridge components, such as memory controller, PCI Express for external graphics, integrated graphics and the DMI connector, making it possible to build more compact systems without a separate north bridge or discrete graphics like Lynnfield. The Clarkdale processor package contains two dies: the 32 nm processor die with the I/O connections, and the 45 nm graphics and integrated memory controller die. Physical separation of the processor die and memory controller die resulted in increased ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Xeon
Xeon (; ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for error correction code (ECC) memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture (MCA). They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus, which replaced ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pentium D
Pentium D is a range of desktop 64-bit x86-64 processors based on the NetBurst microarchitecture, which is the Multi-core processor, dual-core variant of the Pentium 4 manufactured by Intel. Each CPU comprised two cores. The brand's first processor, codenamed Smithfield and manufactured on the 90 nm process, was released on May 25, 2005, followed by the 65 nm Presler nine months later. The core implementation on the 90 nm Smithfield and later 65 nm Presler are designed differently but are functionally the same. The 90 nm Smithfield contains a single Die (integrated circuit), die, with two adjoined but functionally separate CPU cores cut from the same wafer (electronics), wafer. The later 65 nm Presler utilized a multi-chip module package, where two discrete dies each containing a single core reside on the CPU substrate. Neither the 90 nm Smithfield nor the 65 nm Presler were capable of direct core to core communication, relying instead on the Northbridge (computing), northbridge li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pentium II OverDrive
The Pentium OverDrive was a microprocessor marketing brand name used by Intel, to cover a variety of consumer upgrade products sold in the mid-1990s. It was originally released for 486 motherboards, and later some Pentium sockets. Intel dropped the brand, as it failed to appeal to corporate buyers, and discouraged new system sales. 486 sockets The Pentium OverDrive is a heavily modified, 3.3 volt Pentium P54 core manufactured on 0.6 micrometer technology. It is fitted with a 486-compatible bus unit (though with an increased pin-count), an integrated heatsink and fan, and 32 kB of level 1 cache, double the 16 kB offered on regular P54C chips. As the data bus was effectively reduced to 32-bit width, per-clock performance was much lower than that of a 'regular' Pentium, though still substantially faster compared to a similarly clocked 486 owing to the Pentium's architectural improvements, such as the much improved FPU. It was also equipped with an integrated 3.3 volt power regula ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pentium Pro
The Pentium Pro is a sixth-generation x86 microprocessor developed and manufactured by Intel and introduced on November 1, 1995. It implements the P6 (microarchitecture), P6 microarchitecture (sometimes termed i686), and was the first x86 Intel CPU to do so. The Pentium Pro was originally intended to replace the original Pentium (original), Pentium in a full range of applications. Later, it was reduced to a more narrow role as a server and high-end desktop processor. The Pentium Pro was also used in supercomputers, most notably ASCI Red, which was the first computer to reach over one teraFLOPS in 1996 and held the number one spot in the TOP500 list from 1997 to 2000. ASCI Red used two Pentium Pro CPUs on each computing node. While the Pentium and Pentium MMX had 3.1 and 4.5 million transistors, respectively, the Pentium Pro contained 5.5 million transistors. It was capable of both dual- and quad-processor configurations and only came in one form factor, the relatively l ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
