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Intel Core I7
The following is a list of Intel Core i7 brand microprocessors. Introduced in 2008, the Core i7 line of microprocessors are intended to be used by high-end users. Desktop processors Nehalem microarchitecture (1st generation) "Bloomfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Turbo Boost, Smart Cache. * FSB has been replaced with QPI. * Transistors: 731 million * Die size: 263 mm * Steppings: C0, D0 "Lynnfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, Smart Cache. * Core i7-875K features an unlocked multiplier and does not support Intel TXT and Intel VT-d. * FSB has been replaced with DMI. *Mov ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Core I7 (11th Generation, Logo)
The following is a list of Intel Core i7 brand microprocessors. Introduced in 2008, the Core i7 line of microprocessors are intended to be used by high-end users. Desktop processors Nehalem microarchitecture (1st generation) "Bloomfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Turbo Boost, Smart Cache. * FSB has been replaced with QPI. * Transistors: 731 million * Die size: 263 mm * Steppings: C0, D0 "Lynnfield" (45 nm) * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, Smart Cache. * Core i7-875K features an unlocked multiplier and does not support Intel TXT and Intel VT-d. * FSB has been replaced with DMI. *Moves the QPI link an ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SSE2
SSE2 (Streaming SIMD Extensions 2) is one of the Intel SIMD (Single Instruction, Multiple Data) processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2000. It extends the earlier SSE instruction set, and is intended to fully replace MMX. Intel extended SSE2 to create SSE3 in 2004. SSE2 added 144 new instructions to SSE, which has 70 instructions. Competing chip-maker AMD added support for SSE2 with the introduction of their Opteron and Athlon 64 ranges of AMD64 64-bit CPUs in 2003. Features Most of the SSE2 instructions implement the integer vector operations also found in MMX. Instead of the MMX registers they use the XMM registers, which are wider and allow for significant performance improvements in specialized applications. Another advantage of replacing MMX with SSE2 is avoiding the mode switching penalty for issuing x87 instructions present in MMX because it is sharing register space with the x87 FPU. The SSE2 als ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut ( diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel QuickPath Interconnect
The Intel QuickPath Interconnect (QPI) is a point-to-point processor interconnect developed by Intel which replaced the front-side bus (FSB) in Xeon, Itanium, and certain desktop platforms starting in 2008. It increased the scalability and available bandwidth. Prior to the name's announcement, Intel referred to it as Common System Interface (CSI). Earlier incarnations were known as Yet Another Protocol (YAP) and YAP+. QPI 1.1 is a significantly revamped version introduced with Sandy Bridge-EP (Romley platform). QPI was replaced by Intel Ultra Path Interconnect (UPI) in Skylake-SP Xeon processors based on LGA 3647 socket. Background Although sometimes called a "bus", QPI is a point-to-point interconnect. It was designed to compete with HyperTransport that had been used by Advanced Micro Devices (AMD) since around 2003. Intel developed QPI at its Massachusetts Microprocessor Design Center (MMDC) by members of what had been the Alpha Development Group, which Intel had acquired from ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Front-side Bus
A front-side bus (FSB) is a computer communication interface (bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus. The speed of the front side bus is often used as an important measure of the performance of a computer. The original front-side bus architecture has been replaced by HyperTransport, Intel QuickPath Interconnect or Direct Media Interface in modern volume CPUs. History The term came into use by Intel Corporation about the time the Pentium Pro and Pentium II products were announced, in the 1990s. "Front side" refers to the e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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