Copper Plating

	Copper Plating Copper plating may refer to: * Copper electroplating, a technique of electroplating a layer of copper onto a metal object * Electroless copper plating, an auto-catalytic chemical technique used to deposit a layer of copper on a solid workpiece See also * Copperplate (other) {{disambiguation ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]
picture info	Copper Electroplating Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. The copper layer can be decorative, provide corrosion resistance, increase electrical and thermal conductivity, or improve the adhesion of additional deposits to the substrate. Overview Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects. After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. Th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]
picture info	Electroless Copper Plating Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde. Unlike electroplating, electroless plating processes in general do not require passing an electric current through the bath and the substrate; the reduction of the metal cations in solution to metallic is achieved by purely chemical means, through an autocatalytic reaction. Thus electroless plating creates an even layer of metal regardless of the geometry of the surface – in contrast to electroplating which suffers from uneven current density due to the effect of substrate shape on the electric field at its surface. Moreover, electroless plating can be applied to non-conductive surfaces. Process In a typical formulation of the process, the surfaces to be coated are primed with a palladium catalyst and th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]