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Back End Of Line
Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices. It is the second part of IC fabrication, after front end of line (FEOL). In BEOL, the individual devices (transistors, capacitors, resistors, etc.) are connected to each other according to how the metal wiring is deposited. Metalization The individual devices are connected by alternately stacking oxide layers (for insulation purposes) and metal layers (for the interconnect tracks). The vias between layers and the interconnects on the individual layers are thus formed using a structuring process. Common metals are copper and aluminum. BEOL generally begins when the first layer of metal is deposited on the wafer. BEOL includes contacts, insulating layers (dielectrics), metal levels, and bonding sites for chip-to-package connections. For modern IC processes, more than 10 metal layers ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Phosphosilicate Glass
Phosphosilicate glass, commonly referred to by the acronym PSG, is a silicate glass commonly used in semiconductor device fabrication for intermetal layers, i.e., insulating layers deposited between succeedingly higher metal or conducting layers, due to its effect in gettering alkali ions. Another common type of phosphosilicate glass is borophosphosilicate glass (BPSG). Soda-lime phosphosilicate glasses also form the basis for bioactive glasses (e.g. Bioglass), a family of materials which chemically convert to mineralised bone (hydroxy-carbonate-apatite) in physiological fluid. Bismuth doped phosphosilicate glasses are being explored for use as the active gain medium in fiber lasers for fiber-optic communication. See also * Wafer (electronics) In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for Semiconductor device fabrication, the fabrication of integrated circuits and, in ph ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components are etched onto a small, flat piece ("chip") of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count. The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discre ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Front End Of Line
The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers. Steps For the CMOS process, FEOL contains all fabrication steps needed to form isolated CMOS elements: # Selecting the type of wafer to be used; Chemical-mechanical planarization (CMP) and cleaning of the wafer. # Shallow trench isolation (STI) (or LOCOS in early processes with feature size > 0.25 μm); # Well formation; # Gate module formation; # Source and drain module formation. Finally, the surface is treated to prepare the contacts for the subsequent metallization. This concludes the FEOL process, that is, all devices have been built. Following these steps, the devices must be connected electrically as per the nets to build the electrical circuit. This is done in the back end of l ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit Packaging
Integrated circuit packaging is the final stage of fabrication (semiconductor), semiconductor device fabrication, in which the die (integrated circuit), die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "semiconductor package, package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the integrated circuit. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. Therefore, it is important that the materials used as electrical contacts exhibit characteristics like low resistance, low capacitance and low inductance. Both the structure and materials must prioritize sign ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die Preparation
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing. Wafer mounting Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ensures that the individual dies remain firmly in place during 'dicing', as the process of cutting the wafer is called. The picture on the right shows a 300 mm wafer after it was mounted and diced. The blue plastic is the adhesive tape. The wafer is the round disc in the middle. In this case, a large number of dies were already removed. Semiconductor-die cutting In the manufacturing of micro ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Backgrinding
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers predominantly used today have diameters of 200 and 300 mm. They are roughly 750 μm thick to ensure a minimum of mechanical stability and to avoid warping during high-temperature processing steps. Smartcards, USB memory sticks, smartphones, handheld music players, and other ultra-compact electronic products would not be feasible in their present form without minimizing the size of their various components along all dimensions. The backside of the wafers are thus ground prior to wafer dicing (separation of the individual microchips). Wafers thinned down to 75 to 50 μm are common today. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Testing
A wafer is a crisp, often sweet, very thin, flat, light biscuit, often used to decorate ice cream, and also used as a Garnish (food), garnish on some sweet dishes. They frequently have a waffle surface pattern but may also be patterned with insignia of the food's manufacturer or may be patternless. Some chocolate bars, such as Kit Kat and Toffee Crisp, are wafers with chocolate in and around them. Communion wafers A communion wafer is a type of unleavened bread consumed as part of the Christian ritual of communion. Spa wafer Special "spa wafers" (Czech: ''lázeňské oplatky'', Slovak: ''kúpeľné oblátky'') are produced in the spa towns of the Czech Republic and the Slovak Republic (e.g. Piešťany). The production of the wafers in Karlovy Vary, Karlsbad and Mariánské Lázně, Marienbad was traditional to the towns' Sudeten Germans, German-speaking population, who, after Expulsion of Germans from Czechoslovakia, the ethnic cleansing of the area, brought the craft to Germa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chemical Vapor Deposition
Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (electronics), wafer (substrate) is exposed to one or more Volatility (chemistry), volatile wikt:precursor, precursors, which chemical reaction, react and/or chemical decomposition, decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber. Microfabrication processes widely use CVD to deposit materials in various forms, including: Single crystal, monocrystalline, polycrystalline, amorphous, and Epitaxy, epitaxial. These materials include: silicon (Silicon dioxide, dioxide, silicon carbide, carbide, silicon nitride, nitride, silicon oxynitride, oxynitride), carbon (carbon (fiber), fiber, carbon nanofibers, nanofibers, carbon nanot ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
