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Apple A12
The Apple A12 Bionic is a 64-bit ARM-based system on a chip (SoC) designed by Apple Inc., part of the Apple silicon series, It first appeared in the iPhone XS and XS Max, iPhone XR, iPad Air (3rd generation), iPad Mini (5th generation), iPad (8th generation) and Apple TV 4K (2nd generation). Apple states that the two high-performance cores are 15% faster and 40% more energy-efficient than the Apple A11's, and the four high-efficiency cores use 50% less power than the A11's. It is the first mass-market system on a chip to be built using the 7 nm process. Updates for the 8th generation iPad and the 3rd generation iPad Pro will still be supported. Design The Apple A12 SoC features an Apple-designed 64-bit ARMv8.3-A six-core CPU, with two high-performance cores called Vortex, running at 2.49 GHz, and four energy-efficient cores called Tempest. The Vortex cores are a 7-wide decode out-of-order superscalar design, while the Tempest cores are a 3-wide decode out-of-order ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
7 Nanometer
In semiconductor manufacturing, the "7 nm" process is a term for the MOSFET technology node following the "10 nm" node, defined by the International Roadmap for Devices and Systems (IRDS), which was preceded by the International Technology Roadmap for Semiconductors (ITRS). It is based on FinFET (fin field-effect transistor) technology, a type of multi-gate MOSFET technology. As of 2021, the IRDS Lithography standard gives a table of dimensions for the "7 nm" node, with examples given below: The 2021 IRDS Lithography standard is a retrospective document, as the first volume production of a "7 nm" branded process was in 2016 with Taiwan Semiconductor Manufacturing Company's (TSMC) production of 256Mbit SRAM memory chips using a "7 nm" process called N7. Samsung started mass production of their "7nm" process (7LPP) devices in 2018. These process nodes had the same approximate transistor density as Intel's "''10 nm Enhanced Superfin''" node, later rebranded "Intel 7." Sinc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IPad Mini (5th Generation)
The fifth-generation iPad Mini (stylized and marketed as iPad mini and colloquially referred to as iPad Mini 5) is a tablet computer in the iPad Mini line, developed and marketed by Apple Inc. Announced in a press release along with the IPad Air (3rd generation), third-generation iPad Air on March 18, 2019 and released the same day. Its predecessor, the iPad Mini 4, was discontinued on the same day. It shares a similar design to the iPad Mini 4 and features the Apple A12 Bionic chip, 64 or 256GB storage, a more modernly upgraded 7.9-inch Retina Display with support for Apple Pencil (1st Generation), True Tone display and Bluetooth, Bluetooth 5.0. iFixit's teardown shows this iPad Mini is equipped with an upgraded 3GB of Mobile DDR, LPDDR4X RAM, the same as the iPhone XR. The iPad Mini 5, iPad (9th generation) and the iPad Air (3rd generation), iPad Air 3 were the last iPad models to use a Lightning (connector), Lightning port and a home button. The iPad Mini 5 was discontinued ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mobile DDR
Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory (SDRAM) that consumes less power than other random access memory designs and is thus targeted for mobile computing devices such as laptop computers and smartphones. Older variants are also known as Mobile DDR, and abbreviated as mDDR. Modern LPDDR SDRAM is distinct from DDR SDRAM, with various differences that make the technology more appropriate for mobile applications. LPDDR technology standards are developed independently of DDR standards, with LPDDR4X and even LPDDR5 for example being implemented prior to DDR5 SDRAM and offering far higher data rates than DDR4 SDRAM. Bus width In contrast with standard SDRAM, used in stationary devices and laptops and usually connected over a 64-bit wide memory bus, LPDDR also permits 16- or 32-bit wide channels. The "E" and "X" versions mark enhanced versions of the specifications. They formalize overclocking the memory arr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Gibibyte
The byte is a unit of digital information that most commonly consists of eight bits. Historically, the byte was the number of bits used to encode a single character of text in a computer and for this reason it is the smallest addressable unit of memory in many computer architectures. To disambiguate arbitrarily sized bytes from the common 8-bit definition, network protocol documents such as the Internet Protocol () refer to an 8-bit byte as an octet. Those bits in an octet are usually counted with numbering from 0 to 7 or 7 to 0 depending on the bit endianness. The size of the byte has historically been hardware-dependent and no definitive standards existed that mandated the size. Sizes from 1 to 48 bits have been used. The six-bit character code was an often-used implementation in early encoding systems, and computers using six-bit and nine-bit bytes were common in the 1960s. These systems often had memory words of 12, 18, 24, 30, 36, 48, or 60 bits, corresponding t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Package On Package
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and Semiconductor memory, memory. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. PoP allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of being slightly taller. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations. Configuration Two widely used configurations exist for PoP: * Pure memory stacking: two or more memory only packages are stacked on each other * Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard. During PCB assembly, the bottom pac ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Engadget
Engadget ( ) is a technology news, reviews and analysis website offering daily coverage of gadgets, consumer electronics, video games, gaming hardware, apps, social media, streaming, AI, space, robotics, electric vehicles and other potentially consumer-facing technology. The site's content includes short-form news posts, reported features, news analysis, product reviews, buying guides, two weekly video shows, The Engadget Podcast, The Morning After newsletter and a weekly deals newsletter. It has been operated by Yahoo! Inc. (2017–present), Yahoo! Inc. since September 2021. History Engadget was founded by former ''Gizmodo'' technology weblog editor and co-founder Peter Rojas. Engadget was the largest blog in Weblogs, Inc., a blog network with over 75 Blog, weblogs, including ''Autoblog.com, Autoblog'' and ''Joystiq,'' which formerly included ''Hackaday''. Weblogs Inc. was purchased by AOL in 2005. Launched in March 2004, Engadget was one of the internet's earliest tech blogs. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
FinFET
A fin field-effect transistor (FinFET) is a multigate device, a MOSFET (metal–oxide–semiconductor field-effect transistor) built on a substrate where the gate is placed on two, three, or four sides of the channel or wrapped around the channel (gate all around), forming a double or even multi gate structure. These devices have been given the generic name "FinFETs" because the source/drain region forms fins on the silicon surface. The FinFET devices exhibit significantly faster switching times and higher current density than planar CMOS (complementary metal–oxide–semiconductor) technology, resulting in enhanced performance and power efficienc FinFET is a type of non-planar transistor, or "3D" transistor. It is the basis for modern nanoelectronic semiconductor device fabrication. Microchips utilizing FinFET gates first became commercialized in the first half of the 2010s, and became the dominant gate design at 14 nm, 10 nm and 7 nm process nodes. It is common for a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AI Accelerator
A neural processing unit (NPU), also known as AI accelerator or deep learning processor, is a class of specialized hardware accelerator or computer system designed to accelerate artificial intelligence (AI) and machine learning applications, including artificial neural networks and computer vision. Use Their purpose is either to efficiently execute already trained AI models (inference) or to train AI models. Their applications include algorithms for robotics, Internet of things, and data-intensive or sensor-driven tasks. They are often manycore designs and focus on low-precision arithmetic, novel dataflow architectures, or in-memory computing capability. , a typical AI integrated circuit chip contains tens of billions of MOSFETs. AI accelerators are used in mobile devices such as Apple iPhones and Huawei cellphones, and personal computers such as Intel laptops, AMD laptops and Apple silicon Macs. Accelerators are used in cloud computing servers, including tensor processi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed for digital image processing and to accelerate computer graphics, being present either as a discrete video card or embedded on motherboards, mobile phones, personal computers, workstations, and game consoles. GPUs were later found to be useful for non-graphic calculations involving embarrassingly parallel problems due to their parallel structure. The ability of GPUs to rapidly perform vast numbers of calculations has led to their adoption in diverse fields including artificial intelligence (AI) where they excel at handling data-intensive and computationally demanding tasks. Other non-graphical uses include the training of neural networks and cryptocurrency mining. History 1970s Arcade system boards have used specialized graphics circuits since the 1970s. In early video game hardware, RAM for frame buffers was expensive, so video chips composited data together as the display was being scann ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Apple A6
The Apple A6 is a 32-bit package on package (PoP) system on a chip (SoC) designed by Apple Inc., part of the Apple silicon series. It was introduced on September 12, 2012, at the launch of the iPhone 5. Apple states that it is up to twice as fast and has up to twice the graphics power compared with its predecessor, the Apple A5. Software updates for devices using this chip ceased in 2019, with the release of iOS 10.3.4 on the iPhone 5 as it was discontinued with the release of iOS 11 in 2017. Design The Apple A6 is said to use a 1.3 GHz custom Apple-designed ARMv7-A architecture based dual-core CPU, called Swift, rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX543MP3 graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4. Analysis suggests that the Swift core has a tri ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Superscalar Processor
A superscalar processor (or multiple-issue processor) is a CPU that implements a form of parallelism called instruction-level parallelism within a single processor. In contrast to a scalar processor, which can execute at most one single instruction per clock cycle, a superscalar processor can execute or start executing more than one instruction during a clock cycle by simultaneously dispatching multiple instructions to different execution units on the processor. It therefore allows more throughput (the number of instructions that can be executed in a unit of time which can even be less than 1) than would otherwise be possible at a given clock rate. Each execution unit is not a separate processor (or a core if the processor is a multi-core processor), but an execution resource within a single CPU such as an arithmetic logic unit. While a superscalar CPU is typically also pipelined, superscalar and pipelining execution are considered different performance enhancement techniq ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Out-of-order Execution
In computer engineering, out-of-order execution (or more formally dynamic execution) is an instruction scheduling paradigm used in high-performance central processing units to make use of instruction cycles that would otherwise be wasted. In this paradigm, a processor executes instructions in an order governed by the availability of input data and execution units, rather than by their original order in a program. In doing so, the processor can avoid being idle while waiting for the preceding instruction to complete and can, in the meantime, process the next instructions that are able to run immediately and independently. History Out-of-order execution is a restricted form of dataflow architecture, which was a major research area in computer architecture in the 1970s and early 1980s. Early use in supercomputers The first machine to use out-of-order execution was the CDC 6600 (1964), designed by James E. Thornton, which uses a scoreboard to avoid conflicts. It permits ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
