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ARM Cortex-X1
The ARM Cortex-X1 is a central processing unit implementing the ARMv8.2-A 64-bit instruction set designed by ARM Holdings' Austin design centre as part of ARM's Cortex-X Custom (CXC) program. Design The Cortex-X1 design is based on the ARM Cortex-A78, but redesigned for purely performance instead of a balance of performance, power, and area (PPA). The Cortex-X1 is a 5-wide decode out-of-order superscalar design with a 3K macro-OP (MOPs) cache. It can fetch 5 instructions and 8 MOPs per cycle, and rename and dispatch 8 MOPs, and 16 μOPs per cycle. The out-of-order window size has been increased to 224 entries. The backend has 15 execution ports with a pipeline depth of 13 stages and the execution latencies consists of 10 stages. It also features 4x128b SIMD units. ARM claims the Cortex-X1 offers 30% faster integer and 100% faster machine learning performance than the ARM Cortex-A77. The Cortex-X1 supports ARM's DynamIQ technology, expected to be used as high-performanc ...
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ARM Ltd
Arm Holdings plc (formerly an acronym for Advanced RISC Machines and originally Acorn RISC Machine) is a British semiconductor and software design company based in Cambridge, England, whose primary business is the design of central processing unit (CPU) cores that implement the ARM architecture family of instruction sets. It also designs other chips, provides software development tools under the DS-5, RealView and Keil brands, and provides systems and platforms, system-on-a-chip (SoC) infrastructure and software. As a "holding" company, it also holds shares of other companies. Since 2016, it has been majority owned by Japanese conglomerate SoftBank Group. While ARM CPUs first appeared in the Acorn Archimedes, a desktop computer, today's systems include mostly embedded systems, including ARM CPUs used in virtually all modern smartphones. Processors based on designs licensed from Arm, or designed by licensees of one of the ARM instruction set architectures, are used in all cl ...
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ARM DynamIQ
ARM big.LITTLE is a heterogeneous computing architecture developed by Arm Holdings, coupling relatively battery-saving and slower processor cores (''LITTLE'') with relatively more powerful and power-hungry ones (''big''). The intention is to create a multi-core processor that can adjust better to dynamic computing needs and use less power than clock scaling alone. ARM's marketing material promises up to a 75% savings in power usage for some activities. Most commonly, ARM big.LITTLE architectures are used to create a multi-processor system-on-chip (MPSoC). In October 2011, big.LITTLE was announced along with the Cortex-A7, which was designed to be architecturally compatible with the Cortex-A15. In October 2012 ARM announced the Cortex-A53 and Cortex-A57 (ARMv8-A) cores, which are also intercompatible to allow their use in a big.LITTLE chip. ARM later announced the Cortex-A12 at Computex 2013 followed by the Cortex-A17 in February 2014. Both the Cortex-A12 and the Cortex-A17 ...
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Ars Technica
''Ars Technica'' is a website covering news and opinions in technology, science, politics, and society, created by Ken Fisher and Jon Stokes in 1998. It publishes news, reviews, and guides on issues such as computer hardware and software, science, technology policy, and video games. ''Ars Technica'' was privately owned until May 2008, when it was sold to Condé Nast Digital, the online division of Condé Nast Publications. Condé Nast purchased the site, along with two others, for $25 million and added it to the company's ''Wired'' Digital group, which also includes '' Wired'' and, formerly, Reddit. The staff mostly works from home and has offices in Boston, Chicago, London, New York City, and San Francisco. The operations of ''Ars Technica'' are funded primarily by advertising, and it has offered a paid subscription service since 2001. History Ken Fisher, who serves as the website's current editor-in-chief, and Jon Stokes created ''Ars Technica'' in 1998. Its purpose was t ...
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Google Tensor
Google Tensor is a series of ARM64-based system-on-chip (SoC) processors designed by Google for its Pixel devices. It was originally conceptualized in 2016, following the introduction of the first Pixel smartphone, though actual developmental work did not enter full swing until 2020. The first-generation Tensor chip debuted on the Pixel 6 smartphone series in 2021, and was succeeded by the Tensor G2 chip in 2022, G3 in 2023 and G4 in 2024. Tensor has been generally well received by critics. Development Background Development on a Google-designed system-on-chip (SoC) first began in April 2016, after the introduction of the company's first Pixel smartphone, although Google CEO Sundar Pichai and hardware chief Rick Osterloh agreed it would likely take an extended period of time before the product was ready. The next year, the company's hardware division assembled a team of 76 semiconductor researchers specializing in artificial intelligence (AI) and machine learning (ML) ...
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List Of Qualcomm Snapdragon Processors
The Qualcomm Snapdragon suite of System on a chip, systems on chips (SoCs) are designed for use in smartphones, Tablet computer, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices. Before Snapdragon SoC made by Qualcomm before it was renamed to Qualcomm Snapdragon, Snapdragon. *MSM (Mobile Station Modem) *QSC (Qualcomm Single Chip) Snapdragon S series Snapdragon S1 Snapdragon S2 Snapdragon S3 Snapdragon S4 Snapdragon S4 was offered in three models: S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices. It was launched in 2012. The Snapdragon S4 were succeeded by the Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro). Snapdragon S4 Play Snapdragon S4 Plus Snapdragon S4 Pro and S4 Prime (2012) Snapdragon 2 series The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MS ...
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Exynos
The Samsung Exynos (stylized as SΛMSUNG Exynos), formerly Hummingbird (), is a series of ARM architecture, Arm-based System on a chip, system-on-chips developed by Samsung Electronics' System LSI division and manufactured by Samsung Foundry. It is a continuation of Samsung's earlier List of Samsung systems on a chip, S3C, S5L and S5P line of SoCs. The first debut of Samsung's indigenously developed SoC is Samsung Hummingbird (S5PC110/111), later renamed as Exynos 3 Single 3110. Samsung announce it on July 27, 2009. In 2011, Samsung announced Exynos 4 Dual 4210 that was later equipped on Samsung Galaxy S II. Since then, Samsung has used Exynos as a representative brand name of their SoC, based on Arm Cortex cores. In 2017, Samsung launched their proprietary Arm ISA-based customized core designs, codenamed "Exynos M". Exynos M series core made a debut with Exynos M1 nicknamed "Mongoose", which was used for Exynos 8 Octa 8890. The Exynos M-series have been implemented throughout t ...
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System On A Chip
A system on a chip (SoC) is an integrated circuit that combines most or all key components of a computer or Electronics, electronic system onto a single microchip. Typically, an SoC includes a central processing unit (CPU) with computer memory, memory, input/output, and computer data storage#Secondary storage, data storage control functions, along with optional features like a graphics processing unit (GPU), Wi-Fi connectivity, and radio frequency processing. This high level of integration minimizes the need for separate, discrete components, thereby enhancing Performance per watt, power efficiency and simplifying device design. High-performance SoCs are often paired with dedicated memory, such as LPDDR, and flash storage chips, such as Universal Flash Storage, eUFS or eMMC, which may be stacked directly on top of the SoC in a Package on a package, package-on-package (PoP) configuration or placed nearby on the motherboard. Some SoCs also operate alongside specialized chips, such ...
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Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is Semiconductor fabrication, fabricated. Typically, integrated circuits are produced in large batches on a single wafer (electronics), wafer of electronic-grade Monocrystalline silicon, silicon (EGS) or other semiconductor (such as Gallium arsenide, GaAs) through processes such as photolithography. The wafer is cut (wafer dicing, diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies,'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are integrated circuit packaging, packaged in List of electronic component packaging types, various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of Single crystal, monocrystalline sili ...
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Image Processor
An image processor, also known as an image processing engine, image processing unit (IPU), or image signal processor (ISP), is a type of media processor or specialized digital signal processor (DSP) used for image processing, in digital cameras or other devices. Image processors often employ parallel computing even with SIMD or MIMD technologies to increase speed and efficiency. The digital image processing engine can perform a range of tasks. To increase the system integration on embedded devices, often it is a system on a chip with multi-core processor architecture. Function Bayer transformation The photodiodes employed in an image sensor are color-blind by nature: they can only record shades of grey. To get color into the picture, they are covered with different color filters: red, green and blue ( RGB) according to the pattern designated by the Bayer filter. As each photodiode records the color information for exactly one pixel of the image, without an image processor ...
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Digital Signal Processor
A digital signal processor (DSP) is a specialized microprocessor chip, with its architecture optimized for the operational needs of digital signal processing. DSPs are fabricated on metal–oxide–semiconductor (MOS) integrated circuit chips. They are widely used in audio signal processing, telecommunications, digital image processing, radar, sonar and speech recognition systems, and in common consumer electronic devices such as mobile phones, disk drives and high-definition television (HDTV) products. The goal of a DSP is usually to measure, filter or compress continuous real-world analog signals. Most general-purpose microprocessors can also execute digital signal processing algorithms successfully, but may not be able to keep up with such processing continuously in real-time. Also, dedicated DSPs usually have better power efficiency, thus they are more suitable in portable devices such as mobile phones because of power consumption constraints. DSPs often use special m ...
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Display Controller
A video display controller (VDC), also called a display engine or display interface, is an integrated circuit which is the main component in a video-signal generator, a device responsible for the production of a TV video signal in a computing or game system. Some VDCs also generate an audio signal, but that is not their main function. VDCs were used in the home computers of the 1980s and also in some early video picture systems. The VDC is the main component of the video signal generator logic, responsible for generating the timing of video signals such as the horizontal and vertical synchronization signals and the blanking interval signal. Sometimes other supporting chips were necessary to build a complete system, such as RAM to hold pixel data, ROM to hold character fonts, or some discrete logic such as shift registers. Most often the VDC chip is completely integrated in the logic of the main computer system, (its video RAM appears in the memory map of the main CPU), ...
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