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65nm Process
The 65 nm process is an advanced lithographic node used in volume CMOS (MOSFET) semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25  nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm. Process node For comparison, cellular ribosomes are about 20 nm end-to-end. A crystal of bulk silicon has a lattice constant of 0.543 nm, so such transistors are on the order of 100 atoms across. By September 2007, Intel, AMD, IBM, UMC and Chartered were also producing 65 nm chips. While feature sizes may be drawn as 65 nm or less, the wavelengths of light used for lithography are 193 nm and 248 nm. Fabrication of sub-wavelength features requires special imaging technologies, such as optical proximity correction and phase-shifting masks. The cost of these techniques adds substantially to the cost of manufacturing sub-wavelength semiconductor products, with the ...
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Photolithography
Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a photoresist, being applied to the substrate. A photomask that contains the desired pattern is then placed over the photoresist. Light is shone through the photomask, exposing the photoresist in certain areas. The exposed areas undergo a chemical change, making them either soluble or insoluble in a developer solution. After development, the pattern is transferred onto the substrate through etching, chemical vapor deposition, or ion implantation processes. Ultraviolet, Ultraviolet (UV) light is typically used. Photolithography processes can be classified according to the type of light used, including ultraviolet lithography, deep ultraviolet lithography, extreme ultraviolet lithography, extreme ultraviolet lithography ...
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Quantum Tunneling
In physics, a quantum (: quanta) is the minimum amount of any physical entity (physical property) involved in an interaction. The fundamental notion that a property can be "quantized" is referred to as "the hypothesis of quantization". This means that the magnitude of the physical property can take on only discrete values consisting of integer multiples of one quantum. For example, a photon is a single quantum of light of a specific frequency (or of any other form of electromagnetic radiation). Similarly, the energy of an electron bound within an atom is quantized and can exist only in certain discrete values. Atoms and matter in general are stable because electrons can exist only at discrete energy levels within an atom. Quantization is one of the foundations of the much broader physics of quantum mechanics. Quantization of energy and its influence on how energy and matter interact (quantum electrodynamics) is part of the fundamental framework for understanding and describing ...
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Xeon
Xeon (; ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for error correction code (ECC) memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture (MCA). They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus, which replaced ...
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Pentium D
Pentium D is a range of desktop 64-bit x86-64 processors based on the NetBurst microarchitecture, which is the Multi-core processor, dual-core variant of the Pentium 4 manufactured by Intel. Each CPU comprised two cores. The brand's first processor, codenamed Smithfield and manufactured on the 90 nm process, was released on May 25, 2005, followed by the 65 nm Presler nine months later. The core implementation on the 90 nm Smithfield and later 65 nm Presler are designed differently but are functionally the same. The 90 nm Smithfield contains a single Die (integrated circuit), die, with two adjoined but functionally separate CPU cores cut from the same wafer (electronics), wafer. The later 65 nm Presler utilized a multi-chip module package, where two discrete dies each containing a single core reside on the CPU substrate. Neither the 90 nm Smithfield nor the 65 nm Presler were capable of direct core to core communication, relying instead on the Northbridge (computing), northbridge li ...
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Pentium 4
Pentium 4 is a series of single-core central processing unit, CPUs for Desktop computer, desktops, laptops and entry-level Server (computing), servers manufactured by Intel. The processors were shipped from November 20, 2000 until August 8, 2008. All Pentium 4 CPUs are based on the NetBurst microarchitecture, the successor to the P6 (microarchitecture), P6. The Pentium 4 #Willamette, Willamette (180 nm) introduced SSE2, while the #Prescott, Prescott (90 nm) introduced SSE3 and later 64-bit technology. Later versions introduced Hyper-threading, Hyper-Threading Technology (HTT). The first Pentium 4-branded processor to implement x86-64, 64-bit was the Prescott (90 nm) (February 2004), but this feature was not enabled. Intel subsequently began selling 64-bit Pentium 4s using the ''"E0" revision'' of the Prescotts, being sold on the OEM market as the Pentium 4, model F. The E0 revision also adds eXecute Disable (XD) (Intel's name for the NX bit) to Intel 64. Int ...
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Intel Core
Intel Core is a line of multi-core (with the exception of Core Solo and Core 2 Solo) central processing units (CPUs) for midrange, embedded, workstation, high-end and enthusiast computer markets marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets. Core was launched in January 2006 as a mobile-only series, consisting of single- and dual-core models. It was then succeeded later in July by the Core 2 series, which included both desktop and mobile processors with up to four cores, and introduced 64-bit support. Since 2008, Intel began introducing the Core i3, Core i5, Core i7 and Core i9 lineup of processors, succeeding Core 2. A new naming scheme debuted in 2023, consisting of Core 3, Core 5, and Core 7 for mainstream processo ...
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PStwo
The PlayStation 2 (PS2) is a home video game console developed and marketed by Sony Computer Entertainment. It was first released in Japan on 4 March 2000, in North America on 26 October, in Europe on 24 November, in Australia on 30 November, and other regions thereafter. It is the successor to the original PlayStation, as well as the second instalment in the PlayStation brand of consoles. As a sixth-generation console, it competed with Nintendo's GameCube, Sega's Dreamcast, and Microsoft's Xbox. Announced in 1999, Sony began developing the console after the immense success of its predecessor. In addition to serving as a game console, it features a built-in DVD drive and was priced competitively with standalone DVD players of the time, enhancing its value. Full backward compatibility with original PlayStation games and accessories gave it access to a vast launch library, far surpassing those of its competitors. The console's hardware was also notable for its custom-built Emo ...
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PlayStation 2 Technical Specifications
The PlayStation 2 technical specifications describe the various components of the PlayStation 2 (PS2) video game console. Overview The sixth-generation hardware of the PlayStation 2 video game console consists of various components. At the heart of the console's configuration is its central processing unit (CPU), a custom RISC processor known as the Emotion Engine which operates at 294.912 MHz (299 MHz in later consoles). The CPU heavily relies on its integration with two vector processing units, known as VPU0 and VPU1, the Graphics Synthesizer, and a floating-point unit (FPU) in order to render 3D graphics. Other components, such as the system's DVD-ROM optical drive and DualShock 2 controller, provide the software and user control input. PlayStation 2 software is distributed on CD-ROM and DVD-ROM. In addition, the console can play audio CDs and DVD movies, and is backwards compatible with original PlayStation games. This is accomplished through the inclusion of ...
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Emotion Engine
The Emotion Engine is a central processing unit developed and manufactured by Sony Computer Entertainment and Toshiba for use in the PlayStation 2 video game console. It was also used in early PlayStation 3 models sold in Japan and North America (Model Numbers CECHAxx & CECHBxx) to provide PlayStation 2 game support. Mass production of the Emotion Engine began in 1999 and ended in late 2012 with the discontinuation of the PlayStation 2. Description The Emotion Engine consists of eight separate "units", each performing a specific task, integrated onto the same die. These units are: a CPU core, two Vector Processing Units (VPU), a 10-channel DMA unit, a memory controller, and an Image Processing Unit (IPU). There are three interfaces: an input output interface to the I/O processor, a graphics interface (GIF) to the graphics synthesizer, and a memory interface to the system memory. The CPU core is tightly coupled to the first VPU, VPU0. Together, they are responsible for e ...
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Nickel Silicide
Nickel silicides include several intermetallic compounds of nickel and silicon. Nickel silicides are important in microelectronics as they form at junctions of nickel and silicon. Additionally thin layers of nickel silicides may have application in imparting surface resistance to nickel alloys. Compounds Nickel silicides include Ni3Si, Ni31Si12, Ni2Si, Ni3Si2, NiSi and NiSi2. Ni31Si12, Ni2Si, and Nickel monosilicide, NiSi have congruent melting points; the others form via a peritectic transformation. The silicides can be made via fusion or solid state reaction between the elements, diffusion at a junction of the two elements, and other methods including ion beam mixing. Properties Nickel silicides are generally chemically and thermally stable. They have low electrical resistivity; with NiSi 10.5–18 μΩ·cm, Ni2Si 24–30 μΩ·cm, NiSi2 34–50 μΩ·cm; nickel-rich silicides have higher resistivity rising to 90–150 μΩ·cm in Ni31Si12. Uses Microelectronics Nickel silic ...
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Low-κ Dielectric
In semiconductor manufacturing, a low-κ is a material with a small relative dielectric constant (κ, kappa) relative to silicon dioxide. Low-κ dielectric material implementation is one of several strategies used to allow continued scaling of microelectronic devices, colloquially referred to as extending Moore's law. In digital circuits, insulating dielectrics separate the conducting parts (wire interconnects and transistors) from one another. As components have scaled and transistors have gotten closer together, the insulating dielectrics have thinned to the point where charge build up and crosstalk adversely affect the performance of the device. Replacing the silicon dioxide with a low-κ dielectric of the same thickness reduces parasitic capacitance, enabling faster switching speeds (in case of synchronous circuits) and lower heat dissipation. In conversation such materials may be referred to as "low-k" (spoken "low-kay") rather than "low-κ" (low-kappa). Low-κ materials ...
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Cu Interconnect
Copper interconnects are used in integrated circuits to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with better performance. They were first introduced by IBM, with assistance from Motorola, in 1997. The transition from aluminium to copper required significant developments in fabrication techniques, including radically different methods for patterning the metal as well as the introduction of barrier metal layers to isolate the silicon from potentially damaging copper atoms. Although the methods of superconformal copper electrodepostion were known since late 1960, their application at the (sub)micron via scale (e.g. in microchips) started only in 1988-1995 (see figure). By year 2002 it became a mature technology, and research and development effor ...
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