This is a list of

Qualcomm Snapdragon Snapdragon is a suite of system on a chip (SoC) semiconductor products for mobile devices designed and marketed by Qualcomm Technologies Inc. The Snapdragon's central processing unit (CPU) uses the ARM architecture. A single SoC may include mu ...

systems on chips (SoC) made by

Qualcomm Qualcomm () is an American multinational corporation headquartered in San Diego, California, and incorporated in Delaware. It creates semiconductors, software, and services related to wireless technology. It owns patents critical to the 5G, 4 ...

for use in

smartphone A smartphone is a portable computer device that combines mobile telephone and computing functions into one unit. They are distinguished from feature phones by their stronger hardware capabilities and extensive mobile operating systems, whic ...

s, tablets,

laptop A laptop, laptop computer, or notebook computer is a small, portable personal computer (PC) with a screen and alphanumeric keyboard. Laptops typically have a clam shell form factor with the screen mounted on the inside of the upper li ...

2-in-1 PC A 2-in-1 PC, also known as convertible laptop, 2-in-1 tablet, 2-in-1 laptop, 2-in-1 detachable, laplet, tabtop, laptop tablet, or simply 2-in-1, is a portable computer that has features of both tablets and laptops. Before the emergence of ''2- ...

smartwatch A smartwatch is a wearable computer in the form of a watch; modern smartwatches provide a local touchscreen interface for daily use, while an associated smartphone app provides management and telemetry, such as long-term biomonitoring. While ea ...

es, and

smartbook A smartbook was a class of mobile device that combined certain features of both a smartphone and netbook computer, produced between 2009 and 2010. Smartbooks were advertised with features such as always on, all-day battery life, 3G, or Wi-Fi conn ...

s devices.

Before Snapdragon

SoC made by Qualcomm before it was renamed to Snapdragon.

Snapdragon S series

Snapdragon S1

Snapdragon S1 notable features over its predecessor (MSM7xxx): * CPU features ** 1 core up to 1 GHz

Scorpion Scorpions are predatory arachnids of the order Scorpiones. They have eight legs, and are easily recognized by a pair of grasping pincers and a narrow, segmented tail, often carried in a characteristic forward curve over the back and always end ...

Cortex-A5 The ARM Cortex-A5 is a 32-bit processor core licensed by ARM Holdings implementing the ARMv7-A architecture announced in 2009. Overview The Cortex-A5 is intended to replace the ARM9 and ARM11 cores for use in low-end devices. The Cortex-A5 off ...

ARM11 ARM11 is a group of 32-bit RISC ARM processor cores licensed by ARM Holdings. The ARM11 core family consists of ARM1136J(F)-S, ARM1156T2(F)-S, ARM1176JZ(F)-S, and ARM11MPCore. Since ARM11 cores were released from 2002 to 2005, they are no lon ...

** Up to 256K

L2 cache A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which ...

** Up to 32K+32K L1 cache *

GPU A graphics processing unit (GPU) is a specialized electronic circuit designed to manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device. GPUs are used in embedded systems, mobi ...

features **

Adreno Adreno is a series of graphics processing unit (GPU) semiconductor intellectual property cores developed by Qualcomm and used in many of their SoCs. History Adreno (an anagram of AMD's graphic card brand '' Radeon''), was originally developed ...

200 (From Software rendered or

130) ***

OpenGL ES OpenGL for Embedded Systems (OpenGL ES or GLES) is a subset of the OpenGL computer graphics rendering application programming interface (API) for rendering 2D and 3D computer graphics such as those used by video games, typically hardware-accel ...

1.1 ***

OpenVG OpenVG is an API designed for hardware-accelerated 2D vector graphics. Its primary platforms are mobile phones, gaming & media consoles and consumer electronic devices. It was designed to help manufacturers create more attractive user interfaces ...

1.0 ***

Direct3D Mobile Direct3D is a graphics application programming interface (API) for Microsoft Windows. Part of DirectX, Direct3D is used to render three-dimensional graphics in applications where performance is important, such as games. Direct3D uses hardwa ...

***

Unified shader model In the field of 3D computer graphics, the unified shader model (known in Direct3D 10 as " Shader Model 4.0") refers to a form of shader hardware in a graphical processing unit (GPU) where all of the shader stages in the rendering pipeline (geome ...

5-way

VLIW Very long instruction word (VLIW) refers to instruction set architectures designed to exploit instruction level parallelism (ILP). Whereas conventional central processing units (CPU, processor) mostly allow programs to specify instructions to exe ...

DSP DSP may refer to: Computing * Digital signal processing, the mathematical manipulation of an information signal * Digital signal processor, a microprocessor designed for digital signal processing * Yamaha DSP-1, a proprietary digital signal ...

features **

Hexagon In geometry, a hexagon (from Ancient Greek, Greek , , meaning "six", and , , meaning "corner, angle") is a six-sided polygon. The total of the internal angles of any simple polygon, simple (non-self-intersecting) hexagon is 720°. Regular hexa ...

QDSP5 at 350 MHz or

QDSP6 600 MHz *

ISP An Internet service provider (ISP) is an organization that provides services for accessing, using, or participating in the Internet. ISPs can be organized in various forms, such as commercial, community-owned, non-profit, or otherwise private ...

features ** Up to 12 MP camera *

Modem A modulator-demodulator or modem is a computer hardware device that converts data from a digital format into a format suitable for an analog transmission medium such as telephone or radio. A modem transmits data by Modulation#Digital modulati ...

and

wireless Wireless communication (or just wireless, when the context allows) is the transfer of information between two or more points without the use of an electrical conductor, optical fiber or other continuous guided medium for the transfer. The most ...

features ** External

Bluetooth Bluetooth is a short-range wireless technology standard that is used for exchanging data between fixed and mobile devices over short distances and building personal area networks (PANs). In the most widely used mode, transmission power is limi ...

4.0 or external

2.0/2.1 on some models * 45 or 65 nm manufacturing technology

Snapdragon S2

Snapdragon S2 notable features over its predecessor (Snapdragon S1): * CPU feature ** 1 core up to 1.5 GHz

ARMv7 ARM (stylised in lowercase as arm, formerly an acronym for Advanced RISC Machines and originally Acorn RISC Machine) is a family of reduced instruction set computer (RISC) instruction set architectures for computer processors, configured ...

(From ARMv6 on some model) ** Up to 384K L2 *

features **

205 (From Software rendered or

200) *** Up to 266 MHz ***Up to 2 times faster than

200 ***Up to x2 relative performance on

OpenGL ES 2.0 OpenGL for Embedded Systems (OpenGL ES or GLES) is a subset of the OpenGL computer graphics rendering application programming interface (API) for rendering 2D and 3D computer graphics such as those used by video games, typically hardware-acce ...

from

200 ***Up to XGA ***

2.0 ***SVGT 1.2 ***OpenVG 1.1 ***Direct Draw ***GDI ***Concurrent CPU, DSP, graphics and MDP *Memory features **Up to

LPDDR2 Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power and is targeted for mobile computers and devices such as mobile phones. Older variants are also known a ...

32 bit Dual-channel 333 MHz (5.3 GB/s) *

features **

QDSP5 at 256 MHz *45 nm manufacturing technology *904 pins

Snapdragon S3

Snapdragon S3 notable features over its predecessor (Snapdragon S2): * CPU feature ** 2 cores up to 1.7 GHz

** 512KB L2 *

features **

220 *** Up to 4 time faster than

200 ***Up to x5 relative performance on

from

200 ***EGL 1.3 (From 1.2) ***2x Larger L2 cache (512 KB from 256 KB) ***Up to WXGA+ *

features **

QDSP6 at 400 MHz (From

QDSP5 at 256 MHz) *

features **Up to 16 MP camera (From 12 MP) *45 nm manufacturing technology

Snapdragon S4

Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices. It was launched in 2012. The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro) Snapdragon S4 Play Snapdragon S4 Plus Snapdragon S4 plus notable features over its predecessor (Snapdragon S3): * CPU features **2 cores up to 1.7 GHz

Krait ''Bungarus'' is a genus of venomous elapid snakes, the kraits ("krait" is pronounced , rhyming with "kite"), found in South and Southeast Asia. The genus ''Bungarus'' has 16 species. Distribution Kraits are found in tropical Asia, from near Ira ...

200 **4+4 KB L0, 16+16 KB L1, 1 MB L2 **Out of Order Execution (From Partial Out of Order Execution on

) *

features **

225 ***Up to

1080p 1080p (1920×1080 progressively displayed pixels; also known as Full HD or FHD, and BT.709) is a set of HDTV high-definition video modes characterized by 1,920 pixels displayed across the screen horizontally and 1,080 pixels down the screen vert ...

screen ***Up to 6 time faster than

200 ***Up to 32 ALU ***Direct3D feature level 9.0 (From 9.0) ***Up to x7.5 relative performance on OpenGL ES 2.0 from

200 **

305 ***Up to 1080p screen (on 400 MHz) ***Up to 720p screen (on 320 MHz) ***Up to 24 ALU (From 32 on S3) ***

Scalar instruction set (From

5-way

) ***Up to x8 relative performance on

from

200 *

features **Up to 20 MP or 13.5 MP camera *

features **

QDSP6 *

and

features **Integrated

4.0 **IZat Gen8A (From IZat Gen 7) *28 nm manufacturing technology Snapdragon S4 Pro and Snapdragon S4 Prime (2012) Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play): * CPU features **up to 2 cores up to 1.7 GHz

300 on to Snapdragon S4 Pro **up to 4 cores up to 1.5 GHz

300 on to Snapdragon S4 Prime **4+4 KB L0, 16+16 KB L1, 1 MB L2 *

features **

320 ***Support

3.0 ***Up to 1080p screen ***Up to 64 ALU (From 32 on S4 plus) ***Up to x23 relative performance on

from

200 *

features **

QDSP6 *

features ** Up to 20 MP camera *

and

features **LTE FDD/TDD Cat 3 or external on some models * 28 nm LP manufacturing technology *Up to

eMMC The MultiMediaCard, officially abbreviated as MMC, is a memory card standard used for solid-state storage. Unveiled in 1997 by SanDisk and Siemens, MMC is based on a surface-contact low pin-count serial interface using a single memory stack subs ...

4.4/4.4.1

Snapdragon 2 Series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 (2013)

Qualcomm 205, Snapdragon 208, 210 and 212 (2014–17)

The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.
The Snapdragon 212 was announced on July 28, 2015.
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.

Qualcomm 215 (2019)

The Qualcomm 215 was announced on July 9, 2019. It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.

Snapdragon 4 Series

The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.

Snapdragon 400 (2013)

Snapdragon 410, 412 and 415 (2014/15)

The Snapdragon 410 was announced on December 9, 2013. It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China by SMIC.
The Snapdragon 412 was announced on July 28, 2015.
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.

Snapdragon 425, 427, 430 and 435 (2015/16)

Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.
The Snapdragon 427 was announced on October 18, 2016.

Snapdragon 429, 439 and 450 (2017/18)

The Snapdragon 450 was announced on June 28, 2017. Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018. Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.

Snapdragon 460 (2020)

The Snapdragon 460 was announced on 20 January 2020, with

NavIC The Indian Regional Navigation Satellite System (IRNSS), with an operational name of NavIC (acronym for 'Navigation with Indian Constellation; also, 'sailor' or 'navigator' in Indian languages), is an autonomous regional satellite navigation s ...

support. It is the first Snapdragon 400 model to incorporate the

Kryo Qualcomm Kryo is a series of custom or semi-custom ARM-based CPUs included in the Snapdragon line of SoCs. These CPUs implement the ARM 64-bit instruction set and serve as the successor to the previous 32-bit Krait CPUs. It was first introduced i ...

architecture.

Snapdragon 480/480+ 5G (2021)

The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.
The Snapdragon 480+ was announced on October 26, 2021.

Snapdragon 4 Gen 1 (2022)

The Snapdragon 4 Gen 1 was announced on September 6, 2022.

Snapdragon 6 Series

The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.

Snapdragon 600 (2013)

The Snapdragon 600 was announced on January 8, 2013. Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro. * Display Controller: MDP 4. 2 RGB planes, 2 VIG planes, 1080p

Snapdragon 610, 615 and 616 (2014/15)

The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model. *Hardware HEVC/H.265 decode acceleration The Snapdragon 616 was announced on July 31, 2015.

Snapdragon 617, 625 and 626 (2015/16)

The Snapdragon 617 was announced on September 15, 2015.
The Snapdragon 625 was announced on February 11, 2016.
The Snapdragon 626 was announced on October 18, 2016. Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.

Snapdragon 650 (618), 652 (620) and 653 (2015/16)

The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015. They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.
The Snapdragon 653 was announced on October 18, 2016.

Snapdragon 630, 636 and 660 (2017)

Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017.
The Snapdragon 636 was announced on October 17, 2017.

Snapdragon 632 and 670 (2018)

The Snapdragon 632 was announced on June 26, 2018. Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018. Pin and software compatible with Snapdragon 710.

Snapdragon 662, 665, 675 and 678 (2019/20)

The Snapdragon 675 was announced on October 22, 2018.
The Snapdragon 665 was announced on April 9, 2019.
The Snapdragon 662 was announced on January 20, 2020, with

support.
The Snapdragon 678 was announced on December 15, 2020.

Snapdragon 680 4G, 690 5G and 695 5G (2020/21)

The Snapdragon 690 was announced on June 16, 2020, and is the first midrange SoC by Qualcomm to support 5G connectivity.
The Snapdragon 680 and 695 were announced on October 26, 2021.

Snapdragon 6 Gen 1 (2022)

The Snapdragon 6 Gen 1 was announced on September 6, 2022.

Snapdragon 7 Series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.

Snapdragon 710 and 712 (2018/19)

The Snapdragon 710 was announced on May 23, 2018. Pin and software compatible with Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.

Snapdragon 720G/730/730G/732G (2019/20)

The Snapdragon 730 and 730G were announced on April 9, 2019.
The Snapdragon 720G was announced on January 20, 2020.
The Snapdragon 732G was announced on August 31, 2020.

Snapdragon 750G and 765/765G/768G 5G (2020)

The Snapdragon 765 and 765G were announced on December 4, 2019 as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via the

Play Store Google Play, also known as the Google Play Store and formerly the Android Market, is a digital distribution service operated and developed by Google. It serves as the official app store for certified devices running on the Android operating syst ...

.
The Snapdragon 768G was announced on May 10, 2020.
The Snapdragon 750G was announced on September 22, 2020.

Snapdragon 778G/778G+, 780G and 782G 5G (2021/22)

The Snapdragon 780G was announced on March 25, 2021.
The Snapdragon 778G was announced on May 19, 2021.
The Snapdragon 778G+ was announced on October 26, 2021.
The Snapdragon 782G was announced on November 22, 2022.

Snapdragon 7 Gen 1 (2022)

The Snapdragon 7 Gen 1 was announced on May 20, 2022.

Snapdragon 8 Series

The Snapdragon 8 Series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800, 801 and 805 (2013/14)

The Snapdragon 800 was announced on January 8, 2013. * CPU features **4 cores up to 2.36 GHz

400 **4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache *

features **Adreno 330

***Up to 128 ALU (From 96 on

320) ***Up to 1024 KB On-chip graphics memory (From 512 KB on

320) ***Up to x30 relative performance on

from

200 ***Support

3.0 (Over 2.0 Adreno

225) ***

Scalar instruction set (from

5-way

on 2xx Adreno series) *

features **

H.264 Advanced Video Coding (AVC), also referred to as H.264 or MPEG-4 Part 10, is a video compression standard based on block-oriented, motion-compensated coding. It is by far the most commonly used format for the recording, compression, and distr ...

, VP8 UHD/30fps encoding/decoding (From 1080p60) *

features **Up to 21 megapixel, stereoscopic 3D 24dual image signal processor (supports HDRI) **Throughput: 0.64 GP/sec **Up to 320 MHz *

and

features **Wi-Fi 802.11ac wave 1 support **Gobi 4G ( LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s), on some models * SOC features **

4.5 support ** USB 2.0 and 3.0 ** Qualcomm Quick Charge 2.0 **28 nm HPm (From 28 nm HP) **Up to 1 billion transistors **Die size: 118mm² The Snapdragon 801 was announced on February 24, 2014.
Notable features: * CPU features **4 cores up to 2.45 GHz

400 *

features **

H.265 H is the eighth letter of the Latin alphabet. H may also refer to: Musical symbols * H number, Harry Halbreich reference mechanism for music by Honegger and Martinů * H, B (musical note) * H, B major People * H. (noble) (died after 12 ...

HD/30fps software decoding *

features **Throughput: 1.0 GP/sec (From 0.64 GP/sec on S800) **Up to 465 MHz (From 320 MHz on S800) *

5.0 support (Up to 400MB/s) *DSDA The Snapdragon 805 was announced on November 20, 2013. * CPU features **4 cores up to 2.7 GHz

450 **Up to 128-bit wide LPDDR3 memory interface *

features **Adreno 420

*** Up to 128 ALU ***Hardware dynamic

tessellation A tessellation or tiling is the covering of a surface, often a plane (mathematics), plane, using one or more geometric shapes, called ''tiles'', with no overlaps and no gaps. In mathematics, tessellation can be generalized to high-dimensional ...

support ***Support for hull, domain and geometry shaders ***Update with new dedicated connection to the memory controller(From shared bus with the video decoder and ISP) ***Up to 40% increase performance in shader hardware ***1.5x larger L2 cache (1536 KB from 1024 KB) ***Better

anisotropic filtering In 3D computer graphics, anisotropic filtering (abbreviated AF) is a method of enhancing the image quality of textures on surfaces of computer graphics that are at oblique viewing angles with respect to the camera where the projection of the t ...

support ***Larger texture cache ***Full support Direct3D Feature Level 11_2 and OpenCL 1.2 *

features **Improve

support : UHD/30fps hardware decoding **1080p 120fps encoding and decoding *

features **Up to 55 megapixel **Throughput: 1.0 GP/sec (From 0.64 GP/sec on SD800) *

and

features **External modem

Snapdragon 808 and 810 (2015)

The Snapdragon 808 and 810 were announced on April 7, 2014. Snapdragon 808 notable features over its predecessor (805): * CPU features **

ARMv8-A ARM (stylised in lowercase as arm, formerly an acronym for Advanced RISC Machines and originally Acorn RISC Machine) is a family of reduced instruction set computer (RISC) instruction set architectures for computer processors, configured ...

64-bit architecture (with Global Task Scheduling) **2 + 4 cores (1.82 GHz

Cortex-A57 The ARM Cortex-A57 is a central processing unit implementing the ARMv8-A 64-bit instruction set designed by ARM Holdings. The Cortex-A57 is an out-of-order superscalar pipeline. It is available as SIP core to licensees, and its design makes ...

+ 1.44 GHz

Cortex-A53 The ARM Cortex-A53 is one of the first two central processing units implementing the ARMv8-A 64-bit instruction set designed by ARM Holdings' Cambridge design centre. The Cortex-A53 is a 2-wide decode superscalar processor, capable of dual-iss ...

) **Up to 48KB Data + 32KB Instr. L1 cache (From 16 KB + 16 KB) *

features ** Up to 128 ALU **

418

with support for Vulkan 1.0 **Support

3.1 **Full support

Direct3D Direct3D is a graphics application programming interface (API) for Microsoft Windows. Part of DirectX, Direct3D is used to render three-dimensional graphics in applications where performance is important, such as games. Direct3D uses hardware a ...

Feature Level 11_2 and OpenCL 1.2 *

features **

V56

features ** 12-bit dual-ISP up to 21 MP * SOC features **2 billion transistor Snapdragon 810 notable features over its lower end (808): * CPU features **4 + 4 cores (2.0 GHz

+ 1.5 GHz

) *

features **

430

with support for Vulkan 1.0 **Full support

Feature Level 11_2 and

OpenCL OpenCL (Open Computing Language) is a framework for writing programs that execute across heterogeneous platforms consisting of central processing units (CPUs), graphics processing units (GPUs), digital signal processors (DSPs), field-progra ...

1.2 ** 4K main display support **Up to 256 ALU (From 128 on

330) *

features **14-bit dual-ISP up to 55 MP **Throughput: 1.2 GP/sec (From 1.0 GP/sec on SD805) **ISP is clocked at 600 MHz *

features **

UHD/30fps encoding and decoding *

and

features **Snapdragon X10 LTE modem *** Cat 9: download up to 450 Mbit/s ***Upload up to 50 Mbit/s **Bluetooth 4.1 * SOC features **20 nm manufacturing technology **2.5 billion transistor

Snapdragon 820 and 821 (2016)

The Snapdragon 820 was announced at the

Mobile World Congress MWC Barcelona (formerly but still commonly referred to as Mobile World Congress) is an annual trade show organised by GSMA, dedicated primarily to the mobile communications industry. The event is held in Barcelona, Catalonia, Spain at the Fir ...

in March 2015, with the first phones featuring the SoC released in early 2016.First Snapdragon 820 powered smartphone announced at CES
– Qualcomm.com, January 5, 2016 The Snapdragon 821 was announced in July 2016.Snapdragon 821 builds on 820 processor success
– Qualcomm.com, July 11, 2016 The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820. Notable features over its predecessor (Snapdragon 808 and 810): * CPU features **Custom

quad-core CPU **Per Core : L1: 32+32 KB, L2: 2 MB + 1 MB **L3 cache shared between CPU cluster *

features **

530

with support for Vulkan 1.0 **Less L2 GPU cache (1024 KB from 1536 KB) **

DirectX 12 Microsoft DirectX is a collection of application programming interfaces (APIs) for handling tasks related to multimedia, especially game programming and video, on Microsoft platforms. Originally, the names of these APIs all began with "Direct" ...

2.0,

3.2 *

features **

680

1st generation "AI engine" ***Down to 2-3 time power consumption (From SD808) ***New low power island (LPI) for sensor aware apps ***Hexagon Vector eXtensions **All-Ways Aware Hub low power island **Neural Processing Engine ( NPE) **

Halide In chemistry, a halide (rarely halogenide) is a binary chemical compound, of which one part is a halogen atom and the other part is an element or radical that is less electronegative (or more electropositive) than the halogen, to make a fluor ...

and

TensorFlow TensorFlow is a free and open-source software library for machine learning and artificial intelligence. It can be used across a range of tasks but has a particular focus on training and inference of deep neural networks. "It is machine learnin ...

support **H.264, H.265 UHD/30fps

encoding In communications and information processing, code is a system of rules to convert information—such as a letter, word, sound, image, or gesture—into another form, sometimes shortened or secret, for communication through a communication ...

10-bit,

VP9 VP9 is an open and royalty-free video coding format developed by Google. VP9 is the successor to VP8 and competes mainly with MPEG's High Efficiency Video Coding (HEVC/H.265). At first, VP9 was mainly used on Google's video platform YouTube. ...

UHD/60fps decoding *

features ** Qualcomm Spectra ISP with Dual 14-bit ISPs ** 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL ** Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS ** Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS ** Throughput: 1.2GP/sec (Same as 810) *

and

features **Snapdragon X12 LTE modem ***Download: Cat 12 (up to 600 Mbit/s), 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C ***Upload: Cat 13 (up to 150 Mbit/s), 2x20 MHz CA; 64-QAM ***Support MIMO 4×4 ** 802.11a/b/g/n/ac

Wi-Fi Wi-Fi () is a family of wireless network protocols, based on the IEEE 802.11 family of standards, which are commonly used for local area networking of devices and Internet access, allowing nearby digital devices to exchange data by radio wave ...

connectivity ** Wi-Fi ad support with external chip * SOC features **

14 nm The 14 nm process refers to the MOSFET technology node that is the successor to the 22nm (or 20nm) node. The 14nm was so named by the International Technology Roadmap for Semiconductors (ITRS). Until about 2011, the node following 22nm was expe ...

FinFET A fin field-effect transistor (FinFET) is a multigate device, a MOSFET (metal-oxide-semiconductor field-effect transistor) built on a substrate where the gate is placed on two, three, or four sides of the channel or wrapped around the channel, f ...

process **

5.1/ UFS 2.0 **

Quick Charge Quick Charge (QC) is a proprietary battery charging protocol developed by Qualcomm, used for managing power delivered over USB, mainly by communicating to the power supply and negotiating a voltage. Quick Charge is supported by devices such as ...

3.0 **2.0 billion transistors **Max 8 GB

LPDDR4 Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power and is targeted for mobile computers and devices such as mobile phones. Older variants are also known as ...

Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) The Snapdragon 821 was announced on August 16, 2016. Notable features over its predecessor (Snapdragon 820): * CPU features ** Faster CPU (+10%) *

features ** Faster GPU 650Mhz from 624 (+5%) ** Snapdragon VR-SDK. *

features ** Support Dual PD (PDAF). ** Extended laser Auto-focus.

Snapdragon 835 (2017)

The Snapdragon 835 was announced on November 17, 2016. Notable features over its predecessor (821). * CPU features **Samsung 10nm FinFET Low-Power Early fabrication, 3 billion transistors **4 Kryo 280 Gold (

ARM In human anatomy, the arm refers to the upper limb in common usage, although academically the term specifically means the upper arm between the glenohumeral joint (shoulder joint) and the elbow joint. The distal part of the upper limb between th ...

Cortex-A73 The ARM Cortex-A73 is a central processing unit implementing the ARMv8-A 64-bit instruction set designed by ARM Holdings' Sophia design centre. The Cortex-A73 is a 2-wide decode out-of-order superscalar pipeline. The Cortex-A73 serves as the ...

based) ***L1 cache: 64 kB + 64 kB ***L2 cache: 2 MB ** 4 Kryo 280 Silver (

based) **

LPDDR4X Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power and is targeted for mobile computers and devices such as mobile phones. Older variants are also known as ...

in dual-channel mode, up to 1866 MHz *

features **

540 graphics with support for

Vulkan Vulkan is a low- overhead, cross-platform API, open standard for 3D graphics and computing. Vulkan targets high-performance real-time 3D graphics applications, such as video games and interactive media. Vulkan is intended to offer higher perfor ...

1.1,

DirectX Microsoft DirectX is a collection of application programming interfaces (APIs) for handling tasks related to multimedia, especially game programming and video, on Microsoft platforms. Originally, the names of these APIs all began with "Direct", ...

12 (Feature level 12_1),

2.0 and

3.2 **Quad-Core GPU @ 710/670 MHz with 384 ALUs, 16 TMUs and 12 ROPs **@ 710 MHz: 727.04 GFLOPs, 11.36 GTexels/s and 8.52 GPixels/s **@ 670 MHz: 686.08 GFLOPs, 10.72 GTexels/s and 8.04 GPixels/s **Qualcomm Q-Sync (Variable Refresh Rate) and Adreno Foveation (Foveated Rendering) *

features **

682

2nd generation "AI engine" **Hexagon Vector eXtensions **All-Ways Aware Hub low power island **Neural Processing Engine ( NPE) **

and

support **

UHD/30fps encoding and UHD/60fps 10-bit decoding **

High-dynamic-range video High-dynamic-range television (HDR or HDR-TV) is a technology that improves the quality of display signals. It is contrasted with the retroactively-named standard dynamic range (SDR). HDR changes the way the luminance and colors of videos and ...

support(

HDR10 HDR10 Media Profile, more commonly known as HDR10, is an open high-dynamic-range video (HDR) standard announced on 27 August 2015 by the Consumer Technology Association. It is the most widespread of the HDR formats. HDR10 is not backward compati ...

)/Ultra HD Premium (only Decoding) **DSD and 32-bit/384 kHz PCM audio support with WCD9341 codec * ISP features: **

Qualcomm Spectra Qualcomm () is an American multinational corporation headquartered in San Diego, California, and Delaware General Corporation Law, incorporated in Delaware. It creates semiconductors, software, and services related to wireless technology. It ow ...

180 ISP with Dual 14-bit ISPs ** Single Camera, 30fps: Up to 32 MP ** 32 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 16 MP Dual Camera with ZSL ** Video Capture: Up to 4K Ultra HD video capture @ 30FPS ** Video Playback: Up to 4K Ultra HD video playback ** Codec Support: H.265 (

HEVC High Efficiency Video Coding (HEVC), also known as H.265 and MPEG-H Part 2, is a video compression standard designed as part of the MPEG-H project as a successor to the widely used Advanced Video Coding (AVC, H.264, or MPEG-4 Part 10). In compari ...

), H.264 (AVC),

and

features **Snapdragon X16 LTE modem ***Downlink: LTE Cat 16 up to 1 Gbit/s, 4x20 MHz carrier aggregation, up to 256-QAM ***Uplink: LTE Cat 13 up to 150 Mbit/s, Qualcomm® Snapdragon Upload+ (2x20 MHz carrier aggregation, up to 64-QAM, uplink data compression) ** 802.11a/b/g/n/ac/ad

connectivity **

5.0 (From

4.1) * SOC features **10 nm

LPE (Samsung) **Die size: 72.3mm² **3 billion Transistors ** UFS 2.1, SD 3.0 (UHS-I) **

DisplayPort DisplayPort (DP) is a digital display interface developed by a consortium of PC and chip manufacturers and standardized by the Video Electronics Standards Association (VESA). It is primarily used to connect a video source to a display device su ...

HDMI High-Definition Multimedia Interface (HDMI) is a proprietary audio/video interface for transmitting uncompressed video data and compressed or uncompressed digital audio data from an HDMI-compliant source device, such as a display controller, ...

2.0,

USB Type-C USB-C (properly known as USB Type-C) is a 24-pin USB connector system with a rotationally symmetrical connector. The designation C refers only to the connector's physical configuration or form factor and should not be confused with the conne ...

3.1 with USB Power Delivery **

Qualcomm Quick Charge Quick Charge (QC) is a proprietary battery charging protocol developed by Qualcomm, used for managing power delivered over USB, mainly by communicating to the power supply and negotiating a voltage. Quick Charge is supported by devices such as ...

4 **Up to 8 GB

Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)

Snapdragon 845 (2018)

The Snapdragon 845 was announced on December 7, 2017. Snapdragon 845's notable features: * CPU features **Samsung 10nm FinFET Low-Power Plus fabrication **4 Kryo 385 Gold (

Cortex-A75 based) ***L1 cache: 64 KB + 64 KB ***L2 cache: 256 KB **4 Kryo 385 Silver (

Cortex-A55 based) **

DynamIQ ARM big.LITTLE is a heterogeneous computing architecture developed by ARM Holdings, coupling relatively battery-saving and slower processor cores (''LITTLE'') with relatively more powerful and power-hungry ones (''big''). Typically, only one "s ...

with 2 MiB L3 cache *3 MiB system-level cache for CPU, GPU, DSP... *

features **

630 graphics with support for

1.1,

12 (Feature level 12_1),

2.0,

3.2 and DxNext eXtended Reality (XR) **Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs (up from 512 ALUs, 16 TMUs and 12 ROPs) **727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s **Inside-out Room-Scale

6DoF Six degrees of freedom (6DOF) refers to the six mechanical degrees of freedom of movement of a rigid body in three-dimensional space. Specifically, the body is free to change position as forward/backward (surge), up/down (heave), left/right ...

with

simultaneous localization and mapping Simultaneous localization and mapping (SLAM) is the computational problem of constructing or updating a map of an unknown environment while simultaneously keeping track of an agent's location within it. While this initially appears to be a chick ...

(SLAM) **Advanced visual inertial odometry (VIO) And Adreno Foveation **Support for

and

hybrid log–gamma The hybrid log–gamma (HLG) transfer function is a transfer function jointly developed by the BBC and NHK for high dynamic range (HDR) display. It's backward compatible with the transfer function of SDR (the gamma curve). It was approved as ARIB ...

(HLG) **

2.0,

3.1 with USB Power Delivery *

features **

685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS) **Hexagon Vector eXtensions **All-Ways Aware Hub low power island **Neural Processing Engine ( NPE) ** Caffe, Caffe2,

and

support **Up to 4K Ultra HD @ 60 FPS (From 4K30 Encode), 2x 2400x2400 @ 120 FPS ( VR) **Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion) **10-bit color depth (encoding and decoding) on

and (decode only)

BT.2020 ITU-R Recommendation BT.2020, more commonly known by the abbreviations Rec. 2020 or BT.2020, defines various aspects of ultra-high-definition television (UHDTV) with standard dynamic range (SDR) and wide color gamut (WCG), including picture ...

support on DSP and GPU *ISP features: **Qualcomm Spectra 280 ISP with Dual 14-bit ISPs **192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL *

and

features **Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers **Uplink: 2x20 MHz carrier aggregation, up to 64-QAM **

enhancements **Ultra-low power wireless earbuds **Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers **

ad 60 GHz with external Module **Improve Global Positioning System, GPS support : GLONASS, Glonass, BeiDou Navigation Satellite System, Beidou, Galileo (satellite navigation), Galileo, Quasi-Zenith Satellite System, QZSS and SBAS *System on a chip features **10 nm FinFET LPP (Samsung) **Die size: 94 mm² **(5.3) billion Transistors **Secure Vault (Secure cryptoprocessor, SPU) **Native DSD support, PCM up to 384 kHz/32bit **

4+ **Up to 8 GB

Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)

Snapdragon 855/855+ (2019) and 860 (2021)

The Snapdragon 855 was announced on December 5, 2018. The Snapdragon 855 is Qualcomm's first 7 nm

chipset. Notable features over its predecessor (845): * 7 nanometer, 7 nm TSMC, (N7 TSMC) process *Die size: 73 mm² (8.48 mm × 8.64 mm) *6.7 billion transistors * Support up to 16 GB

2133 MHz support *4x 16-bit memory bus, (34.13 GB/s) up to 16 GB *NVM Express 2x 3.0 (1x for external 5G modem) * CPU features **1 Kryo#/Kryo 485, Kryo 485 Prime (Cortex-A76-based), up to 2.84 GHz. Prime core with 512 KB pL2 **3 Kryo#/Kryo 485, Kryo 485 Gold (Cortex-A76-based), up 2.42 GHz. Performance cores with 256 KB pL2 each **4 Kryo#/Kryo 485, Kryo 485 Silver (Cortex-A55-based), up 1.8 GHz. Efficiency cores with 128 KB pL2 each **

with 2 MB sL3 cache *3 MB system-level cache *GPU features **

640 GPU with support for Vulkan (API), Vulkan 1.1 **Up to 768 ALU (From 512 on

630) **Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs (up from 512 ALUs, 24 TMUs and 16 ROPs) **954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth **High-dynamic-range video, HDR gaming (10-bit color depth, Rec. 2020) **120 fps gaming **Improvement on hardware-accelerated

and

decoder **HDR playback codec support for HDR10+,

, Hybrid log–gamma, HLG and Dolby Vision **Volumetric VR video playback **8K 360 VR video playback **Quarterly GPU driver updates via Google Play, Google Play Store **Android GPU Inspector Tool *

features **

690 4th generation "AI engine" with greater than 7 trillion operations per second (TOPS) **Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions **Qualcomm Hexagon Tensor Accelerator (HTA) **Qualcomm Hexagon Voice Assistant **All-Ways Aware Hub ** Caffe, Caffe2,

and

support **Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance *ISP features: **Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision **Multi-frame noise reduction **Hybrid AF **192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL **High Efficiency Image File Format, HEIF photo capture support **Tri-core hardware CV functions including object detection & tracking, and stereo depth processing **Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array (QCFA) HDR **4K 60 FPS HDR video with real-time object segmentation (portrait mode, background swap) features HDR10, HDR10+ and HLG with Portrait Mode (bokeh), 10-bit color depth and Rec. 2020 color gamut **Up to 1.32 Gpixel/s ** Video Capture Formats: HDR10, Hybrid log–gamma, HLG ** Video Codec Support: H.265 (HEVC), H.264 (Advanced Video Coding, AVC), HLG,

, HDR10+, VP8,

*Modem and wireless features: **Internal Qualcomm Snapdragon LTE modem, X24 LTE Modem **Download: 2000 Mbit/s DL (Cat. 20), 7x20 MHz CA, 256-QAM, 4x4 MIMO **Upload: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM **External Qualcomm Snapdragon LTE modem, Snapdragon X50 (5G Modem): 5000 Mbit/s DL **Qualcomm IEEE 802.11ax, Wi-Fi 6-ready mobile platform: ***IEEE 802.11ax, Wi-Fi Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n ***Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz ***MIMO Configuration: 2x2 (2-stream) • MU-MIMO• Dual-band simultaneous (DBS) ***Key Features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3 **Qualcomm 60 GHz Wi-Fi mobile platform ***IEEE 802.11ax, Wi-Fi Standards: 802.11ad, 802.11ay ***Wi-Fi Spectral Band: 60 GHz ***Peak speed: 10 Gbit/s The Snapdragon 855+ was announced on July 15, 2019. The Snapdragon 860 was announced on March 22, 2021.

Snapdragon 865/865+ 5G (2020) and 870 5G (2021)

The Snapdragon 865 was announced on December 4, 2019. Notable features over its predecessor (855): * 7 nanometer, 2nd generation 7 nm TSMC, (N7P TSMC) process *10.3 billion transistors *83.54 mm2 (8.49 mm x 9.84 mm) * Support up to 16 GB LPDDR#LP-DDR5, LPDDR5 2750 MHz or

2133 MHz support * 4x 16-bit memory bus, (or 34.13 GB/s) up to 16 GB * NVM Express 2x 3.0 (1x for external 5G modem) *Support Quick Charge 4.0, Quick charge 4+ * CPU features ** 1 Kryo#Kryo 585, Kryo 585 Prime (Cortex-A77-based), 2.84 GHz (3.1 GHz for 865+, 3.2 GHz for 870). Prime Central processing unit, core with 512 KB pL2 ** 3 Kryo#/Kryo 485, Kryo 585 Gold (Cortex-A77-based), 2.55 GHz. Performance cores with 256 KB pL2 each ** 4 Kryo#/Kryo 485, Kryo 585 Silver (Cortex-A55-based), 1.95 GHz. Efficiency cores with 128 KB pL2 each **

with 4 MB sL3, ** 25% performance uplift and 25% power efficiency improvement * 3 MB system-level cache * GPU features **

650 GPU with support for Vulkan (API), Vulkan 1.1 ** 50% more ALUs and ROPs ** 25% faster graphics rendering and 35% more power efficient ** Quarterly GPU driver updates via Google Play, Google Play Store **Android GPU Inspector Tool ** Desktop Forward Rendering **Up to 1202.1 GFLOPs FP-32 (From 898.5 GFLOPs on SD855) *

features **

698 5th generation "AI engine" capable of 15 trillion operations per second (TOPS) ** Quad-core Qualcomm Hexagon Tensor Accelerator (HTA) ** Deep learning bandwidth compression * ISP features: ** Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision **Multi-frame noise reduction **Hybrid AF ** 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL ** 8K resolution, 8K 30 FPS and 4K 120 FPS HDR video ** Up to 2 Gpixel/s ** Video capture formats: Dolby Vision,

, HDR10+, HEVC ** Video codec support: Dolby Vision, H.265 (

), HDR10+, HLG, HDR10, Advanced Video Coding, H.264 (AVC), VP8,

** New functionalities to improve noise reduction and local contrast enhancements * Modem and wireless features: ** External Qualcomm Snapdragon LTE modem, X55 LTE Modem ** Modes: NSA, SA, TDD, FDD ** 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO ** 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO ** 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL ** 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL ** LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO ** LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM ** Dynamic Spectrum Sharing (DSS) ** Qualcomm IEEE 802.11ax, Wi-Fi 6-ready mobile platform: ***

FastConnect 6800 (for 865 and 870), 6900 (for 865+) *** IEEE 802.11ax, Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E for 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n *** Wi-Fi spectral bands: 2.4 GHz, 5 GHz (for 865 and 870), 2.4 GHz, 5 GHz, 6 GHz (for 865+) • channel utilization: 20/40/80 MHz (for 865 & 870), 20/40/80/160 MHz (for 865+) *** MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) *** Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3 ** Qualcomm 60 GHz Wi-Fi mobile platform *** IEEE 802.11ax, Wi-Fi Standards: 802.11ad, 802.11ay *** Wi-Fi spectral band: 60 GHz *** Peak speed: 10 Gbit/s * Other features: ** Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support The Snapdragon 865+ was announced on July 8, 2020. The Snapdragon 870 was announced on January 19, 2021.

Snapdragon 888/888+ 5G (2021)

The Snapdragon 888 was announced on December 1, 2020. Notable features over its predecessor (865): * 5 nanometer, 5 nm (5LPE) Samsung process *~10 billion transistors * Support up to 16 GB LPDDR#LP-DDR5, LPDDR5 3200 MHz (51.2 GB/s) * 4x 16-bit memory bus * Quick Charge, Quick Charge 5 (100 W+) * Support Universal Flash Storage, UFS 3.1 * CPU features ** 1 Kryo#Kryo 680, Kryo 680 Prime (ARM Cortex-X1-based), up to 2.84 GHz. Prime Central processing unit, core with 1 MB pL2 and 64 KB pL1 ** 3 Kryo#/Kryo 680, Kryo 680 Gold (ARM Cortex-A78-based), up 2.42 GHz. Performance cores with 512 KB pL2 each ** 4 Kryo#/Kryo 680, Kryo 680 Silver (ARM Cortex-A55-based), up 1.8 GHz. Efficiency cores with 128 KB pL2 each ** Move to instruction set ARMv8.4-A (From ARMv8.2-A) **

with 4 MB sL3, ** 25% performance uplift and 25% power efficiency improvement * 3 MB system-level cache * GPU features **

660 GPU with API Support:

3.2, OpenCL 2.0 FP, Vulkan (API), Vulkan 1.1 ** Up to 840 MHz (From 670 MHz on 865+ and 870) ** 35% faster graphics rendering and 20% more power efficient ** 73% AI performance boost (From 15 TOPS to 26 TOPS) ** Variable rate shading (VRS) ** Demura and subpixel rendering for OLED uniformity ** Up to 1720.3 GFLOPs FP32 (From 1202.1 GFLOPs on SD865) ** High-dynamic-range video, HDR video playback formats:

, HDR10+, Dolby Vision, Hybrid log–gamma, HLG ** High-dynamic-range video, HDR gaming (including 10-bit color depth, Rec. 2020 color gamut) ** On-device display: 4K@60 Hz, QHD+@144 Hz ** External display: 4K@60 Hz, 10-bit, Rec. 2020,

, HDR10+ *

features **

780 with Fused AI Accelerator architecture 6th generation "AI engine" capable of 26 trillion operations per second (TOPS), From 15 TOPS on 865. *** Hexagon Tensor Accelerator *** Hexagon Vector eXtensions *** Hexagon Scalar Accelerator ** Qualcomm Sensing Hub (2nd generation) *** New dedicated AI processor *** 80% task reduction offload from Hexagon DSP *** 5X more processing power ** 16X larger shared memory ** 1000X hand off time improvement in certain use cases ** 50% faster scalar accelerator, 2x faster tensor accelerator ** Video codec playback support: Advanced Video Coding, H.264 (AVC), High Efficiency Video Coding, H.265 (HEVC), VP8,

* ISP features: ** Qualcomm Spectra 580 with triple 14-bit CV-ISPs and hardware accelerator for computer vision ** Single camera: 1x 200 MP or 84 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag) ** Dual camera: 64+25 MP at 30 fps with MFNR/ZSL ** Triple camera: 3x 28 MP at 30 fps with MFNR/ZSL ** 8K resolution, 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo ** Slow-mo video capture at 720p @ 960 FPS, 1080p @ 480 FPS ** High-dynamic-range video, HDR video capture formats:

with

, HDR10+, Dolby Vision, Hybrid log–gamma, HLG ** High-dynamic-range video, HDR photo capture: 10-bit High-dynamic-range video, HDR High Efficiency Image File Format, HEIF ** High-dynamic-range imaging, Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors ** Real-time object classification, segmentation, and replacement ** AI-based auto-focus, auto-exposure and auto-white-balance ** Advanced HW-based face detection with deep learning filter ** New low-light architecture (capture photos in 0.1 lux) ** 2.7 Gigapixel per second ISP (+35% speed increase over S865) ** 120 photos at 12MP/s * Modem and wireless features: ** Internal Qualcomm Snapdragon LTE modem#Snapdragon X60 5G Modem, X60 LTE Modem ** Modes: NSA, SA, TDD, FDD ** 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO ** 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO ** 5G NR Sub-6 + mmWave download: 7500 Mbit/s DL ** 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL ** LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO ** LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM ** 5G NR#Dynamic spectrum sharing, Dynamic Spectrum Sharing (DSS) **

5.2 *** Dual antennas *** Premium audio ** Qualcomm IEEE 802.11ax, Wi-Fi 6-ready mobile platform: ***

FastConnect 6900 *** IEEE 802.11ax, Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n *** Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz *** MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2) *** Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3 ** Qualcomm 60 GHz Wi-Fi mobile platform *** IEEE 802.11ax, Wi-Fi Standards: IEEE 802.11ad, 802.11ad, 802.11ay *** Wi-Fi spectral band: 60 GHz *** Peak speed: 10 Gbit/s * Other features: ** Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support ** Adds compatibility with Content Authenticity Initiative The Snapdragon 888+ was announced on June 28, 2021.

Snapdragon 8/8+ Gen 1 (2022)

The Snapdragon 8 Gen 1 was announced on November 30, 2021. Notable features over its predecessor (888): * 5 nanometer, 4 nm (4LPE) Samsung process * ~ billion transistors * Support up to 16 GB LPDDR#LP-DDR5, LPDDR5 3200 MHz * Quick Charge, Quick Charge 5 (100 W+) * Support Universal Flash Storage, UFS 3.1 * CPU features ** 1 Kryo#Kryo (ARMv9), Kryo Prime (ARM Cortex-X2-based), up to 3 GHz. Prime Central processing unit, core ** 3 Kryo#Kryo (ARMv9), Kryo Gold (ARM Cortex-A710-based), up 2.5 GHz. Performance cores ** 4 Kryo#Kryo (ARMv9), Kryo Silver (ARM Cortex-A510-based), up 1.8 GHz. Efficiency cores ** Move to instruction set ARMv9 (From ARMv8.2-A) **

with 4 MB sL3, ** 20% performance uplift and 30% power efficiency improvement ** 6 MB system-level cache * GPU features **

GPU with API Support:

3.2, OpenCL 2.0 FP, Vulkan (API), Vulkan 1.1 ** 30% faster graphics rendering and 25% more power efficient ** Demura and subpixel rendering for OLED uniformity ** Variable Rate Shading Pro ** High-dynamic-range video, HDR video playback formats:

, HDR10+ *

features **

with Fused AI Accelerator, INT8 and INT16 *** Hexagon Tensor Accelerator *** Hexagon Vector eXtensions *** Hexagon Scalar Accelerator ** Qualcomm Sensing Hub *** New dedicated AI pro * ISP featureshttps://www.qualcomm.com/media/documents/files/snapdragon-8-gen-1-mobile-platform-product-brief.pdf ** Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision ** Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag) ** Dual camera: 64+36 MP at 30 fps with MFNR/ZSL ** Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL ** 8K resolution, 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo ** Slow-m 5G NR, LTE including CBRS **WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE **720p @ 960 FPS **High-dynamic-range video, HDR video capture formats:

with

5.3 *** Qualcomm Aqstic audio codec (WCD9385) ***Provide lossless wireless audio with Qualcomm aptX Technology. ** Qualcomm IEEE 802.11ax, Wi-Fi 6-ready mobile platform: ***

Snapdragon 8 Gen 2 (2023)

The Snapdragon 8 Gen 2 was announced on November 15, 2022. Notable features over its predecessor (8 Gen 1): * 4nm (N4) TSMC process * Support up to 16 GB LPDDR, LPDDR5X 4200 MHz * Support UFS 4.0 * CPU features

1 Kryo, Kryo Prime (ARM Cortex-X3-based), up to 3.2 GHz. Prime core; 2 Kryo, Kryo Gold (ARM Cortex-A715-based), up to 2.8 GHz. High Performance cores; 2 Kryo, Kryo Gold (ARM Cortex-A710-based), up to 2.8 GHz. Performance cores; 3 Kryo, Kryo Silver (ARM Cortex-A510-based), up to 2 GHz. Efficiency cores; 35% performance uplift and 40% power efficiency improvement; 8 MB system-level cache

* GPU features

Adreno GPU with API support: OpenGL ES, OpenGL ES 3.2, OpenCL 2.0, Vulkan, Vulkan 1.3; 25% faster graphics rendering and 45% more power efficient; Real-Time-Hardware-Accelerated Ray Tracing

Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

The first and second generation of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018. It is essentially an over-clocked version of the Snapdragon 845.

Snapdragon 7c/7c+ Compute Platforms

The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019.
The Snapdragon 7c Gen 2 Compute Platform was announced on May 24, 2021.
The Snapdragon 7c+ Gen 3 Compute Platform was announced on December 1, 2021.

Snapdragon 8c Compute Platforms

The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.

Snapdragon 8cx Compute Platforms

The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.
Notable features over the Snapdragon 855: * 10 MB L3 cache * 8x 16-bit memory bus, (68.26 GB/s) *NVM Express 4x The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.
The Snapdragon 8cx Gen 3 Compute Platform was announced on December 1, 2021.

Microsoft SQ1, SQ2 and SQ3

The Microsoft SQ1 was announced on October 2, 2019. Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.

Hardware codec supported

See: Qualcomm Hexagon

Wearable platforms

Snapdragon Wear series

The Snapdragon Wear 1100 processor was announced May 30, 2016 for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories. The Snapdragon Wear 1100 processor was announced June 27, 2017 for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers. The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches. It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions. The Snapdragon Wear 2500 was announced on June 26, 2018. It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking. The Snapdragon Wear 3100 was announced on September 10, 2018. The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays. The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020. The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+. The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022. The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

Automotive platforms

Snapdragon 602A, 820A and 855A

The Snapdragon 602A, for application in the motor industry, was announced on January 6, 2014.
The Snapdragon 820A was announced on January 6, 2016.

Embedded platforms

Snapdragon 410E, 600E, 800, 810 and 820E

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.

Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform was announced on April 11, 2018. The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Home Hub and Smart Audio platforms

Qualcomm 212, 624 and Smart Audio

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017) was announced on June 14, 2017.
The Qualcomm 212 Home Hub (APQ8009) and Qualcomm 624 Home Hub (APQ8053) were announced on January 9, 2018. The QCS400 Series was announced March 19, 2019.

eXtended Reality (XR) platforms

Snapdragon XR1 and XR2

In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built System on a chip, SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.
The Snapdragon XR2 5G Platform was announced on December 5, 2019, and is a derivative of the Snapdragon 865. It is used in the Meta Quest 2, the HTC Vive#Product lines, HTC Vive Focus 3 and the Pico 4.
The Snapdragon XR2+ Gen 1 Platform was announced on October 11, 2022, and is used in the Meta Quest Pro.

Gaming platforms

Snapdragon G3x Gen 1

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform, a purpose-built SoC designed for dedicated gaming devices. Qualcomm also announced a handheld gaming developer kit developed with Razer Inc., Razer. Specifications: * Qualcomm Adreno GPU * Qualcomm Kryo CPU * Qualcomm Quick Game Touch * Support for Variable Rate Shading * Qualcomm Game Color Plus * Qualcomm Game Smoother * 5G mmWave Modem-RF system * Qualcomm FastConnect Subsystem with Wi-Fi 6E * Haptics Engine * Snapdragon Sound Technology * 4K TV out

Bluetooth SoC platforms

Following Qualcomm's acquisition of CSR (company), CSR in 2015, Qualcomm designs ultra-low-power

System on a chip, SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon (company), Amazon and Google on reference designs to help manufacturers develop headsets with support for Amazon Alexa, Alexa, Google Assistant and Google Fast Pair. Qualcomm announced the QCC5100 Series at CES 2018. On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG. On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series. On March 25, 2020, the Bluetooth Low Energy#Audio, BLE Audio QCC304x and QCC514x SoCs were officially announced.

Before Snapdragon

Snapdragon S series

Snapdragon S1

Snapdragon S2

Snapdragon S3

Snapdragon S4

Snapdragon 2 Series

Snapdragon 200 (2013)

Qualcomm 205, Snapdragon 208, 210 and 212 (2014–17)

Qualcomm 215 (2019)

Snapdragon 4 Series

Snapdragon 400 (2013)

Snapdragon 410, 412 and 415 (2014/15)

Snapdragon 425, 427, 430 and 435 (2015/16)

Snapdragon 429, 439 and 450 (2017/18)

Snapdragon 460 (2020)

Snapdragon 480/480+ 5G (2021)

Snapdragon 4 Gen 1 (2022)

Snapdragon 6 Series

Snapdragon 600 (2013)

Snapdragon 610, 615 and 616 (2014/15)

Snapdragon 617, 625 and 626 (2015/16)

Snapdragon 650 (618), 652 (620) and 653 (2015/16)

Snapdragon 630, 636 and 660 (2017)

Snapdragon 632 and 670 (2018)

Snapdragon 662, 665, 675 and 678 (2019/20)

Snapdragon 680 4G, 690 5G and 695 5G (2020/21)

Snapdragon 6 Gen 1 (2022)

Snapdragon 7 Series

Snapdragon 710 and 712 (2018/19)

Snapdragon 720G/730/730G/732G (2019/20)

Snapdragon 750G and 765/765G/768G 5G (2020)

Snapdragon 778G/778G+, 780G and 782G 5G (2021/22)

Snapdragon 7 Gen 1 (2022)

Snapdragon 8 Series

Snapdragon 800, 801 and 805 (2013/14)

Snapdragon 808 and 810 (2015)

Snapdragon 820 and 821 (2016)

Snapdragon 835 (2017)

Snapdragon 845 (2018)

Snapdragon 855/855+ (2019) and 860 (2021)

Snapdragon 865/865+ 5G (2020) and 870 5G (2021)

Snapdragon 888/888+ 5G (2021)

Snapdragon 8/8+ Gen 1 (2022)

Snapdragon 8 Gen 2 (2023)

Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

Snapdragon 7c/7c+ Compute Platforms

Snapdragon 8c Compute Platforms

Snapdragon 8cx Compute Platforms

Microsoft SQ1, SQ2 and SQ3

Hardware codec supported

Wearable platforms

Snapdragon Wear series

Automotive platforms

Snapdragon 602A, 820A and 855A

Embedded platforms

Snapdragon 410E, 600E, 800, 810 and 820E

Vision Intelligence Platform

Home Hub and Smart Audio platforms

Qualcomm 212, 624 and Smart Audio

eXtended Reality (XR) platforms

Snapdragon XR1 and XR2

Gaming platforms

Snapdragon G3x Gen 1

Bluetooth SoC platforms

Qualcomm QCC300x Series Bluetooth audio SoCs

Qualcomm QCC30xx Series Bluetooth audio SoCs

Qualcomm QCC510x Series Bluetooth audio SoCs

See also

References

External links