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Transistor Density
The transistor count is the number of transistors in an electronic device (typically on a single substrate or "chip"). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in the cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observed that the transistor count doubles approximately every two years. However, being directly proportional to the area of a chip, transistor count doesn't represent how advanced corresponding manufacturing technology is, which is better characterized by transistor density instead (ratio of transistor count of a chip to its area). , the largest transistor count in a commercially available microprocessor is 114billion transistors, in Apple's ARM-based dual-die M1 Ultra system on a chip, which is fabricated using TSMC's 5 nm semicon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Transistor
upright=1.4, gate (G), body (B), source (S) and drain (D) terminals. The gate is separated from the body by an insulating layer (pink). A transistor is a semiconductor device used to Electronic amplifier, amplify or electronic switch, switch electrical signals and electrical power, power. The transistor is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more are found embedded in integrated circuits. Austro-Hungarian physicist Julius Edgar Lilienfeld proposed the concept of a field-effect transistor in 1926, but it was not possible to actually constru ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3D Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOSFET, MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (Integrated circuit packaging, package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flash Memory
Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both use the same cell design, consisting of floating gate MOSFETs. They differ at the circuit level depending on whether the state of the bit line or word lines is pulled high or low: in NAND flash, the relationship between the bit line and the word lines resembles a NAND gate; in NOR flash, it resembles a NOR gate. Flash memory, a type of floating-gate memory, was invented at Toshiba in 1980 and is based on EEPROM technology. Toshiba began marketing flash memory in 1987. EPROMs had to be erased completely before they could be rewritten. NAND flash memory, however, may be erased, written, and read in blocks (or pages), which generally are much smaller than the entire device. NOR flash memory allows a single machine word to be written to an era ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Three-dimensional Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOSFET, MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (Integrated circuit packaging, package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer-scale Integration
Wafer-scale integration (WSI) is a rarely used system of building very-large integrated circuit (commonly called a "chip") networks from an entire silicon wafer to produce a single "super-chip". Combining large size and reduced packaging, WSI was expected to lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term very-large-scale integration, the state of the art when WSI was being developed. Overview In the normal integrated circuit manufacturing process, a single large cylindrical crystal ( boule) of silicon is produced and then cut into disks known as wafers. The wafers are then cleaned and polished in preparation for the fabrication process. A photographic process is used to pattern the surface where material ought to be deposited on top of the wafer and where not to. The desired material is deposited and the photographic mask is removed for the next layer. From then on the wafer is repeatedly processed in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphcore
Graphcore is a British semiconductor company that develops accelerators for AI and machine learning. It aims to make a massively parallel Intelligence Processing Unit (IPU) that holds the complete machine learning model inside the processor. History Graphcore was founded in 2016 by Simon Knowles and Nigel Toon. In the autumn of 2016, Graphcore secured a first funding round led by Robert Bosch Venture Capital. Other backers include Samsung, Amadeus Capital Partners, C4 Ventures, Draper Esprit, Foundation Capital, and Pitango. In July 2017, Graphcore secured a round B funding led by Atomico, which was followed a few months later by $50 million in funding from Sequoia Capital. In December 2018, Graphcore closed its series D with $200 million raised at a $1.7 billion valuation, making the company a unicorn. Investors included Microsoft, Samsung and Dell Technologies. On 13 November 2019, Graphcore announced that their Graphcore C2 IPUs are available for preview on Microsoft Azur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed to manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device. GPUs are used in embedded systems, mobile phones, personal computers, workstations, and game consoles. Modern GPUs are efficient at manipulating computer graphics and image processing. Their parallel structure makes them more efficient than general-purpose central processing units (CPUs) for algorithms that process large blocks of data in parallel. In a personal computer, a GPU can be present on a video card or embedded on the motherboard. In some CPUs, they are embedded on the CPU die. In the 1970s, the term "GPU" originally stood for ''graphics processor unit'' and described a programmable processing unit independently working from the CPU and responsible for graphics manipulation and output. Later, in 1994, Sony used the term (now standing for ''graphics processing unit'' ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Cerebras
Cerebras Systems is an American artificial intelligence company with offices in Sunnyvale and San Diego, Toronto, Tokyo and Bangalore, India. Cerebras builds computer systems for complex artificial intelligence deep learning applications. History Cerebras was founded in 2015 by Andrew Feldman, Gary Lauterbach, Michael James, Sean Lie and Jean-Philippe Fricker. These five founders worked together at SeaMicro, which was started in 2007 by Feldman and Lauterbach and was later sold to AMD in 2012 for $334 million. In May 2016, Cerebras secured $27 million in series A funding led by Benchmark, Foundation Capital and Eclipse Ventures. In December 2016, series B funding was led by Coatue Management, followed in January 2017 with series C funding led by VY Capital. In November 2018, Cerebras closed its series D round with $88 million, making the company a unicorn. Investors in this round included Altimeter, VY Capital, Coatue, Foundation Capital, Benchmark, and Eclipse. On August ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Deep Learning
Deep learning (also known as deep structured learning) is part of a broader family of machine learning methods based on artificial neural networks with representation learning. Learning can be supervised, semi-supervised or unsupervised. Deep-learning architectures such as deep neural networks, deep belief networks, deep reinforcement learning, recurrent neural networks, convolutional neural networks and Transformers have been applied to fields including computer vision, speech recognition, natural language processing, machine translation, bioinformatics, drug design, medical image analysis, Climatology, climate science, material inspection and board game programs, where they have produced results comparable to and in some cases surpassing human expert performance. Artificial neural networks (ANNs) were inspired by information processing and distributed communication nodes in biological systems. ANNs have various differences from biological brains. Specifically, artificial ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-level Cell
In electronics, a multi-level cell (MLC) is a memory cell capable of storing more than a single bit of information, compared to a single-level cell (SLC), which can store only one bit per memory cell. A memory cell typically consists of a single floating-gate MOSFET (metal–oxide–semiconductor field-effect transistor), thus multi-level cells reduce the number of MOSFETs required to store the same amount of data as single-level cells. Triple-level cells (TLC) and quad-level cells (QLC) are versions of MLC memory, which can store three and four bits per cell respectively. The name "''multi''-level cell" is sometimes used specifically to refer to the "''two''-level cell". Overall, the memories are named as follows: # Single-level cell or SLC (1 bit per cell) # Multi-level cell or MLC (2 bits per cell), alternatively double-level cell or DLC # Triple-level cell or TLC (3 bits per cell) or 3-Bit MLC # Quad-level cell or QLC (4 bits per cell) # Penta-level cell or PLC (5 bits per ce ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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