Failure Of Electronic Components
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Failure Of Electronic Components
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits. Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates. Burn-in procedures are used to detect early failures. In semiconductor devices, parasitic structures, irrelevant for normal operation, become important in the context of failures; they can be both a source and protection against failure. Applications such as aerospace systems, life support systems, telecommunications, railway signals, and computers use great numbers of individual electronic componen ...
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Failed SMPS Controller IC ISL6251
Failure is the state or condition of not meeting a desirable or intended objective, and may be viewed as the opposite of success. The criteria for failure depends on context, and may be relative to a particular observer or belief system. One person might consider a failure what another person considers a success, particularly in cases of direct competition or a zero-sum game. Similarly, the degree of success or failure in a situation may be differently viewed by distinct observers or participants, such that a situation that one considers to be a failure, another might consider to be a success, a qualified success or a neutral situation. It may also be difficult or impossible to ascertain whether a situation meets criteria for failure or success due to ambiguous or ill-defined definition of those criteria. Finding useful and effective criteria, or heuristics, to judge the success or failure of a situation may itself be a significant task. In American history Cultural histori ...
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Ammonia
Ammonia is an inorganic compound of nitrogen and hydrogen with the formula . A stable binary hydride, and the simplest pnictogen hydride, ammonia is a colourless gas with a distinct pungent smell. Biologically, it is a common nitrogenous waste, particularly among aquatic organisms, and it contributes significantly to the nutritional needs of terrestrial organisms by serving as a precursor to 45% of the world's food and fertilizers. Around 70% of ammonia is used to make fertilisers in various forms and composition, such as urea and Diammonium phosphate. Ammonia in pure form is also applied directly into the soil. Ammonia, either directly or indirectly, is also a building block for the synthesis of many pharmaceutical products and is used in many commercial cleaning products. It is mainly collected by downward displacement of both air and water. Although common in nature—both terrestrially and in the outer planets of the Solar System—and in wide use, ammonia is both caust ...
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Intermetallic
An intermetallic (also called an intermetallic compound, intermetallic alloy, ordered intermetallic alloy, and a long-range-ordered alloy) is a type of metallic alloy that forms an ordered solid-state compound between two or more metallic elements. Intermetallics are generally hard and brittle, with good high-temperature mechanical properties. They can be classified as stoichiometric or nonstoichiometic intermetallic compounds. Although the term "intermetallic compounds", as it applies to solid phases, has been in use for many years, its introduction was regretted, for example by Hume-Rothery in 1955. Definitions Research definition Schulze in 1967 defined intermetallic compounds as ''solid phases containing two or more metallic elements, with optionally one or more non-metallic elements, whose crystal structure differs from that of the other constituents''. Under this definition, the following are included: #Electron (or Hume-Rothery) compounds #Size packing phases. e.g. Lav ...
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Electromigration
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases. History The phenomenon of electromigration has been known for over 100 years, having been discovered by the French scientist Gerardin. The topic first became of practical interest during the late 1960s when packaged ICs first appeared. The earliest commercially available ICs failed in a mere three weeks of use from runaway electromigration, which led to a major industry effort to correct this problem. The first observation of electromigration in thin films was made by I. Blech.I. Blech: ''Electromigration in Thin Aluminum Fi ...
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Mechanical Vibration
Vibration is a mechanical phenomenon whereby oscillations occur about an equilibrium point. The word comes from Latin ''vibrationem'' ("shaking, brandishing"). The oscillations may be periodic, such as the motion of a pendulum—or random, such as the movement of a tire on a gravel road. Vibration can be desirable: for example, the motion of a tuning fork, the reed in a woodwind instrument or harmonica, a mobile phone, or the cone of a loudspeaker. In many cases, however, vibration is undesirable, wasting energy and creating unwanted sound. For example, the vibrational motions of engines, electric motors, or any mechanical device in operation are typically unwanted. Such vibrations could be caused by imbalances in the rotating parts, uneven friction, or the meshing of gear teeth. Careful designs usually minimize unwanted vibrations. The studies of sound and vibration are closely related. Sound, or pressure waves, are generated by vibrating structures (e.g. vocal cords); thes ...
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Contact Resistance
The term contact resistance refers to the contribution to the total resistance of a system which can be attributed to the contacting interfaces of electrical leads and connections as opposed to the intrinsic resistance. This effect is described by the term electrical contact resistance (ECR) and arises as the result of the limited areas of true contact at an interface and the presence of resistive surface films or oxide layers. ECR may vary with time, most often decreasing, in a process known as resistance creep. The idea of potential drop on the injection electrode was introduced by William Shockley to explain the difference between the experimental results and the model of gradual channel approximation. In addition to the term ECR, ''interface resistance'', ''transitional resistance'', or just simply ''correction term'' are also used. The term ''parasitic resistance'' is used as a more general term, of which it is usually assumed that contact resistance is a major component. ...
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Lead Frame
A lead frame (pronounced ) is the metal structure inside a chip package that carries signals from the die to the outside. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad. Small bond wires connect the die to each bond pad. Mechanical connections fix all these parts into a rigid structure, which makes the whole lead frame easy to handle automatically. Manufacturing Lead frames are manufactured by removing material from a flat plate of copper, copper-alloy, or iron-nickel alloy like alloy 42. Two processes used for this are etching (suitable for high density of leads), or stamping (suitable for low density of leads). The mechanical bending process can be applied after both techniques. The die is glued or soldered to the die pad inside the lead frame, and then bond wires are attached between the die and the bond p ...
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Phosphoric Acid
Phosphoric acid (orthophosphoric acid, monophosphoric acid or phosphoric(V) acid) is a colorless, odorless phosphorus-containing solid, and inorganic compound with the chemical formula . It is commonly encountered as an 85% aqueous solution, which is a colourless, odourless, and non- volatile syrupy liquid. It is a major industrial chemical, being a component of many fertilizers. The compound is an acid. Removal of all three ions gives the phosphate ion . Removal of one or two protons gives dihydrogen phosphate ion , and the hydrogen phosphate ion , respectively. Phosphoric acid forms esters, called organophosphates. The name "orthophosphoric acid" can be used to distinguish this specific acid from other "phosphoric acids", such as pyrophosphoric acid. Nevertheless, the term "phosphoric acid" often means this specific compound; and that is the current IUPAC nomenclature. Production Phosphoric acid is produced industrially by one of two routes, wet processes and dry. We ...
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Phosphorus Pentoxide
Phosphorus pentoxide is a chemical compound with molecular formula P4 O10 (with its common name derived from its empirical formula, P2O5). This white crystalline solid is the anhydride of phosphoric acid. It is a powerful desiccant and dehydrating agent. Structure Phosphorus pentoxide crystallizes in at least four forms or polymorphs. The most familiar one, a metastable form (shown in the figure), comprises molecules of P4O10. Weak van der Waals forces hold these molecules together in a hexagonal lattice (However, in spite of the high symmetry of the molecules, the crystal packing is not a close packing). The structure of the P4O10 cage is reminiscent of adamantane with ''T''d symmetry point group. It is closely related to the corresponding anhydride of phosphorous acid, P4O6. The latter lacks terminal oxo groups. Its density is 2.30 g/cm3. It boils at 423 °C under atmospheric pressure; if heated more rapidly it can sublimate. This form can be made by condensing the vap ...
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Hygroscopy
Hygroscopy is the phenomenon of attracting and holding water molecules via either absorption or adsorption from the surrounding environment, which is usually at normal or room temperature. If water molecules become suspended among the substance's molecules, adsorbing substances can become physically changed, e.g., changing in volume, boiling point, viscosity or some other physical characteristic or property of the substance. For example, a finely dispersed hygroscopic powder, such as a salt, may become clumpy over time due to collection of moisture from the surrounding environment. ''Deliquescent'' materials are sufficiently hygroscopic that they absorb so much water that they become liquid and form an aqueous solution. Etymology and pronunciation The word ''hygroscopy'' () uses combining forms of '' hygro-'' and '' -scopy''. Unlike any other ''-scopy'' word, it no longer refers to a viewing or imaging mode. It did begin that way, with the word ''hygroscope'' referring in the ...
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Aluminium Hydroxide
Aluminium hydroxide, Al(OH)3, is found in nature as the mineral gibbsite (also known as hydrargillite) and its three much rarer polymorphs: bayerite, doyleite, and nordstrandite. Aluminium hydroxide is amphoteric, i.e., it has both basic and acidic properties. Closely related are aluminium oxide hydroxide, AlO(OH), and aluminium oxide or alumina (Al2O3), the latter of which is also amphoteric. These compounds together are the major components of the aluminium ore bauxite. Aluminium hydroxide also forms a gelatinous precipitate in water. Structure Al(OH)3 is built up of double layers of hydroxyl groups with aluminium ions occupying two-thirds of the octahedral holes between the two layers. Four polymorphs are recognized. All feature layers of octahedral aluminium hydroxide units, with hydrogen bonds between the layers. The polymorphs differ in terms of the stacking of the layers. All forms of Al(OH)3 crystals are hexagonal : *gibbsite is also known as γ-Al(OH)3 or α-Al(OH) ...
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Silver Migration
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors. The main factor facilitating the ECM is humidity. In the presence of water, ECM can go very quickly. Usually the process involves several stages: water adsorption, anode metal dissolution, ion accumulation, ion migration to cathode, and dendritic growth. The growth of the dendrite takes fraction of a second, during which time the resistance between anode and cathode drops almost to zero. Characteristics In addition to the electrical potential difference, the presence of moisture is a driving factor in the ECM. If there is a sufficient film of moisture with condensation and even at low electrical voltage, the ECM can form a bridging structure between the conta ...
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