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Dicing Saw
A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of material. Dicing saw is a kind of cutting machines. A cutter for use in dicing, and performs the cutting of the silicon wafer (Wafer dicing). At present, the mainstream cutting of silicon wafers with a diameter of 200mm or 300mm, 0.05mm square cut is also possible. Diamond blade to obscure the industrial diamond in the resin is the mainstream. Also, the thickness of the blades varies by the subject material is of about 20μm ~ 35μm is used when cutting the silicon wafer. Share accounted for 90% in only Japanese companies, such as DISCO Corporation and Accretech (Tokyo Seimitsu). In the past, half-cut to cut 2/3 degree of wafer thickness it was the mainstream, with the large diameter of the wafer size, on top of the tape mount, full cut cutting all the waf ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Diamond Blade
A diamond blade is a saw blade which has diamonds fixed on its edge for cutting hard or abrasive materials. There are many types of diamond blade, and they have many uses, including cutting stone, concrete, asphalt, bricks, coal balls, glass, and ceramics in the construction industry; cutting semiconductor materials in the semiconductor industry; and cutting gemstones, including diamonds, in the gem industry. Types Diamond blades are available in different shapes: * ''Circular diamond saw blades'' are the most widely used type of diamond blade. * A ''diamond gang saw blade'' is a long steel plate with diamond segments welded onto it. Normally, tens or hundreds of diamond gang saw blades are used together to saw raw stone blocks. * A ''diamond band saw blade'' is a flexible closed steel band with diamonds fixed (often by electroplating) on one edge of the band. Diamond blades designed for specific uses include marble, granite, concrete, asphalt, masonry, and gem-cutting blade ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Diamond Wire
A wire saw is a saw that uses a metal wire or cable for mechanical cutting of bulk solid material such as stone, wood, glass, ferrites, concrete, metals, crystals etc.. Industrial wire saws are usually powered. There are also hand-powered survivalist wire saws suitable for cutting tree branches. Wire saws are classified as continuous (or endless, or loop) or oscillating (or reciprocating). Sometimes the wire itself is referred to as a "blade". Wire saws are similar in principle to band saws or reciprocating saws, but they use abrasion to cut rather than saw teeth. Depending on the application, diamond material may or may not be used as an abrasive. The wire can have one strand or many strands braided together (cable). A single-strand saw can be roughened to be abrasive, abrasive compounds can be bonded to the cable, or diamond-impregnated beads (and spacers) can be threaded on the cable. Wire saws are often cooled and lubricated by water or oil. Types Wilderness Survival ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called " metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical elem ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer (electronics)
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit. History In the semiconductor or silicon wafer industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. Round shape comes from single-crystal ingots usually produced using the Czochralski method. Silicon wafers were first introduced in the 1940s. By 1960, silicon wafers were being manufactured in the U. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon
Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic table: carbon is above it; and germanium, tin, lead, and flerovium are below it. It is relatively unreactive. Because of its high chemical affinity for oxygen, it was not until 1823 that Jöns Jakob Berzelius was first able to prepare it and characterize it in pure form. Its oxides form a family of anions known as silicates. Its melting and boiling points of 1414 °C and 3265 °C, respectively, are the second highest among all the metalloids and nonmetals, being surpassed only by boron. Silicon is the eighth most common element in the universe by mass, but very rarely occurs as the pure element in the Earth's crust. It is widely distributed in space in cosmic dusts, planetoids, and planets as various forms of silicon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Glass
Glass is a non-crystalline, often transparent, amorphous solid that has widespread practical, technological, and decorative use in, for example, window panes, tableware, and optics. Glass is most often formed by rapid cooling ( quenching) of the molten form; some glasses such as volcanic glass are naturally occurring. The most familiar, and historically the oldest, types of manufactured glass are "silicate glasses" based on the chemical compound silica (silicon dioxide, or quartz), the primary constituent of sand. Soda–lime glass, containing around 70% silica, accounts for around 90% of manufactured glass. The term ''glass'', in popular usage, is often used to refer only to this type of material, although silica-free glasses often have desirable properties for applications in modern communications technology. Some objects, such as drinking glasses and eyeglasses, are so commonly made of silicate-based glass that they are simply called by the name of the material. D ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ceramic
A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain, and brick. The earliest ceramics made by humans were pottery objects (''pots,'' ''vessels or vases'') or figurines made from clay, either by itself or mixed with other materials like silica, hardened and sintered in fire. Later, ceramics were glazed and fired to create smooth, colored surfaces, decreasing porosity through the use of glassy, amorphous ceramic coatings on top of the crystalline ceramic substrates. Ceramics now include domestic, industrial and building products, as well as a wide range of materials developed for use in advanced ceramic engineering, such as in semiconductors. The word "'' ceramic''" comes from the Greek word (), "of pottery" or "for pottery", from (), "potter's clay, tile, pottery". The earliest kno ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Crystal
A crystal or crystalline solid is a solid material whose constituents (such as atoms, molecules, or ions) are arranged in a highly ordered microscopic structure, forming a crystal lattice that extends in all directions. In addition, macroscopic single crystals are usually identifiable by their geometrical shape, consisting of flat faces with specific, characteristic orientations. The scientific study of crystals and crystal formation is known as crystallography. The process of crystal formation via mechanisms of crystal growth is called crystallization or solidification. The word ''crystal'' derives from the Ancient Greek word (), meaning both "ice" and "rock crystal", from (), "icy cold, frost". Examples of large crystals include snowflakes, diamonds, and table salt. Most inorganic solids are not crystals but polycrystals, i.e. many microscopic crystals fused together into a single solid. Polycrystals include most metals, rocks, ceramics, and ice. A third category ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Dicing
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a ''dicing saw'') or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Dicing saws may use a dicing blade with diamond particles, rotating at 30,000 RPM and cooled with deionized water. Once ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Diamond Tools
A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method. As diamond is a superhard material, diamond tools have many advantages as compared with tools made with common abrasives such as corundum and silicon carbide. History In '' Natural History'', Pliny wrote "When an ''adamas'' is successfully broken it disintegrates into splinters so small as to be scarcely visible. These are much sought after by engravers of gems and are inserted by them into iron tools because they make hollows in the hardest materials without difficulty." Advantages Diamond is one of the hardest natural materials on earth; much harder than corundum and silicon carbide. Diamond also has high strength, good wear resistance, and a low friction coefficient. So when used as an abrasive, it has many obvious advantages over many other common abrasives. Advantages of diamond grinding tools Diamond can be used to make grinding tools, whi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Disco Corporation
is a Japanese precision tools maker, especially for the semiconductor production industry. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. History The company was founded as Daiichi-Seitosho in May 1937, as an industrial abrasive wheel manufacturer. After World War II Japan faced a construction boom which also helped DISCO to boost its sales. The company's grinder discs were in high demand from utility companies, which needed them to manufacture watt-meters. In December 1968 the company developed and released an ultra-thin resinoid cutting wheel, ''Microncut''. The wheel contained diamond powder and as a result it was capable of making sharp, precision cuts as demanded in the semiconductor manufacturing process. There were no cutti ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
