A dicing saw is a kind of

saw A saw is a tool consisting of a tough blade, wire, or chain with a hard toothed edge. It is used to cut through material, very often wood, though sometimes metal or stone. The cut is made by placing the toothed edge against the material and mov ...

which employs a high-speed spindle fitted with an extremely thin

diamond blade A diamond blade is a saw blade which has diamonds fixed on its edge for cutting hard or abrasive materials. There are many types of diamond blade, and they have many uses, including cutting stone, concrete, asphalt, bricks, coal balls, glass, an ...

diamond wire A wire saw is a saw that uses a metal wire or cable for mechanical cutting of bulk solid material such as stone, wood, glass, ferrites, concrete, metals, crystals etc.. Industrial wire saws are usually powered. There are also hand-powered survi ...

to dice, cut, or groove

semiconductor A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. ...

wafers A wafer is a crisp, often sweet, very thin, flat, light and dry biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. Wafers can also be made into cookies with cream flavoring sandwiched between them. They ...

silicon Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic ta ...

glass Glass is a non-crystalline, often transparent, amorphous solid that has widespread practical, technological, and decorative use in, for example, window panes, tableware, and optics. Glass is most often formed by rapid cooling ( quenching ...

ceramic A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain ...

crystal A crystal or crystalline solid is a solid material whose constituents (such as atoms, molecules, or ions) are arranged in a highly ordered microscopic structure, forming a crystal lattice that extends in all directions. In addition, macro ...

, and many other types of material. Dicing saw is a kind of cutting machines. A cutter for use in dicing, and performs the cutting of the silicon wafer (

Wafer dicing In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sa ...

). At present, the mainstream cutting of silicon wafers with a diameter of 200mm or 300mm, 0.05mm square cut is also possible. Diamond blade to obscure the industrial diamond in the resin is the mainstream. Also, the thickness of the blades varies by the subject material is of about 20μm ~ 35μm is used when cutting the silicon wafer. Share accounted for 90% in only Japanese companies, such as DISCO Corporation and Accretech (Tokyo Seimitsu). In the past, half-cut to cut 2/3 degree of wafer thickness it was the mainstream, with the large diameter of the wafer size, on top of the tape mount, full cut cutting all the wafer is becoming mainstream. Along with it, before and after the process, from the dicing saw (split the rest of the wafer by pasting roller half pre-cut wafer tape to split chip) (half-cut) ⇒ expanded, the mounter (frame tape (mainly UV curable tape) and paste the wafer at the same time) ⇒ has been changed to a dicing saw (full cut) ⇒UV irradiation.

References

Saws {{Tool-stub

See also

References