Ceramic Capacitor
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Ceramic Capacitor
A ceramic capacitor is a fixed-value capacitor where the ceramic material acts as the dielectric. It is constructed of two or more alternating layers of ceramic and a metal layer acting as the electrodes. The composition of the ceramic material defines the electrical behavior and therefore applications. Ceramic capacitors are divided into two application classes: * Class 1 ceramic capacitors offer high stability and low losses for resonant circuit applications. * Class 2 ceramic capacitors offer high volumetric efficiency for buffer, by-pass, and coupling applications. Ceramic capacitors, especially multilayer ceramic capacitors (MLCCs), are the most produced and used capacitors in electronic equipment that incorporate approximately one trillion (1012) pieces per year.Download
Ceramic capacitors of special shapes and styles are ...
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Electronic Industries Alliance
The Electronic Industries Alliance (EIA; until 1997 Electronic Industries Association) was an American standards and trade organization composed as an alliance of trade associations for electronics manufacturers in the United States. They developed standards to ensure the equipment of different manufacturers was compatible and interchangeable. The EIA ceased operations on February 11, 2011, but the former sectors continue to serve the constituencies of EIA. History In 1924, 50 radio manufacturers in Chicago formed a trade group called the ''Associated Radio Manufacturers''. This organization was designed to control the licensing of the large number of radio patents so that each member could have access to all the relevant patents necessary to build radio transmitters, antennas and receivers. Over time, new electronic technologies brought new members, non-manufacturer members, and name changes. Names in chronological order: * 1924 – ''Associated Radio Manufacturers'' * ...
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International Electrotechnical Commission
The International Electrotechnical Commission (IEC; in French: ''Commission électrotechnique internationale'') is an international standards organization that prepares and publishes international standards for all electrical, electronic and related technologies – collectively known as "electrotechnology". IEC standards cover a vast range of technologies from power generation, transmission and distribution to home appliances and office equipment, semiconductors, fibre optics, batteries, solar energy, nanotechnology and marine energy as well as many others. The IEC also manages four global conformity assessment systems that certify whether equipment, system or components conform to its international standards. All electrotechnologies are covered by IEC Standards, including energy production and distribution, electronics, magnetics and electromagnetics, electroacoustics, multimedia, telecommunication and medical technology, as well as associated general disciplines such as t ...
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Ferroelectricity
Ferroelectricity is a characteristic of certain materials that have a spontaneous electric polarization that can be reversed by the application of an external electric field. All ferroelectrics are also piezoelectric and pyroelectric, with the additional property that their natural electrical polarization is reversible. The term is used in analogy to ferromagnetism, in which a material exhibits a permanent magnetic moment. Ferromagnetism was already known when ferroelectricity was discovered in 1920 in Rochelle salt by Joseph Valasek.See and Thus, the prefix ''ferro'', meaning iron, was used to describe the property despite the fact that most ferroelectric materials do not contain iron. Materials that are both ferroelectric ''and'' ferromagnetic are known as multiferroics. Polarization When most materials are electrically polarized, the polarization induced, ''P'', is almost exactly proportional to the applied external electric field ''E''; so the polarization is a linear fun ...
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Paraelectricity
In electromagnetism, a dielectric (or dielectric medium) is an electrical insulator that can be polarised by an applied electric field. When a dielectric material is placed in an electric field, electric charges do not flow through the material as they do in an electrical conductor, because they have no loosely bound, or free, electrons that may drift through the material, but instead they shift, only slightly, from their average equilibrium positions, causing dielectric polarisation. Because of dielectric polarisation, positive charges are displaced in the direction of the field and negative charges shift in the direction opposite to the field (for example, if the field is moving parallel to the positive ''x'' axis, the negative charges will shift in the negative ''x'' direction). This creates an internal electric field that reduces the overall field within the dielectric itself. If a dielectric is composed of weakly bonded molecules, those molecules not only become polarise ...
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Electromagnetic Interference
Electromagnetic interference (EMI), also called radio-frequency interference (RFI) when in the radio frequency spectrum, is a disturbance generated by an external source that affects an electrical circuit by electromagnetic induction, electrostatic coupling, or conduction. The disturbance may degrade the performance of the circuit or even stop it from functioning. In the case of a data path, these effects can range from an increase in error rate to a total loss of the data. Both man-made and natural sources generate changing electrical currents and voltages that can cause EMI: ignition systems, cellular network of mobile phones, lightning, solar flares, and auroras (northern/southern lights). EMI frequently affects AM radios. It can also affect mobile phones, FM radios, and televisions, as well as observations for radio astronomy and atmospheric science. EMI can be used intentionally for radio jamming, as in electronic warfare. History Since the earliest days of ra ...
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Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ...
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Through-hole Technology
In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. History Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the mid 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, bu ...
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Co-fired Ceramic
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications. Co-fired ceramic devices are fabricated using a multilayer approach. The starting material is composite green tapes, consisting of ceramic particles mixed with polymer binders. The tapes are flexible and can be machined, for example, using cutting, milling, punching and embossing. Metal structures can be added to the layers, commonly using filling and screen printing. Individual tapes are then bonded together in a lamination procedure before the devices are fired in a kiln, ...
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Doping (semiconductor)
In semiconductor production, doping is the intentional introduction of impurities into an intrinsic semiconductor for the purpose of modulating its electrical, optical and structural properties. The doped material is referred to as an extrinsic semiconductor. Small numbers of dopant atoms can change the ability of a semiconductor to conduct electricity. When on the order of one dopant atom is added per 100 million atoms, the doping is said to be ''low'' or ''light''. When many more dopant atoms are added, on the order of one per ten thousand atoms, the doping is referred to as ''high'' or ''heavy''. This is often shown as ''n+'' for n-type doping or ''p+'' for p-type doping. (''See the article on semiconductors for a more detailed description of the doping mechanism.'') A semiconductor doped to such high levels that it acts more like a conductor than a semiconductor is referred to as a degenerate semiconductor. A semiconductor can be considered i-type semiconductor if it has ...
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