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Yorkfield (microprocessor)
Yorkfield is the code name for some Intel processors sold as Core 2 Quad and Xeon. In Intel's Tick-Tock cycle, the 2007/2008 "Tick" was Penryn microarchitecture, the shrink of the Core microarchitecture to 45 nanometers as CPUID model 23, replacing Kentsfield, the previous model. Like its predecessor, Yorkfield multi-chip modules come in two sizes. The smaller version is equipped with 6MB L2 cache, and is commonly called Yorkfield-6M. The larger version is equipped with 12 MB L2 cache. The mobile version of Yorkfield is Penryn-QC and the dual-socket server version is Harpertown. The MP server Dunnington chip is a more distant relative based on a different chip but using the same 45 nm Core microarchitecture. The Wolfdale desktop processor is a dual-core version of Yorkfield. The successors to Yorkfield are the Nehalem based Lynnfield and Bloomfield. Variants Yorkfield Yorkfield (codename for the Core 2 Quad Q9x5x series and Xeon X33x0 series) features a dual-die ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Core 2
Intel Core 2 is the processor family encompassing a range of Intel's consumer 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single- die, whereas the quad-core models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range was the last flagship range of Intel desktop processors to use a front-side bus. The introduction of Core 2 relegated the Pentium brand to the mid-range market, and reunified laptop and desktop CPU lines for marketing purposes under the same product name, which were formerly divided into the Pentium 4, Pentium D, and Pentium M brands. The ''Core 2'' processor line was introduced on July 27, 2006, comprising the ''Duo'' (dual-core) and ''Extreme'' (dual- or quad-core CPUs for enthusiasts), and in 2007, the ''Quad'' (quad-core) and ''Solo'' (single-core) sub-brands. Intel Core 2 processors with vPro technology (designed for businesses) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nehalem (microarchitecture)
Nehalem is the codename for Intel's 45 nm microarchitecture released in November 2008. It was used in the first-generation of the Intel Core i5 and i7 processors, and succeeds the older Core microarchitecture used on Core 2 processors. The term "Nehalem" comes from the Nehalem River. Nehalem is built on the 45 nm process, is able to run at higher clock speeds, and is more energy-efficient than Penryn microprocessors. Hyper-threading is reintroduced, along with a reduction in L2 cache size, as well as an enlarged L3 cache that is shared among all cores. Nehalem is an architecture that differs radically from Netburst, while retaining some of the latter's minor features. Nehalem later received a die-shrink to 32 nm with Westmere, and was fully succeeded by "second-generation" Sandy Bridge in January 2011. Technology * Cache line block on L2/L3 cache was reduced from 128 bytes in Netburst & Conroe/Penryn to 64 bytes per line in this generation (same size as Yonah and Pe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Celeron
Celeron is Intel's brand name for low-end IA-32 and x86-64 computer microprocessor models targeted at low-cost personal computers. Celeron processors are compatible with IA-32 IA-32 (short for "Intel Architecture, 32-bit", commonly called i386) is the 32-bit version of the x86 instruction set architecture, designed by Intel and first implemented in the 80386 microprocessor in 1985. IA-32 is the first incarnation of ... software. They typically offer less performance per clock speed compared to flagship Intel CPU lines, such as the Pentium or Intel Core (microarchitecture), Core brands. Celeron branded processors often have less CPU cache, cache or intentionally disabled advanced features, with variable impact on performance. While some Celeron designs have achieved strong performance for their segment, most of the Celeron line has exhibited noticeably degraded performance. This has been the primary Market segmentation, justification for the higher cost of other Intel CPU ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wolfdale-DP (microprocessor)
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been mainta ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SSE4
SSE4 (Streaming SIMD Extensions 4) is a SIMD CPU instruction set used in the Intel Core microarchitecture and AMD K10 (K8L). It was announced on September 27, 2006, at the Fall 2006 Intel Developer Forum, with vague details in a white paper; more precise details of 47 instructions became available at the Spring 2007 Intel Developer Forum in Beijing, in the presentation. SSE4 is fully compatible with software written for previous generations of Intel 64 and IA-32 architecture microprocessors. All existing software continues to run correctly without modification on microprocessors that incorporate SSE4, as well as in the presence of existing and new applications that incorporate SSE4. SSE4 subsets Intel SSE4 consists of 54 instructions. A subset consisting of 47 instructions, referred to as ''SSE4.1'' in some Intel documentation, is available in Penryn. Additionally, ''SSE4.2'', a second subset consisting of the 7 remaining instructions, is first available in Nehalem-based Core i7 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
45 Nm
Per the International Technology Roadmap for Semiconductors, the 45 nm process is a MOSFET technology node referring to the average half-pitch of a memory cell manufactured at around the 2007–2008 time frame. Matsushita and Intel started mass-producing 45 nm chips in late 2007, and AMD started production of 45 nm chips in late 2008, while IBM, Infineon, Samsung, and Chartered Semiconductor have already completed a common 45 nm process platform. At the end of 2008, SMIC was the first China-based semiconductor company to move to 45 nm, having licensed the bulk 45 nm process from IBM. In 2008, TSMC moved on to a 40nm process. Many critical feature sizes are smaller than the wavelength of light used for lithography (i.e., 193 nm and 248 nm). A variety of techniques, such as larger lenses, are used to make sub-wavelength features. Double patterning has also been introduced to assist in shrinking distances between features, especially if dry lith ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Front Side Bus
A front-side bus (FSB) is a computer communication interface (bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus. The speed of the front side bus is often used as an important measure of the performance of a computer. The original front-side bus architecture has been replaced by HyperTransport, Intel QuickPath Interconnect or Direct Media Interface in modern volume CPUs. History The term came into use by Intel Corporation about the time the Pentium Pro and Pentium II products were announced, in the 1990s. "Front side" refers to the extern ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Core 2 Microprocessors
The Core 2 brand refers to Intel's x86 and x86-64 processors with the Core microarchitecture made for the consumer and business markets (except servers) above Pentium. The Core 2 Solo branch covered single-core CPUs for notebook computers, Core 2 Duo – dual-core CPUs for desktop and notebook computers, Core 2 Quad – quad-core CPUs for desktop and notebook computers, and Core 2 Extreme – dual-core and quad-core CPUs for desktop and notebook computers. Desktop processors Dual-Core Desktop processors Core 2 Duo = "Allendale" (65 nm, 800 MT/s) = *All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)'' * Die size: 111 mm2 * Steppings: L2, M0, G0 Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W. Note: The E4700 uses G0 Stepping which makes it a Conroe CPU. = "Conroe" ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Core 2
Intel Core 2 is the processor family encompassing a range of Intel's consumer 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single-die, whereas the quad-core models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range was the last flagship range of Intel desktop processors to use a front-side bus. The introduction of Core 2 relegated the Pentium brand to the mid-range market, and reunified laptop and desktop CPU lines for marketing purposes under the same product name, which were formerly divided into the Pentium 4, Pentium D, and Pentium M brands. The ''Core 2'' processor line was introduced on July 27, 2006, comprising the ''Duo'' (dual-core) and ''Extreme'' (dual- or quad-core CPUs for enthusiasts), and in 2007, the ''Quad'' (quad-core) and ''Solo'' (single-core) sub-brands. Intel Core 2 processors with vPro technology (designed for businesses) i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Intel Xeon Microprocessors
The following is a list of Intel Xeon microprocessors, by generation. P6-based * Pentium II Xeon 400 * Pentium II Xeon 400 * Pentium II Xeon 450 * Pentium II Xeon 450 * Pentium II Xeon 450 * Pentium III Xeon 500 * Pentium III Xeon 500 * Pentium III Xeon 500 * Pentium III Xeon 550 * Pentium III Xeon 550 * Pentium III Xeon 550 * Pentium III Xeon 600 * Pentium III Xeon 667 * Pentium III Xeon 700 * Pentium III Xeon 700 * Pentium III Xeon 733 * Pentium III Xeon 800 * Pentium III Xeon 866 * Pentium III Xeon 900 * Pentium III Xeon 933 * Pentium III Xeon 1.00 NetBurst-based * Xeon 1.4 * Xeon 1.5 * Xeon 1.7 * Xeon 2.0 * Xeon 1.8 * Xeon 2.0A * Xeon 2.0B * Xeon 2.2 * Xeon 2.4 * Xeon 2.4B * Xeon 2.6 * Xeon 2.66 * Xeon 2.8 * Xeon 2.8B * Xeon 3.0 * Xeon 3.06 * Xeon LV 1.6 * Xeon LV 2.0 * Xeon LV 2.4 * Xeon 2.4B * Xeon 2.8B * Xeon 3.06 * Xeon 3.2 * Xeon 3.2 * Xeon 2.8 * Xeon 2.8D * Xeon 3.0 * Xeon 3.0D * Xeon 3.2 * Xeon 3.4 * Xeon 3. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bloomfield (microprocessor)
Bloomfield is the code name for Intel high-end desktop processors sold as Core i7-9xx and single-processor servers sold as Xeon 35xx., in almost identical configurations, replacing the earlier Yorkfield processors. The Bloomfield core is closely related to the dual-processor Gainestown, which has the same CPUID value of 0106Ax (family 6, model 26) and which uses the same socket. Bloomfield uses a different socket than the later Lynnfield and Clarksfield processors based on the same 45 nm Nehalem microarchitecture, even though some of these share the same Intel Core i7 brand. Features Bloomfield has many new features that represent significant changes from Yorkfield: * The new LGA 1366 socket is incompatible with earlier processors. * On-die memory controller: the memory is directly connected to the processor. It is called the uncore part and runs at a different clock (uncore clock) than the execution cores. ** Three channel memory: each channel can support up to two D ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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