Xeon E5450
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Xeon E5450
Xeon (UP/DP), Dual Core " Allendale" (65 nm) * Based on Core microarchitecture * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x'' * All models support uni-processor configurations * Die size: 111 mm² * Steppings: L2 " Conroe" (65 nm) * Based on Core microarchitecture * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x'' * All models support uni-processor configurations * Die size: 143 mm² * Steppings: B2, G0 " Woodcrest" (65 nm) * Based on Core microarchitecture * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, EIST, XD bit (an NX bit implementation), Intel VT-x'' * All models support dual-processor configurations * Die size: 143 mm² * Steppings: B2, G0 * For processors with G0 stepping Vmin = 0.85 V " Wolfdale-CL" (45 nm) * Based on Penryn microarchitecture * All models support: '' MMX, SSE, SSE ...
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Conroe (microprocessor)
Conroe is the code name for many Intel processors sold as Core 2 Duo, Xeon, Pentium Dual-Core and Celeron. It was the first desktop processor to be based on the Core microarchitecture, replacing the NetBurst microarchitecture based Cedar Mill processor. It has product code 80557, which is shared with ''Allendale'' and ''Conroe-L'' that are very similar but have a smaller L2 cache. Conroe-L has only one processor core and a new CPUID model. The mobile version of Conroe is Merom, the dual-socket server version is Woodcrest, and the quad-core desktop version is Kentsfield. Conroe was replaced by the 45 nm Wolfdale processor. Variants Conroe The first Intel Core 2 Duo branded processor cores, code-named Conroe, were launched on July 27, 2006, at Fragapalooza, a yearly gaming event in Edmonton, Alberta, Canada. These processors were fabricated on 300 mm wafers using a 65 nm manufacturing process, and intended for desktop computers, as a replacement for the ...
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Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rat ...
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Clovertown (microprocessor)
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been mainta ...
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Yorkfield (microprocessor)
Yorkfield is the code name for some Intel processors sold as Core 2 Quad and Xeon. In Intel's Tick-Tock cycle, the 2007/2008 "Tick" was Penryn microarchitecture, the shrink of the Core microarchitecture to 45 nanometers as CPUID model 23, replacing Kentsfield, the previous model. Like its predecessor, Yorkfield multi-chip modules come in two sizes. The smaller version is equipped with 6MB L2 cache, and is commonly called Yorkfield-6M. The larger version is equipped with 12 MB L2 cache. The mobile version of Yorkfield is Penryn-QC and the dual-socket server version is Harpertown. The MP server Dunnington chip is a more distant relative based on a different chip but using the same 45 nm Core microarchitecture. The Wolfdale desktop processor is a dual-core version of Yorkfield. The successors to Yorkfield are the Nehalem based Lynnfield and Bloomfield. Variants Yorkfield Yorkfield (codename for the Core 2 Quad Q9x5x series and Xeon X33x0 series) features a dual-die ...
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Kentsfield (microprocessor)
Kentsfield is the code name of the first Intel desktop Core 2 Quad and quad-core Xeon#3200-series .22Kentsfield.22, Xeon CPUs, released on November 2, 2006. The top-of-the-line Kentsfields were Core 2 Extreme models numbered ''QX6x00'', while the mainstream Core 2 Quad models were numbered ''Q6x00''. All of them featured two 4 MiB L2 CPU cache, caches. The mainstream 65 nanometer Core 2 Quad Q6600, clocked at 2.4 GHz, was launched on January 8, 2007 at US$851 (reduced to US$530 on April 7, 2007). July 22, 2007 marked the release of the Core 2 Quad Q6700 and Core 2 Extreme QX6850 Kentsfields at US$530 and US$999 respectively; the price of the Q6600 was later reduced to US$266. Both Kentsfield and Kentsfield XE use product code 80562. Variants Kentsfield Analogous to the Pentium D branded CPUs, the Kentsfields comprise two separate silicon dies (each equivalent to a single Core 2 Duo) on one Multi-Chip Module, MCM. This results in lower costs, but a lesser share of the ...
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Wolfdale-DP (microprocessor)
Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Ultra Path Interconnect (UPI) bus. Overview The ''Xeon'' brand has been mainta ...
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Speedstep
Enhanced SpeedStep is a series of dynamic frequency scaling technologies (codenamed Geyserville and including SpeedStep, SpeedStep II, and SpeedStep III) built into some Intel microprocessors that allow the clock speed of the processor to be dynamically changed (to different ''P-states'') by software. This allows the processor to meet the instantaneous performance needs of the operation being performed, while minimizing power draw and heat generation. EIST (SpeedStep III) was introduced in several Prescott 6 series in the first quarter of 2005, namely the Pentium 4 660. Intel Speed Shift Technology (SST) was introduced in Intel Skylake Processor. Enhanced Intel SpeedStep Technology is sometimes abbreviated as EIST. Intel's trademark of "INTEL SPEEDSTEP" was cancelled due to the trademark being invalidated in 2012. Explanation Running a processor at high clock speeds allows for better performance. However, when the same processor is run at a lower frequency (speed), it generates ...
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LGA 771
LGA 771, also known as ''Socket J'', is a CPU interface introduced by Intel in 2006. It is used in Intel Core microarchitecture and NetBurst microarchitecture(Dempsey) based DP-capable server processors, the Dual-Core Xeon is codenamed Dempsey, Woodcrest, and Wolfdale and the Quad-Core processors Clovertown, Harpertown, and Yorkfield-CL. It is also used for the Core 2 Extreme QX9775, and blade servers designated under Conroe-CL. It was succeeded by LGA 1366 for the Nehalem-based Xeon processors. Technical specifications As its name implies, it is a land grid array with 771 contacts. The word "socket" in this instance is a misnomer, as the processor interface has no pin holes. Instead, it has 771 protruding lands which touch contact points on the underside of the microprocessor. The "J" in "Socket J" refers to the now-canceled processor codenamed " Jayhawk", which was expected to debut alongside this interface. It is intended as a successor to Socket 604 and takes muc ...
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SSE4
SSE4 (Streaming SIMD Extensions 4) is a SIMD CPU instruction set used in the Intel Core microarchitecture and AMD K10 (K8L). It was announced on September 27, 2006, at the Fall 2006 Intel Developer Forum, with vague details in a white paper; more precise details of 47 instructions became available at the Spring 2007 Intel Developer Forum in Beijing, in the presentation. SSE4 is fully compatible with software written for previous generations of Intel 64 and IA-32 architecture microprocessors. All existing software continues to run correctly without modification on microprocessors that incorporate SSE4, as well as in the presence of existing and new applications that incorporate SSE4. SSE4 subsets Intel SSE4 consists of 54 instructions. A subset consisting of 47 instructions, referred to as ''SSE4.1'' in some Intel documentation, is available in Penryn. Additionally, ''SSE4.2'', a second subset consisting of the 7 remaining instructions, is first available in Nehalem-based Core i7 ...
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Penryn (microarchitecture)
In Intel's Tick-Tock cycle, the 2007/2008 "Tick" was the shrink of the Core microarchitecture to 45 nanometers as CPUID model 23. In Core 2 processors, it is used with the code names Penryn (Socket P), Wolfdale (LGA 775) and Yorkfield (MCM, LGA 775), some of which are also sold as Celeron, Pentium and Xeon processors. In the Xeon brand, the Wolfdale-DP and Harpertown code names are used for LGA 771 based MCMs with two or four active Wolfdale cores. Architectural improvements over 65-nanometer Core 2 CPUs include a new divider with reduced latency, a new shuffle engine, and SSE4.1 instructions (some of which are enabled by the new single-cycle shuffle engine). Maximum L2 cache size per chip was increased from 4 to 6 MB, with L2 associativity increased from 16-way to 24-way. Cut-down versions with 3 MB L2 also exist, which are commonly called Penryn-3M and Wolfdale-3M as well as Yorkfield-6M, respectively. The single-core version of Penryn, listed as Penryn-L here, is not a sepa ...
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Wolfdale (microprocessor)
Wolfdale is the code name for a processor from Intel that is sold in varying configurations as Core 2 Duo, Celeron, Pentium and Xeon. In Intel's Tick-Tock cycle, the 2007/2008 "Tick" was Penryn microarchitecture, the shrink of the Core microarchitecture to 45 nanometers as CPUID model 23. This replaced the Conroe processor with ''Wolfdale''. The Wolfdale chips come in four sizes, with 6 MB and 3 MB L2 cache (Core 2 Duo); the smaller version is commonly called Wolfdale-3M, 2 MB L2 (Pentium), and 1 MB L2 (Celeron). The mobile version of Wolfdale is Penryn and the dual-socket server version is Wolfdale-DP. The Yorkfield desktop processor is a quad-core Multi-chip module of Wolfdale. Wolfdale was replaced by Nehalem based Clarkdale and its Sandy Bridge successor. Variants Wolfdale Wolfdale is the codename for the E8000 series of Core 2 Duo desktop processors and the Xeon 3100 server processor family. Released on January 20, 2008, the chips are manufactured using a ...
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SpeedStep
Enhanced SpeedStep is a series of dynamic frequency scaling technologies (codenamed Geyserville and including SpeedStep, SpeedStep II, and SpeedStep III) built into some Intel microprocessors that allow the clock speed of the processor to be dynamically changed (to different ''P-states'') by software. This allows the processor to meet the instantaneous performance needs of the operation being performed, while minimizing power draw and heat generation. EIST (SpeedStep III) was introduced in several Prescott 6 series in the first quarter of 2005, namely the Pentium 4 660. Intel Speed Shift Technology (SST) was introduced in Intel Skylake Processor. Enhanced Intel SpeedStep Technology is sometimes abbreviated as EIST. Intel's trademark of "INTEL SPEEDSTEP" was cancelled due to the trademark being invalidated in 2012. Explanation Running a processor at high clock speeds allows for better performance. However, when the same processor is run at a lower frequency (speed), it generates ...
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