Universal Flash Storage
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Universal Flash Storage
Universal Flash Storage (UFS) is a flash storage specification for digital cameras, mobile phones and consumer electronic devices. It was designed to bring higher data transfer speed and increased reliability to flash memory storage, while reducing market confusion and removing the need for different adapters for different types of cards. The standard encompasses both packages permanently attached (embedded) within a device (), and removable UFS memory cards. Overview UFS uses NAND flash. It may use multiple stacked 3D TLC NAND flash dies (integrated circuits) with an integrated controller. The proposed flash memory specification is supported by consumer electronics companies such as Nokia, Sony Ericsson, Texas Instruments, STMicroelectronics, Samsung, Micron, and SK Hynix. UFS is positioned as a replacement for and SD cards. The electrical interface for UFS uses the M-PHY, developed by the MIPI Alliance, a high-speed serial interface targeting 2.9 Gbit/s per lane with ...
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Unix File System
The Unix file system (UFS) is a family of file systems supported by many Unix and Unix-like operating systems. It is a distant descendant of the original filesystem used by Version 7 Unix. Design A UFS volume is composed of the following parts: * A few blocks at the beginning of the partition reserved for boot blocks (which must be initialized separately from the filesystem) * A superblock, containing a magic number identifying this as a UFS filesystem, and some other vital numbers describing this filesystem's geometry and statistics and behavioral tuning parameters * A collection of cylinder groups. Each cylinder group has the following components: ** A backup copy of the superblock ** A cylinder group header, with statistics, free lists, etc., about this cylinder group, similar to those in the superblock ** A number of inodes, each containing file attributes ** A number of data blocks Inodes are numbered sequentially, starting at 0. Inode 0 is reserved for unallocated ...
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SK Hynix
SK hynix Inc. is a South Korean supplier of dynamic random-access memory (DRAM) chips and flash memory chips. Hynix is the world's second-largest memory chipmaker (after Samsung Electronics) and the world's third-largest semiconductor company. Founded as Hyundai Electronic Industrial Co., Ltd. in 1983 and known as Hyundai Electronics, the company has manufacturing sites in Korea, the United States, mainland China and Taiwan. In 2012, when SK Telecom became its major shareholder, Hynix merged with SK Group (the third largest conglomerate in South Korea). The company's major customers include Microsoft, Apple, Asus, Dell, MSI, HP Inc., and Hewlett Packard Enterprise (formerly Hewlett-Packard). Other products that use Hynix memory include DVD players, cellular phones, set-top boxes, personal digital assistants, networking equipment, and hard disk drives. History * 1949: Founded as Gukdo construction. * 1983: Incorporated and renamed as Hyundai Electronics Industries Co., Ltd ...
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Kioxia
Kioxia Holdings Corporation (), simply known as Kioxia and stylized as KIOXIA, is an American-Japanese multinational computer memory manufacturer headquartered in Tokyo, Japan. The company was spun off from the Toshiba conglomerate as in June 2018. It became a wholly owned subsidiary company of Toshiba Memory Holdings Corporation on March 1, 2019, and was renamed Kioxia in October 2019. In the early 1980s, while still part of Toshiba, the company was credited with inventing flash memory. In the second quarter of 2021, the company was estimated to have 18.3% of the global revenue share for NAND flash solid-state drives. The company is the parent company of Kioxia Corporation. Name Kioxia is a combination of the Japanese word '' kioku'' meaning ''memory'' and the Greek word '' axia'' meaning ''value''. History In 1980, Fujio Masuoka, an engineer at Kioxia predecessor Toshiba, invented flash memory, and in 1984, Masuoka and his colleagues presented their invention of NOR fl ...
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Multi-chip Package
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ...
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Mobile World Congress
MWC Barcelona (formerly but still commonly referred to as Mobile World Congress) is an annual trade show organised by GSMA, dedicated primarily to the mobile communications industry. The event is held in Barcelona, Catalonia, Spain at the Fira de Barcelona Gran Via, usually in February or early-March. It is attended primarily by device manufacturers, network equipment providers, representatives of wireless carriers, and the press, among others. Its annual attendance is generally around 100,000 people, while mobile phone manufacturers often use the conference to unveil upcoming devices. GSMA has extended the MWC brand to two other trade shows in Shanghai, China (MWC Shanghai) and Las Vegas, United States (MWC Las Vegas, formerly MWC Los Angeles), but the brand remains most synonymous with the Barcelona event. History The name of the event has evolved over the years. The event's origin traces back to a business conference on "Pan Europe Digital Cellular Radio" (the original w ...
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Trade Association
A trade association, also known as an industry trade group, business association, sector association or industry body, is an organization founded and funded by businesses that operate in a specific Industry (economics), industry. An industry trade association participates in public relations activities such as advertising, education, publishing, lobbying, and political donations, but its focus is collaboration between companies. Associations may offer other services, such as producing conferences, holding networking or charitable events, or offering classes or educational materials. Many associations are non-profit organizations governed by bylaws and directed by officers who are also members. In countries with a social market economy, the role of trade associations is often taken by employers' organizations, which also take a role in social dialogue. Political influence One of the primary purposes of trade groups, particularly in the United States, is to attempt to influence p ...
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Linux Kernel
The Linux kernel is a free and open-source, monolithic, modular, multitasking, Unix-like operating system kernel. It was originally authored in 1991 by Linus Torvalds for his i386-based PC, and it was soon adopted as the kernel for the GNU operating system, which was written to be a free (libre) replacement for Unix. Linux is provided under the GNU General Public License version 2 only, but it contains files under other compatible licenses. Since the late 1990s, it has been included as part of a large number of operating system distributions, many of which are commonly also called Linux. Linux is deployed on a wide variety of computing systems, such as embedded devices, mobile devices (including its use in the Android operating system), personal computers, servers, mainframes, and supercomputers. It can be tailored for specific architectures and for several usage scenarios using a family of simple commands (that is, without the need of manually editing its source code ...
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JEDEC Solid State Technology Association
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States. JEDEC has over 300 members, including some of the world's largest computer companies. Its scope and past activities includes standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the lead-free manufacturing transition. The origin of JEDEC traces back to 1944, when RMA (subsequently renamed EIA) and NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council. NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became a separate trade association under the current name, but maintained an EIA alliance, until EIA ceased o ...
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Tagged Command Queuing
Tagged Command Queuing (TCQ) is a technology built into certain ATA and SCSIin the form of Parallel SCSI, Serial attached SCSI, and Fibre Channel drives hard drives. It allows the operating system to send multiple read and write requests to a hard drive. ATA TCQ is not identical in function to the more efficient Native Command Queuing (NCQ) used by SATA drives. SCSI TCQ does not suffer from the same limitations as ATA TCQ. Without TCQ, an operating system was limited to sending one request at a time. To boost performance, the OS had to determine the order of the requests based on its own possibly incorrect perspective of the hard drive activity (otherwise known as I/O scheduling). With TCQ, the drive can make its own decisions about how to order the requests (and in turn relieve the operating system from having to do so). Thus TCQ can improve the overall performance of a hard drive if it is implemented correctly. Overview For increased efficiency the sectors should be serviced ...
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LVDS
Low-voltage differential signaling (LVDS), also known as TIA/EIA-644, is a technical standard that specifies electrical characteristics of a differential, serial signaling standard. LVDS operates at low power and can run at very high speeds using inexpensive twisted-pair copper cables. LVDS is a physical layer specification only; many data communication standards and applications use it and add a data link layer as defined in the OSI model on top of it. LVDS was introduced in 1994, and has become popular in products such as LCD-TVs, in-car entertainment systems, industrial cameras and machine vision, notebook and tablet computers, and communications systems. The typical applications are high-speed video, graphics, video camera data transfers, and general purpose computer buses. Early on, the notebook computer and LCD display vendors commonly used the term LVDS instead of FPD-Link when referring to their protocol, and the term ''LVDS'' has mistakenly become synonymous with ' ...
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MIPI Alliance
MIPI Alliance is a global business alliance that develops technical specifications for the mobile ecosystem, particularly smart phones but including mobile-influenced industries. MIPI was founded in 2003 by ARM, Intel, Nokia, Samsung, STMicroelectronics and Texas Instruments Texas Instruments Incorporated (TI) is an American technology company headquartered in Dallas, Texas, that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globall .... Non-member organizations have limited access to MIPI standards, with some exceptions. The exceptions generally take the form of a ''public'' version of the standard. An example of one of these exceptions is the ''I3C (bus), I3C Basic standard'' which requires no license from MIPI to implement. The organization comprises about 330 member companies worldwide, 15 active working groups and has delivered more than 45 specifications within the mobile ecosystem ...
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