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UltraSPARC III
The UltraSPARC III, code-named "Cheetah", is a microprocessor that implements the SPARC, SPARC V9 instruction set architecture (ISA) developed by Sun Microsystems and fabricated by Texas Instruments. It was introduced in 2001 and operates at 600 to 900 MHz. It was succeeded by the UltraSPARC IV in 2004. Gary Lauterbach was the chief architect. History When presented at the '97 Microprocessor Forum, the probable introduction date for the UltraSPARC III was 1999, and it would have competed with Digital Equipment Corporation's Alpha 21264 and Intel's Itanium (Merced). This was not to be the case as it was delayed until 2001. Despite being late, it was awarded the Analysts' Choice Award for Best Server/Workstation Processor of 2001 by ''Microprocessor Report'' for its multiprocessing features. Description The UltraSPARC III is an Out-of-order execution, in-order superscalar microprocessor. The UltraSPARC III was designed for Shared memory (interprocess communication), sha ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sun Microsystems
Sun Microsystems, Inc. (Sun for short) was an American technology company that sold computers, computer components, software, and information technology services and created the Java programming language, the Solaris operating system, ZFS, the Network File System (NFS), and SPARC microprocessors. Sun contributed significantly to the evolution of several key computing technologies, among them Unix, RISC processors, thin client computing, and virtualized computing. Notable Sun acquisitions include Cray Business Systems Division, Storagetek, and ''Innotek GmbH'', creators of VirtualBox. Sun was founded on February 24, 1982. At its height, the Sun headquarters were in Santa Clara, California (part of Silicon Valley), on the former west campus of the Agnews Developmental Center. Sun products included computer servers and workstations built on its own RISC-based SPARC processor architecture, as well as on x86-based AMD Opteron and Intel Xeon processors. Sun also developed its own ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Memory Controller
The memory controller is a digital circuit that manages the flow of data going to and from the computer's main memory. A memory controller can be a separate chip or integrated into another chip, such as being placed on the same die or as an integral part of a microprocessor; in the latter case, it is usually called an integrated memory controller (IMC). A memory controller is sometimes also called a memory chip controller (MCC) or a memory controller unit (MCU). A common form of memory controller is the memory management unit (MMU) which in many operating systems implements virtual addressing. History Most modern desktop or workstation microprocessors use an ''integrated memory controller'' (IMC), including microprocessors from Intel, AMD, and those built around the ARM architecture. Prior to K8 (circa 2003), AMD microprocessors had a memory controller implemented on their motherboard's northbridge. In K8 and later, AMD employed an integrated memory controller. Likewis ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SPARC Microprocessors
SPARC (Scalable Processor Architecture) is a reduced instruction set computer (RISC) instruction set architecture originally developed by Sun Microsystems. Its design was strongly influenced by the experimental Berkeley RISC system developed in the early 1980s. First developed in 1986 and released in 1987, SPARC was one of the most successful early commercial RISC systems, and its success led to the introduction of similar RISC designs from many vendors through the 1980s and 1990s. The first implementation of the original 32-bit architecture (SPARC V7) was used in Sun's Sun-4 computer workstation and server systems, replacing their earlier Sun-3 systems based on the Motorola 68000 series of processors. SPARC V8 added a number of improvements that were part of the SuperSPARC series of processors released in 1992. SPARC V9, released in 1993, introduced a 64-bit architecture and was first released in Sun's UltraSPARC processors in 1995. Later, SPARC processors were used in sym ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fireplane
Fireplane is a computer internal interconnect created by Sun Microsystems. The Fireplane interconnect architecture is an evolutionary development of Sun's previous Ultra Port Architecture (UPA). It was introduced in October 2000 as the processor I/O interconnect in the Sun Blade 1000 workstation, followed in early 2001 by its use in the Sun Fire and Sun Fire 15K series enterprise servers. These coincided with the popular expansion of the web in the dot com boom and a shift of Sun's main market from Unix workstations to datacenter servers such as the Starfire, supporting high traffic web sites. Peak performance (in the Sun Blade 1000) reached 67.2 GBytes/second or a sustained 9.6 Gbit/s (2.4 Gbit/s for each processor). Each generation of Sun architecture had involved upgraded processors and matching upgrades to the bus or interconnect architectures that supported them. By this time, fast access to memory was becoming more important than simple CPU instruction speed for over ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
The Register
''The Register'' is a British technology news website co-founded in 1994 by Mike Magee, John Lettice and Ross Alderson. The online newspaper's masthead sublogo is "''Biting the hand that feeds IT''." Their primary focus is information technology news and opinions. Situation Publishing Ltd is listed as the site's publisher. Drew Cullen is an owner and Linus Birtles is the managing director. Andrew Orlowski was the executive editor before leaving the website in May 2019. History ''The Register'' was founded in London as an email newsletter called ''Chip Connection''. In 1998 ''The Register'' became a daily online news source. Magee left in 2001 to start competing publications ''The Inquirer'', and later the ''IT Examiner'' and ''TechEye''.Walsh, Bob (2007). ''Clear Blogging: How People Blogging Are Changing the World and How You Can Join Them.'' Apress, In 2002, ''The Register'' expanded to have a presence in London and San Francisco, creating ''The Register USA'' at ther ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
UltraSPARC T2
Sun Microsystems' UltraSPARC T2 microprocessor is a multithreading, multi-core CPU. It is a member of the SPARC family, and the successor to the UltraSPARC T1. The chip is sometimes referred to by its codename, Niagara 2. Sun started selling servers with the T2 processor in October 2007. New features The T2 is a commodity derivative of the UltraSPARC series of microprocessors, targeting Internet workloads in computers, storage and networking devices. The processor, manufactured in 65 nm, is available with eight CPU cores, and each core is able to handle eight threads concurrently. Thus the processor is capable of processing up to 64 concurrent threads. Other new features include: * Speed bump for each thread, which increased the frequency from 1.2 GHz to 1.6 GHz * One PCI Express port (x8 1.0) vs. the T1's JBus interface * Two Sun Neptune 10 Gigabit Ethernet ports (embedded into the T2 processor) with packet classification and filtering * L2 cache size increased to 4 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
UltraSPARC T1
Sun Microsystems' UltraSPARC T1 microprocessor, known until its 14 November 2005 announcement by its development codename "Niagara", is a multithreading, multicore CPU. Designed to lower the energy consumption of server computers, the CPU typically uses 72 W of power at 1.4 GHz. Afara Websystems pioneered a radical thread-heavy SPARC design. The company was purchased by Sun, and the intellectual property became the foundation of the CoolThreads line of processors, starting with the T1. The T1 is a new-from-the-ground-up SPARC microprocessor implementation that conforms to thUltraSPARC Architecture 2005 specificationand executes the full SPARC V9 instruction set. Sun has produced two previous multicore processors (UltraSPARC IV and IV+), but UltraSPARC T1 was its first microprocessor that is both multicore ''and'' multithreaded. Security was built-in from the very first release on silicon, with hardware cryptographic units in the T1, unlike general purpose processor from ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
UltraSPARC IV+
The UltraSPARC is a microprocessor developed by Sun Microsystems and fabricated by Texas Instruments, introduced in mid-1995. It is the first microprocessor from Sun to implement the 64-bit SPARC V9 instruction set architecture (ISA). Marc Tremblay was a co-microarchitect. Microarchitecture The UltraSPARC is a four-issue superscalar microprocessor that executes instructions in in-order. It has a nine-stage integer pipeline. Functional units The execution units were simplified relative to the SuperSPARC to achieve higher clock frequencies - an example of a simplification is that the ALUs were not cascaded, unlike the SuperSPARC, to avoid restricting clock frequency. The integer register file has 32 64-bit entries. As the SPARC ISA uses register windows, of which the UltraSPARC has eight, the actual number of registers is 144. The register file has seven read and three write ports. The integer register file provides registers to two arithmetic logic units and the load/ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Copper Interconnects
In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with better performance. They were first introduced by IBM, with assistance from Motorola, in 1997. The transition from aluminium to copper required significant developments in fabrication techniques, including radically different methods for patterning the metal as well as the introduction of barrier metal layers to isolate the silicon from potentially damaging copper atoms. Patterning Although some form of volatile copper compound has been known to exist since 1947, with more discovered as the century progressed, none were in industrial use, so copper could not be ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Aluminium Interconnects
In integrated circuits (ICs), interconnects are structures that connect two or more circuit elements (such as transistors) together electrically. The design and layout of interconnects on an IC is vital to its proper function, performance, power efficiency, reliability, and fabrication yield. The material interconnects are made from depends on many factors. Chemical and mechanical compatibility with the semiconductor substrate and the dielectric between the levels of interconnect is necessary, otherwise barrier layers are needed. Suitability for fabrication is also required; some chemistries and processes prevent the integration of materials and unit processes into a larger technology (recipe) for IC fabrication. In fabrication, interconnects are formed during the back-end-of-line after the fabrication of the transistors on the substrate. Interconnects are classified as ''local'' or ''global'' interconnects depending on the signal propagation distance it is able to support. The widt ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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