TDP Power Cap
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TDP Power Cap
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rat ...
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Heat
In thermodynamics, heat is defined as the form of energy crossing the boundary of a thermodynamic system by virtue of a temperature difference across the boundary. A thermodynamic system does not ''contain'' heat. Nevertheless, the term is also often used to refer to the thermal energy contained in a system as a component of its internal energy and that is reflected in the temperature of the system. For both uses of the term, heat is a form of energy. An example of formal vs. informal usage may be obtained from the right-hand photo, in which the metal bar is "conducting heat" from its hot end to its cold end, but if the metal bar is considered a thermodynamic system, then the energy flowing within the metal bar is called internal energy, not heat. The hot metal bar is also transferring heat to its surroundings, a correct statement for both the strict and loose meanings of ''heat''. Another example of informal usage is the term '' heat content'', used despite the fact that p ...
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Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of ...
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Accelerated Processing Unit
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit ( CPU) and integrated graphics processing unit (IGPU) on a single die. AMD announced the first generation APUs, ''Llano'' for high-performance and ''Brazos'' for low-power devices, in January 2011. The second generation ''Trinity'' for high-performance and ''Brazos-2'' for low-power devices were announced in June 2012. The third generation ''Kaveri'' for high performance devices were launched in January 2014, while ''Kabini'' and ''Temash'' for low-power devices were announced in the summer of 2013. Since the launch of the Zen microarchitecture, Ryzen and Athlon APUs have released to the global market as Raven Ridge on the DDR4 platform, after Bristol Ridge a year prior. AMD has also supplied semi-custom APUs for consoles starting with the release of Sony PlayStation 4 and Microsoft ...
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AMD Kaveri
AMD Steamroller Family 15h is a microarchitecture developed by AMD for AMD APUs, which succeeded Piledriver in the beginning of 2014 as the third-generation Bulldozer-based microarchitecture. Steamroller APUs continue to use two-core modules as their predecessors, while aiming at achieving greater levels of parallelism. Microarchitecture ''Steamroller'' still features two-core modules found in ''Bulldozer'' and ''Piledriver'' designs called clustered multi-thread (CMT), meaning that one module is marketed as a dual-core processor. The focus of ''Steamroller'' is for greater parallelism. Improvements center on independent instruction decoders for each core within a module, 25% more of the maximum width dispatches per thread, better instruction schedulers, improved perceptron branch predictor, larger and smarter caches, up to 30% fewer instruction cache misses, branch misprediction rate reduced by 20%, dynamically resizable L2 cache, micro-operations queue, more internal regist ...
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Haswell (microarchitecture)
Haswell is the codename for a processor microarchitecture developed by Intel as the "fourth-generation core" successor to the Ivy Bridge (which is a die shrink/tick of the Sandy Bridge microarchitecture). Intel officially announced CPUs based on this microarchitecture on June 4, 2013, at Computex Taipei 2013, while a working Haswell chip was demonstrated at the 2011 Intel Developer Forum. With Haswell, which uses a 22 nm process, Intel also introduced low-power processors designed for convertible or "hybrid" ultrabooks, designated by the "U" suffix. Haswell CPUs are used in conjunction with the Intel 8 Series chipsets, Intel 9 Series chipsets, and Intel C220 series chipsets. At least one Haswell-based processor is still being sold as of 2022, the Pentium G3420. Design The Haswell architecture is specifically designed to optimize the power savings and performance benefits from the move to FinFET (non-planar, "3D") transistors on the improved 22 nm pr ...
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Phoronix
Phoronix Test Suite (PTS) is a free and open-source benchmark software for Linux and other operating systems which is developed by Michael Larabel and Matthew Tippett. The Phoronix Test Suite has been endorsed by sites such as Linux.com, LinuxPlanet, and Softpedia. Features * Supports over 220 test profiles and over 60 test suites; * Uses an XML-based testing architecture. Tests include MEncoder, FFmpeg and lm sensors along with OpenGL games such as ''Doom 3'', ''Nexuiz'', and '' Enemy Territory: Quake Wars'', and many more. * Contains a feature called PTS Global where users are able to upload their test results and system information for sharing. Then through executing a single command, other users can compare their test results to a selected system in an easy-comparison mode; * Allows report benchmark results to the Phoronix Global online database; * Allows to compare results side-by-side; * Is extensible and new tests can be added easily * Can do anonymous usage reporting; ...
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AMD Turbo Core
AMD Turbo Core a.k.a. AMD Core Performance Boost (CPB) is a dynamic frequency scaling technology implemented by AMD that allows the processor to dynamically adjust and control the processor operating frequency in certain versions of its processors which allows for increased performance when needed while maintaining lower power and thermal parameters during normal operation. AMD Turbo Core technology has been implemented beginning with the Phenom II X6 microprocessors based on the AMD K10 microarchitecture. AMD Turbo Core is available with some AMD A-Series accelerated processing units. AMD Turbo Core is similar to Intel Turbo Boost, which is another dynamic processor frequency adjustment technology used to increase performance, as well as AMD PowerNow!, which is used to dynamically adjust laptop processor's operating frequencies in order to decrease power consumption (saving battery life), reduce heat, and lower noise. AMD PowerNow! is used to ''decrease'' processor frequenc ...
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Intel Turbo Boost
Intel Turbo Boost is Intel's trade name for central processing units (CPUs) dynamic frequency scaling feature that automatically raises certain versions of its operating frequency when demanding tasks are running, thus enabling a higher resulting performance. The frequency is accelerated when the operating system requests the highest performance state of the processor. Processor performance states are defined by the Advanced Configuration and Power Interface (ACPI) specification, an open standard supported by all major operating systems; no additional software or drivers are required to support the technology. The design concept behind Turbo Boost is commonly referred to as "dynamic overclocking". When the workload on the processor calls for faster performance, the processor's clock will try to increase the operating frequency in regular increments as required to meet demand. The increased clock rate is limited by the processor's power, current, and thermal limits, the number ...
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Conroe (microprocessor)
Conroe is the code name for many Intel processors sold as Core 2 Duo, Xeon, Pentium Dual-Core and Celeron. It was the first desktop processor to be based on the Core microarchitecture, replacing the NetBurst microarchitecture based Cedar Mill processor. It has product code 80557, which is shared with ''Allendale'' and ''Conroe-L'' that are very similar but have a smaller L2 cache. Conroe-L has only one processor core and a new CPUID model. The mobile version of Conroe is Merom, the dual-socket server version is Woodcrest, and the quad-core desktop version is Kentsfield. Conroe was replaced by the 45 nm Wolfdale processor. Variants Conroe The first Intel Core 2 Duo branded processor cores, code-named Conroe, were launched on July 27, 2006, at Fragapalooza, a yearly gaming event in Edmonton, Alberta, Canada. These processors were fabricated on 300 mm wafers using a 65 nm manufacturing process, and intended for desktop computers, as a replacement for the ...
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Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ...
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Electric Power
Electric power is the rate at which electrical energy is transferred by an electric circuit. The SI unit of power is the watt, one joule per second. Standard prefixes apply to watts as with other SI units: thousands, millions and billions of watts are called kilowatts, megawatts and gigawatts respectively. A common misconception is that electric power is bought and sold, but actually electrical energy is bought and sold. For example, electricity is sold to consumers in kilowatt-hours (kilowatts multiplied by hours), because energy is power multiplied by time. Electric power is usually produced by electric generators, but can also be supplied by sources such as electric batteries. It is usually supplied to businesses and homes (as domestic mains electricity) by the electric power industry through an electrical grid. Electric power can be delivered over long distances by transmission lines and used for applications such as motion, light or heat with high efficiency. ...
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Integrated Device Manufacturer
An integrated device manufacturer (IDM) is a semiconductor company which designs, manufactures, and sells integrated circuit (IC) products. IDM is often used to refer to a company which handles semiconductor manufacturing in-house, compared to a fabless semiconductor company, which outsources production to a third-party semiconductor fabrication plant. Examples of IDMs are Intel, Samsung, and Texas Instruments, examples of fabless companies are AMD, Nvidia, and Qualcomm, and examples of pure play foundries are GlobalFoundries, TSMC, and UMC. Due to the dynamic nature of the semiconductor industry, the term IDM has become less accurate than when it was coined. OSATs The term OSATs means "outsourced semiconductor assembly and test providers". OSATs have dominated IC packaging and testing.http://semiengineering.com/tag/osats/ outsourced semiconductor assembly and test providers (OSATs) Fabless operations The terms fabless (fabrication-less), foundry, and IDM are now used to ...
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