|
Thermal Management Of High-power LEDs
High power light-emitting diodes (LEDs) can use 350 milliwatts or more in a single LED. Most of the electricity in an LED becomes heat rather than light (about 70% heat and 30% light). If this heat is not removed, the LEDs run at high temperatures, which not only lowers their efficiency, but also makes the LED less reliable. Thus, thermal management of high power LEDs is a crucial area of research and development. It is necessary to limit both the junction and the phosphor particles temperatures to a value that will guarantee the desired LED lifetime. Thermal management is a universal problem having to do with power density, which occurs both at higher powers or in smaller devices. Many lighting applications wish to combine a high light flux with an extremely small light emitting substrate, causing concerns with LED power management to be particularly acute. Heat transfer procedure In order to maintain a low junction temperature to keep good performance of an LED, ev ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LED Package
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy in the form of photons. The color of the light (corresponding to the energy of the photons) is determined by the energy required for electrons to cross the band gap of the semiconductor. White light is obtained by using multiple semiconductors or a layer of light-emitting phosphor on the semiconductor device. Appearing as practical electronic components in 1962, the earliest LEDs emitted low-intensity infrared (IR) light. Infrared LEDs are used in remote-control circuits, such as those used with a wide variety of consumer electronics. The first visible-light LEDs were of low intensity and limited to red. Early LEDs were often used as indicator lamps, replacing small incandescent bulbs, and in seven-segment displays. Later developments produced LEDs available in visible, ultraviolet (UV), ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
P–n Junction
A p–n junction is a boundary or interface between two types of semiconductor materials, p-type and n-type, inside a single crystal of semiconductor. The "p" (positive) side contains an excess of holes, while the "n" (negative) side contains an excess of electrons in the outer shells of the electrically neutral atoms there. This allows electrical current to pass through the junction only in one direction. The p-n junction is created by doping, for example by ion implantation, diffusion of dopants, or by epitaxy (growing a layer of crystal doped with one type of dopant on top of a layer of crystal doped with another type of dopant). If two separate pieces of material were used, this would introduce a grain boundary between the semiconductors that would severely inhibit its utility by scattering the electrons and holes. p–n junctions are elementary "building blocks" of semiconductor electronic devices such as diodes, transistors, solar cells, light-emitting diodes (LEDs) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Copper
Copper is a chemical element with the symbol Cu (from la, cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement. Copper is one of the few metals that can occur in nature in a directly usable metallic form ( native metals). This led to very early human use in several regions, from circa 8000 BC. Thousands of years later, it was the first metal to be smelted from sulfide ores, circa 5000 BC; the first metal to be cast into a shape in a mold, c. 4000 BC; and the first metal to be purposely alloyed with another metal, tin, to create ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Aluminum
Aluminium (aluminum in American and Canadian English) is a chemical element with the symbol Al and atomic number 13. Aluminium has a density lower than those of other common metals, at approximately one third that of steel. It has a great affinity towards oxygen, and forms a protective layer of oxide on the surface when exposed to air. Aluminium visually resembles silver, both in its color and in its great ability to reflect light. It is soft, non-magnetic and ductile. It has one stable isotope, 27Al; this isotope is very common, making aluminium the twelfth most common element in the Universe. The radioactivity of 26Al is used in radiodating. Chemically, aluminium is a post-transition metal in the boron group; as is common for the group, aluminium forms compounds primarily in the +3 oxidation state. The aluminium cation Al3+ is small and highly charged; as such, it is polarizing, and bonds aluminium forms tend towards covalency. The strong affinity towards ox ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Radiation
Thermal radiation is electromagnetic radiation generated by the thermal motion of particles in matter. Thermal radiation is generated when heat from the movement of charges in the material (electrons and protons in common forms of matter) is converted to electromagnetic radiation. All matter with a temperature greater than absolute zero emits thermal radiation. At room temperature, most of the emission is in the infrared (IR) spectrum. Particle motion results in charge-acceleration or dipole oscillation which produces electromagnetic radiation. Infrared radiation emitted by animals (detectable with an infrared camera) and cosmic microwave background radiation are examples of thermal radiation. If a radiation object meets the physical characteristics of a black body in thermodynamic equilibrium, the radiation is called blackbody radiation. Planck's law describes the spectrum of blackbody radiation, which depends solely on the object's temperature. Wien's displacement law de ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Adhesive
Adhesive, also known as glue, cement, mucilage, or paste, is any non-metallic substance applied to one or both surfaces of two separate items that binds them together and resists their separation. The use of adhesives offers certain advantages over other binding techniques such as sewing, mechanical fastenings, or welding. These include the ability to bind different materials together, the more efficient distribution of stress across a joint, the cost-effectiveness of an easily mechanized process, and greater flexibility in design. Disadvantages of adhesive use include decreased stability at high temperatures, relative weakness in bonding large objects with a small bonding surface area, and greater difficulty in separating objects during testing. Adhesives are typically organized by the method of adhesion followed by ''reactive'' or ''non-reactive'', a term which refers to whether the adhesive chemically reacts in order to harden. Alternatively, they can be organized eithe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pressure
Pressure (symbol: ''p'' or ''P'') is the force applied perpendicular to the surface of an object per unit area over which that force is distributed. Gauge pressure (also spelled ''gage'' pressure)The preferred spelling varies by country and even by industry. Further, both spellings are often used ''within'' a particular industry or country. Industries in British English-speaking countries typically use the "gauge" spelling. is the pressure relative to the ambient pressure. Various units are used to express pressure. Some of these derive from a unit of force divided by a unit of area; the SI unit of pressure, the pascal (Pa), for example, is one newton per square metre (N/m2); similarly, the pound-force per square inch (psi) is the traditional unit of pressure in the imperial and U.S. customary systems. Pressure may also be expressed in terms of standard atmospheric pressure; the atmosphere (atm) is equal to this pressure, and the torr is defined as of this. Manometric u ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LEDs
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy in the form of photons. The color of the light (corresponding to the energy of the photons) is determined by the energy required for electrons to cross the band gap of the semiconductor. White light is obtained by using multiple semiconductors or a layer of light-emitting phosphor on the semiconductor device. Appearing as practical electronic components in 1962, the earliest LEDs emitted low-intensity infrared (IR) light. Infrared LEDs are used in remote-control circuits, such as those used with a wide variety of consumer electronics. The first visible-light LEDs were of low intensity and limited to red. Early LEDs were often used as indicator lamps, replacing small incandescent bulbs, and in seven-segment displays. Later developments produced LEDs available in visible, ultraviolet (UV) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Epoxy
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called ''epoxy''. The IUPAC name for an epoxide group is an oxirane. Epoxy resins may be reacted (cross-linked) either with themselves through catalytic homopolymerisation, or with a wide range of co-reactants including polyfunctional amines, acids (and acid anhydrides), phenols, alcohols and thiols (usually called mercaptans). These co-reactants are often referred to as hardeners or curatives, and the cross-linking reaction is commonly referred to as curing. Reaction of polyepoxides with themselves or with polyfunctional hardeners forms a thermosetting polymer, often with favorable mechanical properties and high thermal and chemical resistance. Epoxy has a wide range of applications, including metal coatings, composites, use in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Interface Material
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink). At each interface, a thermal boundary resistance exists to impede heat dissipation. In addition, the electronic performance and device lifetime can degrade dramatically under continuous overheating and large thermal stress at the interfaces. Therefore, for the last several decades, there have been intensive efforts in developing various TIMs with the aim of minimizing the thermal boundary resistance between layers and enhancing thermal management performance, as well as tackling application requirements such as low thermal stress between materials of different thermal expansion coefficients, low elastic modulus or viscosity, flexibility, and reusability: *T ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Resistance
Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. * (Absolute) thermal resistance ''R'' in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. * Specific thermal resistance or thermal resistivity ''Rλ'' in kelvin–metres per watt (K⋅m/W), is a material constant. * Thermal insulance has the units square metre kelvin per watt (m2⋅K/W) in SI units or square foot degree Fahrenheit– hours per British thermal unit (ft2⋅°F⋅h/Btu) in imperial units. It is the thermal resistance of unit area of a material. In terms of insulation, it is measured by the R-value. Absolute thermal resistance Absolute thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time. It is the reciprocal of thermal conductance. Th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
