|
Socket TR4
Socket TR4, also known as ''Socket SP3r2'', is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors. Socket TR4 is AMD's second LGA socket for a consumer product after the short lived Socket 1207 FX. It is physically identical to, but electrically incompatible with both AMD's server Socket SP3, and Socket TR4's successor socket, Socket sTRX4. While Socket SP3 does not require a chipset, instead utilising a system-on-a-chip design, Socket TR4 and its successor require a chipset to provide improved functionality. For Socket TR4, the AMD X399 chipset was developed, which supports a total of 64 PCIe 4.0 lanes for quad SLI/CrossFire configurations. The socket is made by both Foxconn and Lotes. Se ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Tr4 And 1950X
TR4 may refer to: * Socket TR4, a CPU socket for AMD processors * ''TR4'', '' Tomb Raider: The Last Revelation'', the fourth video game in the ''Tomb Raider'' series * TR4, a postal district in the TR postcode area * TR4, the cow-calf version of the EMD SW7 diesel locomotive * TR.4, a Canadian turbojet engine * The TR-4, musician group that recorded with Tommy Rettig * Travan TR-4, the fourth generation of the Travan mass storage magnetic tape computer backup cartridge * Triumph TR4, a British sports car * ''Fusarium oxysporum'' f.sp. ''cubense'' § Tropical Race 4, a disease of banana A banana is an elongated, edible fruit – botanically a berry – produced by several kinds of large herbaceous flowering plants in the genus ''Musa''. In some countries, bananas used for cooking may be called "plantains", distinguis ... plants See also * * * TR (other) {{Letter-NumberCombDisambig ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ryzen Threadripper
Ryzen ( ) is a brand of multi-core x86-64 microprocessors designed and marketed by AMD for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications. AMD announced a new series of processors on December 13, 2016, named "Ryzen", and delivered them in Q1 2017, the first of several generations. The 1000 series featured up to eight cores and 16 threads, with a 52% instructions per cycle (IPC) increase over their prior CPU products. The second generation of Ryzen processors, the Ryzen 2000 series, released in April 2018, featured the Zen+ microarchitecture, a 12 nm process (GlobalFoundries); the aggregate performance increased 10% (of which approximately 3% was IPC, 6% was frequency); most importantly, Zen+ fixed ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Foxconn
Hon Hai Precision Industry Co., Ltd., trading as Hon Hai Technology Group in China and Taiwan and Foxconn internationally, is a Taiwanese multinational electronics contract manufacturer established in 1974 with headquarters in Tucheng, New Taipei City, Taiwan. In 2021, the company's annual revenue reached () and was ranked 20th in the 2022 Fortune Global 500. It is the world's largest technology manufacturer and service provider. While headquartered in Taiwan, the company is the largest private employer in the People's Republic of China and one of the largest employers worldwide. Terry Gou is the company founder and former chairman. Foxconn manufactures electronic products for major American, Canadian, Chinese, Finnish, and Japanese companies. Notable products manufactured by Foxconn include the BlackBerry, iPad, iPhone, iPod, Kindle, all Nintendo gaming systems since the GameCube (except subsequent Nintendo DS models), Nokia devices, Sony devices (including the PlayStati ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD CrossFireX
AMD CrossFire (also known as CrossFireX) is a brand name for the multi-Graphics processing unit, GPU technology by Advanced Micro Devices, originally developed by ATI Technologies. The technology allows up to four GPUs to be used in a single computer to improve graphics performance. Associated technology used in mobile computers with external graphics cards, such as in laptops or notebooks, is called AMD Hybrid Graphics. The CrossFire brand name was retired by AMD in September 2017, however the company continues to develop and support the technology for DirectX 11 applications. For DirectX 12 applications, AMD has the mGPU (also known as multi-GPU) branding, with the difference being that software developers must create mGPU compatible profiles for their applications where before AMD created the profiles for DirectX 11 applications. Configurations First-generation CrossFire was first made available to the public on September 27, 2005. The system required a CrossFire-compliant ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Scalable Link Interface
Scalable Link Interface (SLI) is a brand name for a deprecated multi-GPU technology developed by Nvidia for linking two or more video cards together to produce a single output. SLI is a parallel processing algorithm for computer graphics, meant to increase the available processing power. The initialism SLI was first used by 3dfx for Scan-Line Interleave, which was introduced to the consumer market in 1998 and used in the Voodoo2 line of video cards. After buying out 3dfx, Nvidia acquired the technology but did not use it. Nvidia later reintroduced the SLI name in 2004 and intended for it to be used in modern computer systems based on the PCI Express (PCIe) bus; however, the technology behind the name SLI has changed dramatically requirincompatible motherboards Implementation SLI allows two, three, or four graphics processing units (GPUs) to share the workload when rendering real-time 3D computer graphics. Ideally, identical GPUs are installed on the motherboard that contains ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of AMD Chipsets
This is an overview of chipsets sold under the AMD brand, manufactured before May 2004 by the company itself, before the adoption of open platform approach as well as chipsets manufactured by ATI Technologies after October 2006 as the completion of the ATI acquisition. North- and Southbridges Northbridges AMD-xxx A-Link Express II A-Link Express and A-Link Express II are essentially PCIe 1.1 x4 lanes. See Comparison of ATI Chipsets for the comparison of chipsets sold under the ATI brand for AMD processors, before AMD's acquisition of ATI. A-Link Express III A-Link Express III is essentially PCIe 2.0 x4 lanes. Southbridges AMD-xxx 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. A-Link Express * All models support eSATA implementations of available SATA channels. 1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel. Fusion controller hubs (FCH) For AMD APU models from 2011 until 2016. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
System On A Chip
A system on a chip or system-on-chip (SoC ; pl. ''SoCs'' ) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include a central processing unit (CPU), memory interfaces, on-chip input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. It may contain digital, analog, mixed-signal, and often radio frequency signal processing functions (otherwise it is considered only an application processor). Higher-performance SoCs are often paired with dedicated and physically separate memory and secondary storage (such as LPDDR and eUFS or eMMC, respectively) chips, that may be layered on top of the SoC in what's known as a package on package (PoP) configuration, or be placed close to the SoC. Additionally, SoCs may use separate wireless modems. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket SP3
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is the same size as Socket TR4, and Socket sTRX4, users can use CPU coolers designed for not only those sockets, but CPU coolers designed for sTR4 and sTRX4. Socket SP3 is a system in a package socket - that means most features required to make the system fully functional (such as memory, PCI Express, SATA controllers etc.) are fully integrated into the processor, eliminating the need for a chipset to be placed on a motherboard. Variants for desktop platforms (as said below) are, eventually, requiring additional chipset to provide improved functionality of the system. A processor using socket SP3 is mounted by inserting the CPU into a slide and fixing the slide assembly by tightening three screws using the torque wrenches normally provided alongside the motherboard. Automated processor mo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket F
Socket F is a CPU socket designed by Advanced Micro Devices, AMD for its Opteron line of Central processing unit, CPUs released on August 15, 2006. In 2010 Socket F was replaced by Socket C32 for entry-level servers and Socket G34 for high-end servers. Technical specifications The socket has 1207 pins on a 1.1mm pitch and employs a land grid array contact mechanism. Socket F is primarily for use in AMD's Server (computing), server line and is considered to be in the same socket generation as Socket AM2, which is used for the Athlon 64 and Athlon 64 X2; as well as Socket S1, which is used for Turion 64 and Turion 64 X2 microprocessors. AMD Quad FX platform Socket F is the base for the AMD Quad FX Platform (referred to as "4x4" or "QuadFather" prior to release), unveiled by AMD on November 30, 2006. This modified version of Socket F, named Socket 1207 FX by AMD, and Socket L1 by NVIDIA, allows for dual-socket, dual-core (four effective cores and eight effective cores in the f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen (microarchitecture)
Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen (desktop and mobile), Ryzen Threadripper (workstation/high end desktop), and Epyc (server). Comparison History First generation The first generation Zen was launched with the Ryzen 1000 series of CPUs (codenamed Summit Ridge) in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs reached the market in early March 2017, and Zen-derived Epyc server processors (codenamed "Naples") launched in June 2017 and Zen-based APUs (codenamed "Raven Ridge") arrived in November 2017. This first iteration of Zen utilized Global Foundries' 14 nm manufacturing process. First generation refresh Zen+ was first released in April 2018, powering the second ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
_(15814067833).jpg "Click for more on -> Socket F")
