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Stencil Lithography
Stencil lithography is a novel method of fabricating nanometer scale patterns using nanostencils, stencils (shadow mask) with nanometer size apertures. It is a resist-less, simple, parallel nanolithography process, and it does not involve any heat or chemical treatment of the substrates (unlike resist-based techniques). History Stencil lithography was first reported in a scientific journal as a micro-structuring technique by S. Gray and P. K. Weimer in 1959. They used long stretched metallic wires as shadow masks during metal deposition. Various materials can be used as membranes, such as metals, Si, SixNy, and polymers. Today the stencil apertures can be scaled down to sub-micrometer size at full 4" wafer scale. This is called a nanostencil. Nano-scale stencil apertures have been fabricated using laser interference lithography (LIL), electron beam lithography, and focused ion beam lithography. Processes Several process are available using stencil lithography: material deposition ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Stencil
Stencilling produces an image or pattern on a surface, by applying pigment to a surface through an intermediate object, with designed holes in the intermediate object, to create a pattern or image on a surface, by allowing the pigment to reach only some parts of the surface. The stencil is both the resulting image or pattern and the intermediate object; the context in which ''stencil'' is used makes clear which meaning is intended. In practice, the (object) stencil is usually a thin sheet of material, such as paper, plastic, wood or metal, with letters or a design cut from it, used to produce the letters or design on an underlying surface by applying pigment through the cut-out holes in the material. The key advantage of a stencil is that it can be reused to repeatedly and rapidly produce the same letters or design. Although aerosol or painting stencils can be made for one-time use, typically they are made with the intention of being reused. To be reusable, they must remain int ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Apertures
In optics, an aperture is a hole or an opening through which light travels. More specifically, the aperture and focal length of an optical system determine the cone angle of a bundle of rays that come to a focus in the image plane. An optical system typically has many openings or structures that limit the ray bundles (ray bundles are also known as ''pencils'' of light). These structures may be the edge of a lens or mirror, or a ring or other fixture that holds an optical element in place, or may be a special element such as a diaphragm placed in the optical path to limit the light admitted by the system. In general, these structures are called stops, and the aperture stop is the stop that primarily determines the ray cone angle and brightness at the image point. In some contexts, especially in photography and astronomy, ''aperture'' refers to the diameter of the aperture stop rather than the physical stop or the opening itself. For example, in a telescope, the aperture ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nanolithography
Nanolithography (NL) is a growing field of techniques within nanotechnology dealing with the engineering (patterning e.g. etching, depositing, writing, printing etc) of nanometer-scale structures on various materials. The modern term reflects on a design of structures built in range of 10−9 to 10−6 meters, i.e. nanometer scale. Essentially, the field is a derivative of lithography, only covering very small structures. All NL methods can be categorized into four groups: photo lithography, scanning lithography, soft lithography and other miscellaneous techniques. History The NL has evolved from the need to increase the number of sub-micrometer features (e.g. transistors, capacitors etc.) in an integrated circuit in order to keep up with Moore's Law. While lithographic techniques have been around since the late 18th century, none were applied to nanoscale structures until the mid-1950s. With evolution of the semiconductor industry, demand for techniques capable of producing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Resist
A resist, used in many areas of manufacturing and art, is something that is added to parts of an object to create a pattern by protecting these parts from being affected by a subsequent stage in the process. Often the resist is then removed. For example in the resist dyeing of textiles, wax or a similar substance is added to places where the dye is not wanted. The wax will "resist" the dye, and after it is removed there will be a pattern in two colours. Batik, ''shibori'' and tie-dye are among many styles of resist dyeing. Wax or grease can also be used as a resist in pottery, to keep some areas free from a ceramic glaze; the wax burns away when the piece is fired. Song dynasty Jizhou ware used paper cut-outs and leaves as resists or stencils under glaze to create patterns. Other uses of resists in pottery work with slip or paints, and a whole range of modern materials used as resists. A range of similar techniques can be used in watercolour and other forms of painting. Whi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Interference Lithography
Interference lithography (or holographic lithography) is a technique for patterning regular arrays of fine features, without the use of complex optical systems or photomasks. Basic principle The basic principle is the same as in interferometry or holography. An interference pattern between two or more coherent light waves is set up and recorded in a recording layer (photoresist). This interference pattern consists of a periodic series of fringes representing intensity minima and maxima. Upon post-exposure photolithographic processing, a photoresist pattern corresponding to the periodic intensity pattern emerges. For 2-beam interference, the fringe-to-fringe spacing or period is given by \frac, where is the wavelength and is the angle between the two interfering waves. The minimum period achievable is then half the wavelength. By using 3-beam interference, arrays with hexagonal symmetry can be generated, while with 4 beams, arrays with rectangular symmetry or 3D photonic crystal ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electron Beam Lithography
Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with sub-10 nm resolution. This form of maskless lithography has high resolution and low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research and development. Systems Electron-beam lithography systems used in commercial applications ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Focused Ion Beam
Focused ion beam, also known as FIB, is a technique used particularly in the semiconductor industry, materials science and increasingly in the biological field for site-specific analysis, deposition, and ablation of materials. A FIB setup is a scientific instrument that resembles a scanning electron microscope (SEM). However, while the SEM uses a focused beam of electrons to image the sample in the chamber, a FIB setup uses a focused beam of ions instead. FIB can also be incorporated in a system with both electron and ion beam columns, allowing the same feature to be investigated using either of the beams. FIB should not be confused with using a beam of focused ions for direct write lithography (such as in proton beam writing). These are generally quite different systems where the material is modified by other mechanisms. Ion beam source Most widespread instruments are using liquid metal ion sources (LMIS), especially gallium ion sources. Ion sources based on elemental gold an ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Physical Vapor Deposition
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacturing of items which require thin films for optical, mechanical, electrical, acoustic or chemical functions. Examples include semiconductor devices such as thin-film solar cells, microelectromechanical devices such as thin film bulk acoustic resonator, aluminized PET film for food packaging and balloons, and titanium nitride coated cutting tools for metalworking. Besides PVD tools for fabrication, special smaller tools used mainly for scientific purposes have been developed. The source material i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electron Beam Physical Vapor Deposition
Electron-beam physical vapor deposition, or EBPVD, is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material. Introduction Thin-film deposition is a process applied in the semiconductor industry to grow electronic materials, in the aerospace industry to form thermal and chemical barrier coatings to protect surfaces against corrosive environments, in optics to impart the desired reflective and transmissive properties to a substrate and elsewhere in industry to modify surfaces to have a variety of desired properties. The deposition process can be broadly classified into physical vapor deposition (PVD) and chemical vapor deposition (CVD). In CVD, the film g ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Molecular Beam Epitaxy
Molecular-beam epitaxy (MBE) is an epitaxy method for thin-film deposition of single crystals. MBE is widely used in the manufacture of semiconductor devices, including transistors, and it is considered one of the fundamental tools for the development of nanotechnologies. MBE is used to fabricate diodes and MOSFETs (MOS field-effect transistors) at microwave frequencies, and to manufacture the lasers used to read optical discs (such as CDs and DVDs). History Original ideas of MBE process were first established by Günther. Films he deposited were not epitaxial, but were deposited on glass substrates. With the development of vacuum technology, MBE process was demonstrated by Davey and Pankey who succeeded in growing GaAs epitaxial films on single crystal GaAs substrates using Günther's method. Major subsequent development of MBE films was enabled by J.R. Arthur's investigations of kinetic behavior of growth mechanisms and Alfred Y. Cho's in situ observation of MBE process usi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sputtering
In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and can be an unwelcome source of wear in precision components. However, the fact that it can be made to act on extremely fine layers of material is utilised in science and industry—there, it is used to perform precise etching, carry out analytical techniques, and deposit thin film layers in the manufacture of optical coatings, semiconductor devices and nanotechnology products. It is a physical vapor deposition technique. Physics When energetic ions collide with atoms of a target material, an exchange of momentum takes place between them. These ions, known as "incident ions", set off collision cascades in the target. Such cascades can take many paths; some recoil back toward the surface of the target. If a collision cascade reaches the surfac ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
