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Smart Mobility Architecture
Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. Specification The SMARC hardware specification V1.0 was published by the Standardization Group for Embedded Technologies (SGET). SGET had its first meeting in 2012, headed by Engelbert Hörmannsdorfer. The specification is freely available as a download on the SGET website. Generally, SMARC modules are based on ARM architecture processors, they can, however, also be fitted with other low-power system on a chip (SoC) architectures, like, for example, ones based on x86 processors. Typically, SMARC modules’ power requirement is in the range of a few watts. Computer-on-modules integrate the core function of a bootable computer, as well as additional circuitry, including DRAM, boot-flash, voltage distribution, Ethernet and display transmitter. The modules are d ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Serial Peripheral Interface
The Serial Peripheral Interface (SPI) is a synchronous serial communication interface specification used for short-distance communication, primarily in embedded systems. The interface was developed by Motorola in the mid-1980s and has become a ''de facto'' standard. Typical applications include Secure Digital cards and liquid crystal displays. SPI devices communicate in full duplex mode using a master-slave architecture usually with a single master (though some Atmel and Silabs devices support changing roles on the fly depending on an external (SS) pin). The master (controller) device originates the frame for reading and writing. Multiple slave-devices may be supported through selection with individual chip select (CS), sometimes called slave select (SS) lines. Sometimes SPI is called a ''four-wire'' serial bus, contrasting with three-, two-, and one-wire serial buses. The SPI may be accurately described as a synchronous serial interface, but it is different from the Sync ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
ETX (form Factor)
ETX, standing for Embedded Technology eXtended, is an integrated and compact computer-on-module (COM) form factor, which can be used in a design application much like an integrated circuit component. Each ETX COM integrates core CPU and memory functionality, the common I/O of a PC/AT (serial, parallel, etc.), USB, audio, graphics, and Ethernet. All I/O signals as well as a full implementation of ISA and PCI buses are mapped to four high-density, low-profile connectors on the bottom side of the module. ETX boards are available with AMD Geode, VIA, Intel Atom, Pentium, Celeron and Core Duo processors. XTX offers a 75% pin-compatible upgrade path to ETX standard. XTX drops the ISA bus and adds PCI-Express, SATA, and LPC. COM Express was released in 2005 from PICMG. History The Embedded Technology eXtended (ETX) specification, first developed by Kontron (formerly *JUMPtec) in early 2000. In April 2006, the members of the ETX Industrial Group released the next generation o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
COM Express
COM Express, a computer-on-module (COM) form factor, is a highly integrated and compact computer that can be used in a design application much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics ( PEG), and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach. The COM modules plug into a baseboard that is typically customized to the application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions. COM Express is commonly used in Industrial, military, aerospace, gaming, medical, transportation, Internet of things, and general computing embedded applications. History The COM Express standard was first released in 2005 by the PCI Industrial Computer Manufacturers Group (PICMG). It defined five module types, each implementing differen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Gigabit Ethernet
In computer networking, Gigabit Ethernet (GbE or 1 GigE) is the term applied to transmitting Ethernet frames at a rate of a gigabit per second. The most popular variant, 1000BASE-T, is defined by the IEEE 802.3ab standard. It came into use in 1999, and has replaced Fast Ethernet in wired local networks due to its considerable speed improvement over Fast Ethernet, as well as its use of cables and equipment that are widely available, economical, and similar to previous standards. History Ethernet was the result of research conducted at Xerox PARC in the early 1970s, and later evolved into a widely implemented physical and link layer protocol. Fast Ethernet increased the speed from 10 to 100 megabits per second (Mbit/s). Gigabit Ethernet was the next iteration, increasing the speed to 1000 Mbit/s. * The initial standard for Gigabit Ethernet was produced by the IEEE in June 1998 as IEEE 802.3z, and required optical fiber. 802.3z is commonly referred to as 1000BASE-X, whe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices, a more detailed error detection and reporting mechanism (Advanced Error Reporting, AER), and native hot-swap functionality. More recent revisions of the PCIe standard provide hardware support for I/O virtualization. The PCI Express electrical interface is measured by the number of simultaneous lanes. (A lane is a single send/receive line of data. The analogy is a highway with traffic in both directions. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Serial ATA
SATA (Serial AT Attachment) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives, optical drives, and solid-state drives. Serial ATA succeeded the earlier Parallel ATA (PATA) standard to become the predominant interface for storage devices. Serial ATA industry compatibility specifications originate from the Serial ATA International Organization (SATA-IO) which are then promulgated by the INCITS Technical Committee T13, AT Attachment (INCITS T13). History SATA was announced in 2000 in order to provide several advantages over the earlier PATA interface such as reduced cable size and cost (seven conductors instead of 40 or 80), native hot swapping, faster data transfer through higher signaling rates, and more efficient transfer through an (optional) I/O queuing protocol. Revision 1.0 of the specification was released in January 2003. Serial ATA industry compatibility specifications originate from the Serial ATA Internat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
I²S
I²S (Inter-IC Sound, pronounced "eye-squared-ess"), is an electrical serial bus interface standard used for connecting digital audio devices together. It is used to communicate PCM audio data between integrated circuits in an electronic device. The I²S bus separates clock and serial data signals, resulting in simpler receivers than those required for asynchronous communications systems that need to recover the clock from the data stream. Alternatively I²S is spelled I2S (pronounced eye-two-ess) or IIS (pronounced eye-eye-ess). Despite the similar name, I²S is unrelated to the bidirectional I²C (IIC) bus. History This standard was introduced in 1986 by Philips Semiconductor (now NXP Semiconductors) and was first revised June 5, 1996. The standard was last revised on February 17, 2022 and updated terms ''master'' and ''slave'' to ''controller'' and ''target''. Details The I²S protocol outlines one specific type of PCM digital audio communication with defined paramete ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mobile PCI Express Module
A Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades. 1st generation configurations Smaller graphics modules can be inserted into larger slots, but type I and II heatsinks will not fit type III and above or vice versa. The Alienware m5700 platform uses a heatsink that will fit Type I, II, & III cards without modification. 2nd generation configurations (MXM 3) Smaller graphics modules can be inserted into larger slots. Heatsink mounting remains the same for type A and B modules. MXM 3.1 was released in March 2012 and added PCIe 3.0 support. Module compatibility First generation modules are ''not'' compatible with second generation modules and vice versa. First generation mo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer-on-module
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense package computer system for use in s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Adlink
ADLINK Technology Inc. ( ) is a company that designs and manufactures products for embedded computing, test and measurement, and automation applications. ADLINK's product line includes computer-on-modules, industrial motherboards, data acquisition modules and complete systems. Headquartered in Taiwan, ADLINK has operations in Beijing, Mannheim Mannheim (; Palatine German: or ), officially the University City of Mannheim (german: Universitätsstadt Mannheim), is the second-largest city in the German state of Baden-Württemberg after the state capital of Stuttgart, and Germany's 2 ..., Paris, San Jose, California, San Jose, Seoul, Shanghai, Shenzhen, Singapore and Tokyo. ADLINK sells to original equipment manufacturers (OEMs) and system integrators. ADLINK acquired Ampro Computers, Inc. in April 2008, and markets Ampro products under the brand Ampro by ADLINK. ADLINK acquired LiPPERT Embedded Computers GmbH in February 2012, and markets LiPPERT products under the brand Li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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