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Process Window
The process window is a graph with a range of parameters for a specific manufacturing process that yields a defined result. Typically multiple parameters are plotted in such a graph with a central region where the process behaves well, while the outer borders define regions where the process becomes unstable or returns an unfavourable result. A statistical evaluation of the process performance is further performed by the calculation of the associated Process Window Index. Applications Typical applications are found in photolithography where the response of a photoresist to parameters like temperature, radiation intensity, critical dimension and sidewall angle of the structures, etc. are plotted versus an optical parameter such as the numerical aperture In optics, the numerical aperture (NA) of an optical system is a dimensionless number that characterizes the range of angles over which the system can accept or emit light. By incorporating index of refraction in its definition, NA ...
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Process Window Index
Process Window Index (PWI) is a statistical measure that quantifies the robustness of a manufacturing process, e.g. one which involves heating and cooling, known as a thermal process. In manufacturing industry, PWI values are used to calibrate the heating and cooling of soldering jobs (known as a thermal profile) while baked in a reflow oven. PWI measures how well a process fits into a user-defined process limit known as the specification limit. The specification limit is the tolerance allowed for the process and may be statistically determined. Industrially, these specification limits are known as the ''process window'', and values that a plotted inside or outside this window are known as the process window index. Using PWI values, processes can be accurately measured, analyzed, compared, and tracked at the same level of statistical process control and quality control available to other manufacturing processes. Statistical process control Process capability is the ability of a ...
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Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature si ...
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Numerical Aperture
In optics, the numerical aperture (NA) of an optical system is a dimensionless number that characterizes the range of angles over which the system can accept or emit light. By incorporating index of refraction in its definition, NA has the property that it is constant for a beam as it goes from one material to another, provided there is no refractive power at the interface. The exact definition of the term varies slightly between different areas of optics. Numerical aperture is commonly used in microscopy to describe the acceptance cone of an objective (and hence its light-gathering ability and resolution), and in fiber optics, in which it describes the range of angles within which light that is incident on the fiber will be transmitted along it. General optics In most areas of optics, and especially in microscopy, the numerical aperture of an optical system such as an objective lens is defined by :\mathrm = n \sin \theta, where is the index of refraction of the medium i ...
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