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Potting (electronics)
In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge, for resistance to shock and vibration, and for the exclusion of water, moisture, or corrosive agents. When such materials are used only on the components, it is referred to as encapsulation. Thermosetting plastics or silicone rubber gels are often used, though epoxy resins are also very common. When epoxy resins are used, low chloride grades are usually specified. Many sites recommend using a potting product to protect sensitive electronic components from impact, vibration, and loose wires. In the potting process, an electronic assembly is placed inside a mold (i.e. the "pot") which is then filled with an insulating liquid compound that hardens, permanently protecting the assembly. The mold may be part of the finished article and may provide shielding or heat dissipating functions in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Potted Pcb Transformer
Small may refer to: Science and technology * SMALL, an ALGOL-like programming language * Small (anatomy), the lumbar region of the back * ''Small'' (journal), a nano-science publication * <small>, an HTML element that defines smaller text Arts and entertainment Fictional characters * Small, in the British children's show Big & Small Other uses * Small, of little size * Small (surname) * "Small", a song from the album '' The Cosmos Rocks'' by Queen + Paul Rodgers See also * Smal (other) * List of people known as the Small The Small is an epithet applied to: *Bolko II the Small (c. 1312–1368), Duke of Świdnica, of Jawor and Lwówek, of Lusatia, over half of Brzeg and Oława, of Siewierz, and over half of Głogów and Ścinawa *Dionysius Exiguus (c. 470–c. 5 ... * Smalls (other) {{disambiguation ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics
The field of electronics is a branch of physics and electrical engineering that deals with the emission, behaviour and effects of electrons using electronic devices. Electronics uses active devices to control electron flow by amplification and rectification, which distinguishes it from classical electrical engineering, which only uses passive effects such as resistance, capacitance and inductance to control electric current flow. Electronics has hugely influenced the development of modern society. The central driving force behind the entire electronics industry is the semiconductor industry sector, which has annual sales of over $481 billion as of 2018. The largest industry sector is e-commerce, which generated over $29 trillion in 2017. History and development Electronics has hugely influenced the development of modern society. The identification of the electron in 1897, along with the subsequent invention of the vacuum tube which could amplify and rectify small ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Corona Discharge
A corona discharge is an electrical discharge caused by the ionization of a fluid such as air surrounding a conductor (material), conductor carrying a high voltage. It represents a local region where the air (or other fluid) has undergone electrical breakdown and become conductive, allowing charge to continuously leak off the conductor into the air. A corona discharge occurs at locations where the strength of the electric field (potential gradient) around a conductor exceeds the dielectric strength of the air. It is often seen as a bluish glow in the air adjacent to pointed metal conductors carrying high voltages, and emits light by the same mechanism as a gas discharge lamp. In many high voltage applications, corona is an unwanted side effect. Corona discharge from high voltage electric power transmission lines constitutes an economically significant waste of energy for utilities. In high voltage equipment like cathode ray tube televisions, radio transmitters, X-ray mac ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermosetting Polymer
In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening (" curing") a soft solid or viscous liquid prepolymer (resin). Curing is induced by heat or suitable radiation and may be promoted by high pressure, or mixing with a catalyst. Heat is not necessarily applied externally, but is often generated by the reaction of the resin with a curing agent (''catalyst'', '' hardener''). Curing results in chemical reactions that create extensive cross-linking between polymer chains to produce an infusible and insoluble polymer network. The starting material for making thermosets is usually malleable or liquid prior to curing, and is often designed to be molded into the final shape. It may also be used as an adhesive. Once hardened, a thermoset cannot be melted for reshaping, in contrast to thermoplastic polymers which are commonly produced and distributed in the form of pellets, and shaped into the final product for ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Epoxy
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called ''epoxy''. The IUPAC name for an epoxide group is an oxirane. Epoxy resins may be reacted ( cross-linked) either with themselves through catalytic homopolymerisation, or with a wide range of co-reactants including polyfunctional amines, acids (and acid anhydrides), phenols, alcohols and thiols (usually called mercaptans). These co-reactants are often referred to as hardeners or curatives, and the cross-linking reaction is commonly referred to as curing. Reaction of polyepoxides with themselves or with polyfunctional hardeners forms a thermosetting polymer, often with favorable mechanical properties and high thermal and chemical resistance. Epoxy has a wide range of applications, including metal coatings, composites, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Conformal Coating
Conformal coating is a protective coating of thin polymeric film, applied to printed circuit boards (PCB). The coating is named conformal since it ''conforms'' to the contours of the PCB. Conformal coatings are typically applied at 25-250 μm to the electronic circuitry and provides it protection against moisture, dust, chemicals, and temperature extremities. Coatings can be applied in a number of ways, including brushing, spraying, dispensing and dip coating. Furthermore, a number of materials can be used as a conformal coating, such as acrylics, silicones, urethanes and parylene. Each has their own characteristics, making them preferred for certain environments and manufacturing scenarios. Most circuit board assembly firms coat assemblies with a layer of transparent conformal coating, which is lighter and easier to inspect than potting. Reasons for use Conformal coatings are used to protect electronic components from the environmental factors they are exposed to. Examples of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short lead (electronics), pins or leads of various styles, flat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Glass Transition Temperature
The glass–liquid transition, or glass transition, is the gradual and reversible transition in amorphous materials (or in amorphous regions within semicrystalline materials) from a hard and relatively brittle "glassy" state into a viscous or rubbery state as the temperature is increased. ISO 11357-2: Plastics – Differential scanning calorimetry – Part 2: Determination of glass transition temperature (1999). An amorphous solid that exhibits a glass transition is called a glass. The reverse transition, achieved by supercooling a viscous liquid into the glass state, is called vitrification. The glass-transition temperature ''T''g of a material characterizes the range of temperatures over which this glass transition occurs (as an experimental definition, typically marked as 100 s of relaxation time). It is always lower than the melting temperature, ''T''m, of the crystalline state of the material, if one exists. Hard plastics like polystyrene and poly(methyl methacrylate) a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Polyurethane
Polyurethane (; often abbreviated PUR and PU) refers to a class of polymers composed of organic units joined by carbamate (urethane) links. In contrast to other common polymers such as polyethylene and polystyrene, polyurethane is produced from a wide range of starting materials. This chemical variety produces polyurethanes with different chemical structures leading to many different applications. These include rigid and flexible foams, varnishes and coatings, adhesives, electrical potting compounds, and fibers such as spandex and PUL. Foams are the largest application accounting for 67% of all polyurethane produced in 2016. A polyurethane is typically produced by reacting an isocyanate with a polyol. Since a polyurethane contains two types of monomers, which polymerize one after the other, they are classed as alternating copolymers. Both the isocyanates and polyols used to make a polyurethane contain two or more functional groups per molecule. Global production in 2019 wa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicone
A silicone or polysiloxane is a polymer made up of siloxane (−R2Si−O−SiR2−, where R = organic group). They are typically colorless oils or rubber-like substances. Silicones are used in sealants, adhesives, lubricants, medicine, cooking utensils, thermal insulation, and electrical insulation. Some common forms include silicone oil, silicone grease, silicone rubber, silicone resin, and silicone caulk. Chemistry More precisely called polymerized siloxanes or polysiloxanes, silicones consist of an inorganic silicon–oxygen backbone chain (⋯−Si−O−Si−O−Si−O−⋯) with two organic groups attached to each silicon center. Commonly, the organic groups are methyl. The materials can be cyclic or polymeric. By varying the −Si−O− chain lengths, side groups, and crosslinking, silicones can be synthesized with a wide variety of properties and compositions. They can vary in consistency from liquid to gel to rubber to hard plastic. The most common si ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder Fatigue
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and semi-analytical closed-form equations. Overview Solder is a metal alloy used to form electrical, thermal, and mechanical interconnections between the component and printed circuit board (PCB) substrate in an electronic assembly. Although other forms of cyclic loading are known to cause solder fatigue, it has been estimated that the largest portion of electronic failures are thermomechanically driven due to temperature cycling. Under thermal cycling, stresses are generated in the solder due to coefficient of thermal expansion (CTE) mismatches. This causes the solder joints to experience non-recoverable deformation via creep and plasticity th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit Packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip sig ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
