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Plasma Activated Bonding
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE). Surface activation prior to bonding has the typical advantage that no intermediate layer is needed and sufficiently high bonding energy is achieved after annealing at temperatures below 400 °C. Overview The decrease of temperature is based on the increase of bonding strength using plasma activation on clean wafer surfaces. Further, the increase is caused by elevation in amount of Si-OH groups, removal of contaminants on the wafer surface, the enhancement of viscous flow of the surface layer and the enhanced diffusivity of water and gas trapped at the interface. Based on ambient pressure, two main surface activation fields using plasma treatment are established for wafer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Temperature
Temperature is a physical quantity that expresses quantitatively the perceptions of hotness and coldness. Temperature is measured with a thermometer. Thermometers are calibrated in various temperature scales that historically have relied on various reference points and thermometric substances for definition. The most common scales are the Celsius scale with the unit symbol °C (formerly called ''centigrade''), the Fahrenheit scale (°F), and the Kelvin scale (K), the latter being used predominantly for scientific purposes. The kelvin is one of the seven base units in the International System of Units (SI). Absolute zero, i.e., zero kelvin or −273.15 °C, is the lowest point in the thermodynamic temperature scale. Experimentally, it can be approached very closely but not actually reached, as recognized in the third law of thermodynamics. It would be impossible to extract energy as heat from a body at that temperature. Temperature is important in all fields of natur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reactive-ion Etching
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it. Equipment A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few millitorr and a few hundred millitorr by adj ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electrode
An electrode is an electrical conductor used to make contact with a nonmetallic part of a circuit (e.g. a semiconductor, an electrolyte, a vacuum or air). Electrodes are essential parts of batteries that can consist of a variety of materials depending on the type of battery. The electrophore, invented by Johan Wilcke, was an early version of an electrode used to study static electricity. Anode and cathode in electrochemical cells Electrodes are an essential part of any battery. The first electrochemical battery made was devised by Alessandro Volta and was aptly named the Voltaic cell. This battery consisted of a stack of copper and zinc electrodes separated by brine-soaked paper disks. Due to fluctuation in the voltage provided by the voltaic cell it wasn't very practical. The first practical battery was invented in 1839 and named the Daniell cell after John Frederic Daniell. Still making use of the zinc–copper electrode combination. Since then many more batteries have be ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dielectric
In electromagnetism, a dielectric (or dielectric medium) is an electrical insulator that can be polarised by an applied electric field. When a dielectric material is placed in an electric field, electric charges do not flow through the material as they do in an electrical conductor, because they have no loosely bound, or free, electrons that may drift through the material, but instead they shift, only slightly, from their average equilibrium positions, causing dielectric polarisation. Because of dielectric polarisation, positive charges are displaced in the direction of the field and negative charges shift in the direction opposite to the field (for example, if the field is moving parallel to the positive ''x'' axis, the negative charges will shift in the negative ''x'' direction). This creates an internal electric field that reduces the overall field within the dielectric itself. If a dielectric is composed of weakly bonded molecules, those molecules not only become polaris ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electric Spark
An electric spark is an abrupt electrical discharge that occurs when a sufficiently high electric field creates an ionized, electrically conductive channel through a normally-insulating medium, often air or other gases or gas mixtures. Michael Faraday described this phenomenon as "the beautiful flash of light attending the discharge of common electricity". The rapid transition from a non-conducting to a conductive state produces a brief emission of light and a sharp crack or snapping sound. A spark is created when the applied electric field exceeds the dielectric breakdown strength of the intervening medium. For air, the breakdown strength is about 30 kV/cm at sea level. Experimentally, this figure tends to differ depending upon humidity, atmospheric pressure, shape of electrodes (needle and ground-plane, hemispherical etc.) and the corresponding spacing between them and even the type of waveform, whether sinusoidal or cosine-rectangular. At the beginning stages, free electrons ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Atmospheric Pressure
Atmospheric pressure, also known as barometric pressure (after the barometer), is the pressure within the atmosphere of Earth. The standard atmosphere (symbol: atm) is a unit of pressure defined as , which is equivalent to 1013.25 millibars, 760mm Hg, 29.9212 inchesHg, or 14.696psi.International Civil Aviation Organization. ''Manual of the ICAO Standard Atmosphere'', Doc 7488-CD, Third Edition, 1993. . The atm unit is roughly equivalent to the mean sea-level atmospheric pressure on Earth; that is, the Earth's atmospheric pressure at sea level is approximately 1 atm. In most circumstances, atmospheric pressure is closely approximated by the hydrostatic pressure caused by the weight of air above the measurement point. As elevation increases, there is less overlying atmospheric mass, so atmospheric pressure decreases with increasing elevation. Because the atmosphere is thin relative to the Earth's radius—especially the dense atmospheric layer at low altitudes—the Earth's gravi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dielectric Barrier Discharge
Dielectric-barrier discharge (DBD) is the electrical discharge between two electrodes separated by an insulating dielectric barrier. Originally called silent (inaudible) discharge and also known as ozone production discharge or partial discharge, it was first reported by Ernst Werner von Siemens in 1857.Kogelschatz, Ulrich, Baldur Eliasson, and Walter EgliFrom ozone generators to flat television screens: history and future potential of dielectric-barrier discharges Pure Applied Chemistry, Vol. 71, No. 10, pp. 1819-1828, 1999. Retrieved on 2007-08-05. Process The process normally uses high voltage alternating current, ranging from lower RF to microwave frequencies. However, other methods were developed to extend the frequency range all the way down to the DC. One method was to use a high resistivity layer to cover one of the electrodes. This is known as the resistive barrier discharge.M. Laroussi, I. Alexeff, J. P. Richardson, and F. F. Dyer " The Resistive Barrier Discharge ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bulk Material
Bulk cargo is commodity cargo that is transported unpackaged in large quantities. Description Bulk cargo refers to material in either liquid or granular, particulate form, as a mass of relatively small solids, such as petroleum/crude oil, grain, coal, or gravel. This cargo is usually dropped or poured, with a spout or shovel bucket, into a bulk carrier ship's hold, railroad car/ railway wagon, or tanker truck/ trailer/semi-trailer body. Smaller quantities can be boxed (or drummed) and palletised; cargo packaged in this manner is referred to as breakbulk cargo. Bulk cargo is classified as liquid or dry. The Baltic Exchange is based in London and provides a range of indices benchmarking the cost of moving bulk commodities, dry and wet, along popular routes around the seas. Some of these indices are also used to settle Freight Futures, known as FFA's. The most famous of the Baltic indices is the Baltic Dry Indices, commonly called the BDI. This is a derived function of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bond Characterization
The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by void formation in the interface due to unevenness or impurities. The bond connection is characterized for wafer bond development or quality assessment of fabricated wafers and sensors. Overview Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. The bond strength can be evaluated using double cantilever beam or chevron respectively micro-chevron tests. Other pull tests as well as burst, direct shear tests or bend tests enable the determination of the bond strength. The packaging hermeticity is characterized using membrane, He-leak, resonator/pressure tests. Three additional possibilities to evaluate the bond connection are optical, electron and Acoustical measurements and instrumentati ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fracture Toughness
In materials science, fracture toughness is the critical stress intensity factor of a sharp crack where propagation of the crack suddenly becomes rapid and unlimited. A component's thickness affects the constraint conditions at the tip of a crack with thin components having plane stress conditions and thick components having plane strain conditions. Plane strain conditions give the lowest fracture toughness value which is a material property. The critical value of stress intensity factor in mode I loading measured under plane strain conditions is known as the plane strain fracture toughness, denoted K_\text. When a test fails to meet the thickness and other test requirements that are in place to ensure plane strain conditions, the fracture toughness value produced is given the designation K_\text. Fracture toughness is a quantitative way of expressing a material's resistance to crack propagation and standard values for a given material are generally available. Slow self-sust ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bond Strength
In chemistry, bond energy (''BE''), also called the mean bond enthalpy or average bond enthalpy is the measure of bond strength in a chemical bond. IUPAC defines bond energy as the average value of the gas-phase bond-dissociation energy (usually at a temperature of 298.15 K) for all bonds of the same type within the same chemical species. The bond dissociation energy (enthalpy) is also referred to as bond disruption energy, bond energy, bond strength, or binding energy (abbreviation: ''BDE'', ''BE'', or ''D''). It is defined as the standard enthalpy change of the following fission: R - ''X'' → R + ''X''. The ''BDE'', denoted by Dº(R - ''X''), is usually derived by the thermochemical equation, : \begin \mathrmX) \ = \Delta H^\circ_f\mathrm + \Delta H^\circ_f(X) - \Delta H^\circ_f(\mathrmX) \end The enthalpy of formation Δ''Hf''º of a large number of atoms, free radicals, ions, clusters and compounds is available from the websites of NIST, NASA, CODATA, and IUPAC. Most au ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
