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Occam Process
The Occam process is a solder-free, Restriction of Hazardous Substances Directive (RoHS)-compliant method for use in the manufacturing of electronic circuit boards developed by Verdant Electronics. It combines the usual two steps of the construction of printed circuit boards (PCBs) followed by the population process of placing various leaded and non-leaded electronic components into one process. Overview Electronic components are first positioned onto an adhesive layer of a temporary or permanent substrate according to the customers needs and design parameters. Then, the pre-tested, burned-in components are held firm in their positions through encapsulating them in insulating material and the entire assembly is then inverted. The adhesive layer is then cut (after removing the temporary substrate if it exists) or drilled out over the component leads mechanically or by laser ablation. These holes are then plated with a conductive, copper connection (vias) from the top of this laye ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder
Solder (; NA: ) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Restriction Of Hazardous Substances Directive
The Restriction of Hazardous Substances Directive 2002/95/EC (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union. The initiative was to prevent an overabundance of chemicals in electronics. Thus, as a result electronics were restricted. The RoHS 1 directive took effect on 1 July 2006, and is required to be enforced and became a law in each member state. This directive restricts (with exceptions) the use of ten hazardous materials in the manufacture of various types of electronic and electrical equipment. In addition to the exceptions, there are exclusions for products such as solar panels. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC (now superseded) which sets collection, recycling and recovery targets for electrical goods and is part of a legislative initiative to solve the problem of h ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Laser Ablation
Laser ablation or photoablation (also called laser blasting) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser, but it is possible to ablate material with a continuous wave laser beam if the laser intensity is high enough. While relatively long laser pulses (e.g. nanosecond pulses) can heat and thermally alter or damage the processed material, ultrashort laser pulses (e.g. femtoseconds) cause only minimal material damage during processing due to the ultrashort light-matter interaction and are therefore also suitable for micromaterial processing. Excimer lasers of deep ultra-violet light are mainly used in photoablation; the wavelength of laser used in photoablation is ap ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Via (electronics)
A via (Latin for ''path'' or ''way'') is an electrical connection between copper layers in a printed circuit board. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with copper that forms electrical connection through the insulation that separates the copper layers. Vias are important for PCB manufacturing. This is because the vias are drilled with certain tolerances and may be fabricated off their designated locations, so some allowance for errors in drill position must be made prior to manufacturing or else the manufacturing yield can decrease due to non-conforming boards (according to some reference standard) or even due to failing boards. In addition, regular through hole vias are considered fragile structures as they are long and narrow; the manufacturer must ensure that the vias are plated properly throughout the barrel and this in turn causes several processing steps. In printed circuit boards In printed c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Conformal Coating
Conformal coating is a protective coating of thin polymeric film, applied to printed circuit boards (PCB). The coating is named conformal since it ''conforms'' to the contours of the PCB. Conformal coatings are typically applied at 25-250 μm to the electronic circuitry and provides it protection against moisture, dust, chemicals, and temperature extremities. Coatings can be applied in a number of ways, including brushing, spraying, dispensing and dip coating. Furthermore, a number of materials can be used as a conformal coating, such as acrylics, silicones, urethanes and parylene. Each has their own characteristics, making them preferred for certain environments and manufacturing scenarios. Most circuit board assembly firms coat assemblies with a layer of transparent conformal coating, which is lighter and easier to inspect than potting. Reasons for use Conformal coatings are used to protect electronic components from the environmental factors they are exposed to. Examples of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
William Of Ockham
William of Ockham, OFM (; also Occam, from la, Gulielmus Occamus; 1287 – 10 April 1347) was an English Franciscan friar, scholastic philosopher, apologist, and Catholic theologian, who is believed to have been born in Ockham, a small village in Surrey. He is considered to be one of the major figures of medieval thought and was at the centre of the major intellectual and political controversies of the 14th century. He is commonly known for Occam's razor, the methodological principle that bears his name, and also produced significant works on logic, physics and theology. William is remembered in the Church of England with a commemoration on 10 April. Life William of Ockham was born in Ockham, Surrey in 1287. He received his elementary education in the London House of the Greyfriars. It is believed that he then studied theology at the University of OxfordSpade, Paul Vincent (ed.). ''The Cambridge Companion to Ockham''. Cambridge University Press, 1999, p. 20.He has long be ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Whisker (metallurgy)
Metal whiskering is a phenomenon which occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads, causing short circuits. Metal whiskers form in the presence of compressive stress. Germanium, zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem, including changes to the annealing process (heating and cooling), the addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders. Following the Restriction of Hazardous Substances Directive (RoHS), the European Union banned the use of lead in most consumer electronic products from 2006 d ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reflow Soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inse ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Moisture Sensitivity Level
Moisture sensitivity level (MSL) relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (30 °C/85%RH at Level 1; 30 °C/60%RH at all other levels). Increasingly, semiconductors have been manufactured in smaller sizes. Components such as thin fine-pitch devices and ball grid arrays could be damaged during SMT reflow when moisture trapped inside the component expands. The expansion of trapped moisture can result in internal separation (delamination) of the plastic from the die or lead-frame, wire bond damage, die damage, and internal cracks. Most of this damage is not visible on the component surface. In extreme cases, cracks will extend to the component surface. In the most severe cases, the component will bulge and pop. This is known as the "popcorn" effect. This occurs when part temperature rises rapidly to a high ma ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Disruptive Technology
In business theory, disruptive innovation is innovation that creates a new market and value network or enters at the bottom of an existing market and eventually displaces established market-leading firms, products, and alliances. The concept was developed by the American academic Clayton Christensen and his collaborators beginning in 1995, and has been called the most influential business idea of the early 21st century. Lingfei Wu, Dashun Wang, and James A. Evans generalized this term to identify disruptive science and technological advances from more than 65 million papers, patents and software products that span the period 1954–2014. Their work was featured as the cover of the February 2019 issue of ''Nature'' and was selected as the Altmetric 100 most-discussed work in 2019. Not all innovations are disruptive, even if they are revolutionary. For example, the first automobiles in the late 19th century were not a disruptive innovation, because early automobiles were expensiv ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Toxicology Letters
''Toxicology Letters'' is a peer-reviewed scientific journal for the rapid publication of short reports on all aspects of toxicology, especially mechanisms of toxicity. Toxicology Letters is the official journal of Eurotox.Website of Toxicology Letters at Elsevier accessed on March, 9th, 2013. ''(Eurotox exists as a Society within the meaning of Art. 60 et seq. of the . The registered address of Eurotox is in .)'' Editors-in-chief are Wolfgang Dek ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
