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NORBIT
In electronics, the NORBIT family of modules is a very early form (since 1960) of digital logic developed by Philips (and also provided through and Mullard) that uses modules containing discrete components to build logic function blocks in resistor–transistor logic (RTL) or diode–transistor logic (DTL) technology. Overview The system was originally conceived as building blocks for solid-state hard-wired programmed logic controllers (the predecessors of programmable logic controllers (PLC)) to replace electro-mechanical relay logic in industrial control systems for process control and automation applications, similar to early Telefunken/ AEG Logistat, Siemens Simatic, BBC Sigmatronic, ACEC Logacec or Estacord systems. Each available logical function was recognizable by the color of its plastic container, black, blue, red, green, violet, etc. The most important circuit block contained a NOR gate (hence the name), but there were also blocks containing drivers, and a t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Automation
Automation describes a wide range of technologies that reduce human intervention in processes, namely by predetermining decision criteria, subprocess relationships, and related actions, as well as embodying those predeterminations in machines. Automation has been achieved by various means including mechanical, hydraulic, pneumatic, electrical, electronic devices, and computers, usually in combination. Complicated systems, such as modern factories, airplanes, and ships typically use combinations of all of these techniques. The benefit of automation includes labor savings, reducing waste, savings in electricity costs, savings in material costs, and improvements to quality, accuracy, and precision. Automation includes the use of various equipment and control systems such as machinery, processes in factories, boilers, and heat-treating ovens, switching on telephone networks, steering, and stabilization of ships, aircraft, and other applications and vehicles with reduced hu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Digital Electronics
Digital electronics is a field of electronics involving the study of digital signals and the engineering of devices that use or produce them. This is in contrast to analog electronics and analog signals. Digital electronic circuits are usually made from large assemblies of logic gates, often packaged in integrated circuits. Complex devices may have simple electronic representations of Boolean logic functions. History The binary number system was refined by Gottfried Wilhelm Leibniz (published in 1705) and he also established that by using the binary system, the principles of arithmetic and logic could be joined. Digital logic as we know it was the brain-child of George Boole in the mid 19th century. In an 1886 letter, Charles Sanders Peirce described how logical operations could be carried out by electrical switching circuits.Peirce, C. S., "Letter, Peirce to A. Marquand", dated 1886, '' Writings of Charles S. Peirce'', v. 5, 1993, pp. 541–3. GooglPreview See Burks, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
ACEC (company)
SA Ateliers de Constructions Electriques de Charleroi (abbrev. ACEC) was a Belgian manufacturer of electrical generation, transmission, transport, lighting and industrial equipment, with origins dating to the late 19th century as a successor to the ''Société Électricité et Hydraulique'' founded by Julien Dulait. After World War II the company expanded into electronics, and became a contractor to the nuclear industry. The company was acquired by Westinghouse in 1970; in 1985 Westinghouse's share was acquired by Société Générale de Belgique (SGB) and Compagnie Générale d'Electricité (CGE). The company operated at a loss during the 1980s, and was split and sold; Alstom and its affiliates acquired the majority of the company, along with ABB and Alcatel Bell and others. The remnants of the company were merged into Union Minière in 1989, forming ''ACEC Union Minière''. History Background, 1878–1904 In 1878 Julien Dulait (1855–1926), son of steelworks engineer J ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thyristor
A thyristor () is a solid-state semiconductor device with four layers of alternating P- and N-type materials used for high-power applications. It acts exclusively as a bistable switch (or a latch), conducting when the gate receives a current trigger, and continuing to conduct until the voltage across the device is reversed biased, or until the voltage is removed (by some other means). There are two designs, differing in what triggers the conducting state. In a three-lead thyristor, a small current on its Gate lead controls the larger current of the Anode to Cathode path. In a two-lead thyristor, conduction begins when the potential difference between the Anode and Cathode themselves is sufficiently large (breakdown voltage). Some sources define silicon-controlled rectifier (SCR) and thyristor as synonymous. Other sources define thyristors as more complex devices that incorporate at least four layers of alternating N-type and P-type substrate. The first thyristor devices were ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Planar Transistor
A diffused junction transistor is a transistor formed by diffusing dopants into a semiconductor substrate. The diffusion process was developed later than the alloy junction and grown junction processes for making bipolar junction transistors (BJTs). Bell Labs developed the first prototype diffused junction bipolar transistors in 1954. Diffused-base transistor The earliest diffused junction transistors were diffused-base transistors. These transistors still had alloy emitters and sometimes alloy collectors like the earlier alloy-junction transistors. Only the base was diffused into the substrate. Sometimes the substrate formed the collector, but in transistors like Philco's micro-alloy diffused transistors the substrate was the bulk of the base. Double diffusion At Bell Labs Calvin Souther Fuller produced basic physical understanding of a means of directly forming the emitter, base, and collector by double diffusion. The method was summarized in a history of science at Bell ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon
Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic table: carbon is above it; and germanium, tin, lead, and flerovium are below it. It is relatively unreactive. Because of its high chemical affinity for oxygen, it was not until 1823 that Jöns Jakob Berzelius was first able to prepare it and characterize it in pure form. Its oxides form a family of anions known as silicates. Its melting and boiling points of 1414 °C and 3265 °C, respectively, are the second highest among all the metalloids and nonmetals, being surpassed only by boron. Silicon is the eighth most common element in the universe by mass, but very rarely occurs as the pure element in the Earth's crust. It is widely distributed in space in cosmic dusts, planetoids, and planets as various forms of silicon dioxide ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Alloy Transistor
The germanium alloy-junction transistor, or alloy transistor, was an early type of bipolar junction transistor, developed at General Electric and RCA in 1951 as an improvement over the earlier grown-junction transistor. The usual construction of an alloy-junction transistor is a germanium crystal forming the base, with emitter and collector alloy beads fused on opposite sides. Indium and antimony were commonly used to form the alloy junctions on a bar of N-type germanium. The collector junction pellet would be about 50 mils (thousandths of an inch) in diameter, and the emitter pellet about 20 mils. The base region would be on the order of 1 mil (0.001 inches, 25 μm) thick. There were several types of improved alloy-junction transistors developed over the years that they were manufactured. All types of alloy-junction transistors became obsolete in the early 1960s, with the introduction of the planar transistor which could be mass-produced easily while alloy-junction transistor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Germanium
Germanium is a chemical element with the symbol Ge and atomic number 32. It is lustrous, hard-brittle, grayish-white and similar in appearance to silicon. It is a metalloid in the carbon group that is chemically similar to its group neighbors silicon and tin. Like silicon, germanium naturally reacts and forms complexes with oxygen in nature. Because it seldom appears in high concentration, germanium was discovered comparatively late in the discovery of the elements. Germanium ranks near fiftieth in relative abundance of the elements in the Earth's crust. In 1869, Dmitri Mendeleev predicted its existence and some of its properties from its position on his periodic table, and called the element ekasilicon. In 1886, Clemens Winkler at Freiberg University found the new element, along with silver and sulfur, in the mineral argyrodite. Winkler named the element after his country, Germany. Germanium is mined primarily from sphalerite (the primary ore of zinc), though germanium is ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Single In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For ex ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Potting (electronics)
In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge, for resistance to shock and vibration, and for the exclusion of water, moisture, or corrosive agents. When such materials are used only on the components, it is referred to as encapsulation. Thermosetting plastics or silicone rubber gels are often used, though epoxy resins are also very common. When epoxy resins are used, low chloride grades are usually specified. Many sites recommend using a potting product to protect sensitive electronic components from impact, vibration, and loose wires. In the potting process, an electronic assembly is placed inside a mold (i.e. the "pot") which is then filled with an insulating liquid compound that hardens, permanently protecting the assembly. The mold may be part of the finished article and may provide shielding or heat dissipating functions in ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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