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Nanoelectromechanical Relay
A nanoelectromechanical (NEM) relay is an electrically actuated switch that is built on the nanometer scale using semiconductor fabrication techniques. They are designed to operate in replacement of, or in conjunction with, traditional semiconductor logic. While the mechanical nature of NEM relays makes them switch much slower than solid-state relays, they have many advantageous properties, such as zero current leakage and low power consumption, which make them potentially useful in next generation computing. A typical NEM Relay requires a potential on the order of the tens of volts in order to "pull in" and have contact resistances on the order of gigaohms. Coating contact surfaces with platinum can reduce achievable contact resistance to as low as 3 kΩ. Compared to transistors, NEM relays switch relatively slowly, on the order of nanoseconds. Operation A NEM relay can be fabricated in two, three, or four terminal configurations. A three terminal relay is composed of a sourc ...
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Switch
In electrical engineering, a switch is an electrical component that can disconnect or connect the conducting path in an electrical circuit, interrupting the electric current or diverting it from one conductor to another. The most common type of switch is an electromechanical device consisting of one or more sets of movable electrical contacts connected to external circuits. When a pair of contacts is touching current can pass between them, while when the contacts are separated no current can flow. Switches are made in many different configurations; they may have multiple sets of contacts controlled by the same knob or actuator, and the contacts may operate simultaneously, sequentially, or alternately. A switch may be operated manually, for example, a light switch or a keyboard button, or may function as a sensing element to sense the position of a machine part, liquid level, pressure, or temperature, such as a thermostat. Many specialized forms exist, such as the toggle swi ...
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Static Random-access Memory
Static random-access memory (static RAM or SRAM) is a type of random-access memory (RAM) that uses latching circuitry (flip-flop) to store each bit. SRAM is volatile memory; data is lost when power is removed. The term ''static'' differentiates SRAM from DRAM (''dynamic'' random-access memory) — SRAM will hold its data permanently in the presence of power, while data in DRAM decays in seconds and thus must be periodically refreshed. SRAM is faster than DRAM but it is more expensive in terms of silicon area and cost; it is typically used for the cache and internal registers of a CPU while DRAM is used for a computer's main memory. History Semiconductor bipolar SRAM was invented in 1963 by Robert Norman at Fairchild Semiconductor. MOS SRAM was invented in 1964 by John Schmidt at Fairchild Semiconductor. It was a 64-bit MOS p-channel SRAM. The SRAM was the main driver behind any new CMOS-based technology fabrication process since 1959 when CMOS was invented. In 1965, ...
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Automotive Electronics
Automotive electronics are electronic systems used in vehicles, including engine management, ignition, radio, carputers, telematics, in-car entertainment systems, and others. Ignition, engine and transmission electronics are also found in trucks, motorcycles, off-road vehicles, and other internal combustion powered machinery such as forklifts, tractors and excavators. Related elements for control of relevant electrical systems are also found on hybrid vehicles and electric cars. Electronic systems have become an increasingly large component of the cost of an automobile, from only around 1% of its value in 1950 to around 30% in 2010. Modern electric cars rely on power electronics for the main propulsion motor control, as well as managing the battery system. Future autonomous cars will rely on powerful computer systems, an array of sensors, networking, and satellite navigation, all of which will require electronics. History The earliest electronic systems available as ...
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Instruction Cycle
The instruction cycle (also known as the fetch–decode–execute cycle, or simply the fetch-execute cycle) is the cycle that the central processing unit (CPU) follows from boot-up until the computer has shut down in order to process instructions. It is composed of three main stages: the fetch stage, the decode stage, and the execute stage. In simpler CPUs, the instruction cycle is executed sequentially, each instruction being processed before the next one is started. In most modern CPUs, the instruction cycles are instead executed concurrently, and often in parallel, through an instruction pipeline: the next instruction starts being processed before the previous instruction has finished, which is possible because the cycle is broken up into separate steps. Role of components The program counter (PC) is a special register that holds the memory address of the next instruction to be executed. During the fetch stage, the address stored in the PC is copied into the memory addres ...
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Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern compute ...
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Mechanical Computer
A mechanical computer is a computer built from mechanical components such as levers and gears rather than electronic components. The most common examples are adding machines and mechanical counters, which use the turning of gears to increment output displays. More complex examples could carry out multiplication and division—Friden used a moving head which paused at each column—and even differential analysis. One model, the Ascota 170 accounting machine sold in the 1960s calculated square roots. Mechanical computers can be either analog, using smooth mechanisms such as curved plates or slide rules for computations; or digital, which use gears. Mechanical computers reached their zenith during World War II, when they formed the basis of complex bombsights including the Norden, as well as the similar devices for ship computations such as the US Torpedo Data Computer or British Admiralty Fire Control Table. Noteworthy are mechanical flight instruments for early spacecraft, whi ...
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Radio Frequency
Radio frequency (RF) is the oscillation rate of an alternating electric current or voltage or of a magnetic, electric or electromagnetic field or mechanical system in the frequency range from around to around . This is roughly between the upper limit of audio frequencies and the lower limit of infrared frequencies; these are the frequencies at which energy from an oscillating current can radiate off a conductor into space as radio waves. Different sources specify different upper and lower bounds for the frequency range. Electric current Electric currents that oscillate at radio frequencies (RF currents) have special properties not shared by direct current or lower audio frequency alternating current, such as the 50 or 60 Hz current used in electrical power distribution. * Energy from RF currents in conductors can radiate into space as electromagnetic waves ( radio waves). This is the basis of radio technology. * RF current does not penetrate deeply into ele ...
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Electroplating
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode (negative electrode) of an electrolytic cell; the electrolyte is a solution of a salt of the metal to be coated; and the anode (positive electrode) is usually either a block of that metal, or of some inert conductive material. The current is provided by an external power supply. Electroplating is widely used in industry and decorative arts to improve the surface qualities of objects—such as resistance to abrasion and corrosion, lubricity, reflectivity, electrical conductivity, or appearance. It is used to build up thickness on undersized or worn-out parts, or to manufacture metal plates with complex shape, a process called electroforming. It is used to deposit copper and other conductors in forming pr ...
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Bulk Micromachining
Bulk micromachining is a process used to produce micromachinery or microelectromechanical systems (MEMS). Unlike surface micromachining, which uses a succession of thin film deposition and selective etching, bulk micromachining defines structures by selectively etching inside a substrate. Whereas surface micromachining creates structures ''on top'' of a substrate, bulk micromachining produces structures ''inside'' a substrate. Usually, silicon wafers are used as substrates for bulk micromachining, as they can be anisotropically wet etched, forming highly regular structures. Wet etching typically uses alkaline liquid solvents, such as potassium hydroxide (KOH) or tetramethylammonium hydroxide (TMAH) to dissolve silicon which has been left exposed by the photolithography masking step. These alkali solvents dissolve the silicon in a highly anisotropic way, with some crystallographic orientations dissolving up to 1000 times faster than others. Such an approach is often used with ve ...
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Inverter (logic Gate)
In digital logic, an inverter or NOT gate is a logic gate which implements logical negation. It outputs a bit opposite of the bit that is put into it. The bits are typically implemented as two differing voltage levels. Description The NOT gate outputs a zero when given a one, and a one when given a zero. Hence, it inverts its inputs. Colloquially, this inversion of bits is called "flipping" bits. As with all binary logic gates, other pairs of symbols such as true and false, or high and low may be used in lieu of one and zero. It is equivalent to the logical negation operator (¬) in mathematical logic. Because it has only one input, it is a unary operation and has the simplest type of truth table. It is also called the complement gate because it produces the ones' complement of a binary number, swapping 0s and 1s. The NOT gate is one of three basic logic gates from which any Boolean circuit may be built up. Together with the AND gate and the OR gate, any function in binar ...
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CMOS
Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", ) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors (CMOS sensors), data converters, RF circuits ( RF CMOS), and highly integrated transceivers for many types of communication. The CMOS process was originally conceived by Frank Wanlass at Fairchild Semiconductor and presented by Wanlass and Chih-Tang Sah at the International Solid-State Circuits Conference in 1963. Wanlass later filed US patent 3,356,858 for CMOS circuitry and it was granted in 1967. commercialized the technology with the trademark ...
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Back End Of Line
The back end of line (BEOL) is the second portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring on the wafer, the metalization layer. Common metals are copper and aluminum. BEOL generally begins when the first layer of metal is deposited on the wafer. BEOL includes contacts, insulating layers (dielectrics), metal levels, and bonding sites for chip-to-package connections. After the last FEOL step, there is a wafer with isolated transistors (without any wires). In BEOL part of fabrication stage contacts (pads), interconnect wires, vias and dielectric structures are formed. For modern IC process, more than 10 metal layers can be added in the BEOL. Steps of the BEOL: # Silicidation of source and drain regions and the polysilicon region. # Adding a dielectric (first, lower layer is pre-metal dielectric (PMD) – to isolate metal from silicon and polysilicon), CMP processing it # Make holes in PMD, make ...
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