Memory Module
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Memory Module
In computing, a memory module or RAM (random-access memory) stick is a printed circuit board on which memory integrated circuits are mounted. Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were proprietary designs that were specific to a model of computer from a specific manufacturer. Later, memory modules were standardized by organizations such as JEDEC and could be used in any system designed to use them. Types of memory module include: * TransFlash Memory Module * SIMM, a single in-line memory module * DIMM, dual in-line memory module ** Rambus memory modules are a subset of DIMMs, but are normally referred to as RIMMs ** SO-DIMM, small outline DIMM, a smaller version of the DIMM, used in laptops Distinguishing characteristics of computer memory modules include voltage, capacity, speed (i.e., bit rate), and form factor. For economic reasons, the ...
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DIMMs
A DIMM () (Dual In-line Memory module, Memory Module), commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These Memory module, memory modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printer (computing), printers, and Server (computing), servers. They are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC memory standards, JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are and laptop (SO-DIMM) which are about half the size at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5 (microarchitecture), P5-based Pentium (brand), Pentium processors began to gain market share. The Pentium had a 64-bit bus (computing), bus width, which would r ...
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Cache Memory
In computing, a cache ( ) is a hardware or software component that stores data so that future requests for that data can be served faster; the data stored in a cache might be the result of an earlier computation or a copy of data stored elsewhere. A ''cache hit'' occurs when the requested data can be found in a cache, while a ''cache miss'' occurs when it cannot. Cache hits are served by reading data from the cache, which is faster than recomputing a result or reading from a slower data store; thus, the more requests that can be served from the cache, the faster the system performs. To be cost-effective and to enable efficient use of data, caches must be relatively small. Nevertheless, caches have proven themselves in many areas of computing, because typical computer applications access data with a high degree of locality of reference. Such access patterns exhibit temporal locality, where data is requested that has been recently requested already, and spatial locality, where d ...
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Zig-zag In-line Package
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages ( TSOPs), but are still in use. The quad in-line package uses a smilar staggered semiconductor package design. High-power devices (such as hi ...
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Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For e ...
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Industry Standard Architecture
Industry Standard Architecture (ISA) is the 16-bit internal bus of IBM PC/AT and similar computers based on the Intel 80286 and its immediate successors during the 1980s. The bus was (largely) backward compatible with the 8-bit bus of the 8088-based IBM PC, including the IBM PC/XT as well as IBM PC compatibles. Originally referred to as the PC bus (8-bit) or AT bus (16-bit), it was also termed ''I/O Channel'' by IBM. The ISA term was coined as a retronym by competing PC-clone manufacturers in the late 1980s or early 1990s as a reaction to IBM attempts to replace the AT-bus with its new and incompatible Micro Channel architecture. The 16-bit ISA bus was also used with 32-bit processors for several years. An attempt to extend it to 32 bits, called Extended Industry Standard Architecture (EISA), was not very successful, however. Later buses such as VESA Local Bus and PCI were used instead, often along with ISA slots on the same mainboard. Derivatives of the AT bus structure ...
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Motherboard
A motherboard (also called mainboard, main circuit board, mb, mboard, backplane board, base board, system board, logic board (only in Apple computers) or mobo) is the main printed circuit board (PCB) in general-purpose computers and other expandable systems. It holds and allows communication between many of the crucial electronic components of a system, such as the central processing unit (CPU) and memory, and provides connectors for other peripherals. Unlike a backplane, a motherboard usually contains significant sub-systems, such as the central processor, the chipset's input/output and memory controllers, interface connectors, and other components integrated for general use. ''Motherboard'' means specifically a PCB with expansion capabilities. As the name suggests, this board is often referred to as the "mother" of all components attached to it, which often include peripherals, interface cards, and daughterboards: sound cards, video cards, network cards, host bus adapters, TV t ...
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Adhesive
Adhesive, also known as glue, cement, mucilage, or paste, is any non-metallic substance applied to one or both surfaces of two separate items that binds them together and resists their separation. The use of adhesives offers certain advantages over other binding techniques such as sewing, mechanical fastenings, or welding. These include the ability to bind different materials together, the more efficient distribution of stress across a joint, the cost-effectiveness of an easily mechanized process, and greater flexibility in design. Disadvantages of adhesive use include decreased stability at high temperatures, relative weakness in bonding large objects with a small bonding surface area, and greater difficulty in separating objects during testing. Adhesives are typically organized by the method of adhesion followed by ''reactive'' or ''non-reactive'', a term which refers to whether the adhesive chemically reacts in order to harden. Alternatively, they can be organized eithe ...
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16 GiB-DDR4-RAM-Riegel RAM019FIX Small Crop 90 PCNT
Sixteen or 16 may refer to: *16 (number), the natural number following 15 and preceding 17 *one of the years 16 BC, AD 16, 1916, 2016 Films * '' Pathinaaru'' or ''Sixteen'', a 2010 Tamil film * ''Sixteen'' (1943 film), a 1943 Argentine film directed by Carlos Hugo Christensen * ''Sixteen'' (2013 Indian film), a 2013 Hindi film * ''Sixteen'' (2013 British film), a 2013 British film by director Rob Brown Music *The Sixteen, an English choir *16 (band), a sludge metal band * Sixteen (Polish band), a Polish band Albums * ''16'' (Robin album), a 2014 album by Robin * 16 (Madhouse album), a 1987 album by Madhouse * ''Sixteen'' (album), a 1983 album by Stacy Lattisaw *''Sixteen'' , a 2005 album by Shook Ones * ''16'', a 2020 album by Wejdene Songs * "16" (Sneaky Sound System song), 2009 * "Sixteen" (Thomas Rhett song), 2017 * "Sixteen" (Ellie Goulding song), 2019 *"16", by Craig David from ''Following My Intuition'', 2016 *"16", by Green Day from ''39/Smooth'', 1990 *"16", by H ...
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RAM N
Ram, ram, or RAM may refer to: Animals * A male sheep * Ram cichlid, a freshwater tropical fish People * Ram (given name) * Ram (surname) * Ram (director) (Ramsubramaniam), an Indian Tamil film director * RAM (musician) (born 1974), Dutch * Raja Ram (musician) (Ronald Rothfield), Australian * Ram Dass (Richard Alpert), US spiritual teacher and author * Kavitark Ram Shriram (born 1950s), Google founding board member * Ram Herrera, a Tejano musician Religion * Rama, incarnation of the god Vishnu in Hinduism * Ram and Rud, progenitors of the second generation of humans in Mandaeism Places * Ram, Serbia, Veliko Gradište * Lake Ram, Golan Heights, Syria * Ram Island (other), several islands with the name * Ram Fortress, Serbia * Ram Range, a mountain range in the Canadian Rockies * Ram River in Alberta, Canada * Ramingining Airport, IATA airport code "RAM" Arts, entertainment, and media * ''Ram'' (album), a 1971 album by Paul and Linda McCartney * RAM (band), Port- ...
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Integrated Circuit Packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signal ...
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