List Of LED Failure Modes
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List Of LED Failure Modes
The most common way for LEDs (and diode lasers) to fail is the gradual lowering of light output and loss of efficiency. Sudden failures, however rare, can occur as well. Early red LEDs were notable for their short lifetime. Packaging-related *Epoxy degradation: Some materials of the plastic package tend to yellow when subjected to heat, causing partial absorption (and therefore loss of efficiency) of the affected wavelengths. * Thermal stress: Sudden failures are most often caused by thermal stresses. When the epoxy resin package reaches its glass transition temperature, it starts rapidly expanding, causing mechanical stresses on the semiconductor and the bonded contact, weakening it or even tearing it off. Conversely, very low temperatures can cause cracking of the packaging. * Differentiated phosphor degeneration: The different phosphors used in white LEDs tend to degrade with heat and age, but at different rates causing changes in the produced light color, for example, purple ...
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Blue LED Failure
Blue is one of the three primary colours in the RYB colour model (traditional colour theory), as well as in the RGB (additive) colour model. It lies between violet and cyan on the spectrum of visible light. The eye perceives blue when observing light with a dominant wavelength between approximately 450 and 495 nanometres. Most blues contain a slight mixture of other colours; azure contains some green, while ultramarine contains some violet. The clear daytime sky and the deep sea appear blue because of an optical effect known as Rayleigh scattering. An optical effect called Tyndall effect explains blue eyes. Distant objects appear more blue because of another optical effect called aerial perspective. Blue has been an important colour in art and decoration since ancient times. The semi-precious stone lapis lazuli was used in ancient Egypt for jewellery and ornament and later, in the Renaissance, to make the pigment ultramarine, the most expensive of all pigments. In the eigh ...
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Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation (particle radiation and high-energy electromagnetic radiation), especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare. Most semiconductor electronic components are susceptible to radiation damage, and radiation-hardened (rad-hard) components are based on their non-hardened equivalents, with some design and manufacturing variations that reduce the susceptibility to radiation damage. Due to the extensive development and testing required to produce a radiation-tolerant design of a microelectronic chip, the technology of radiation-hardened chips tends to lag behind the most recent developments. Radiation-hardened products are typically tested to one or more resultant-effects tests, including total i ...
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Thermal Runaway
Thermal runaway describes a process that is accelerated by increased temperature, in turn releasing energy that further increases temperature. Thermal runaway occurs in situations where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback. In chemistry (and chemical engineering), thermal runaway is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar-mass stars, the " he ...
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Current Filament
A current filament is an inhomogeneity in the current density distribution lateral to the direction of the current flow (that is, orthogonal to the current density vector). It is common in devices showing current-type negative differential conductivity In electronics, negative resistance (NR) is a property of some electrical circuits and devices in which an increase in voltage across the device's terminals results in a decrease in electric current through it. This is in contrast to an ordina ..., especially of S-type (SNDC). References Semiconductor device defects {{Electronics-stub ...
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Current Crowding
Current crowding (also current crowding effect, or CCE) is a nonuniform distribution of current density through a conductor or semiconductor, especially in the vicinity of electrical contacts and over PN junctions. Current crowding is one of the factors limiting the efficiency of light-emitting diodes. Materials with low electron mobility, mobility of charge carriers (e.g., aluminium gallium indium phosphide (AlGaInP)) are especially prone to current crowding phenomena. It is the dominant loss mechanism in some LEDs, where the current densities, especially around the P-side contacts, reach an area of the emission characteristics with lower brightness/current efficiency. Current crowding can lead to localized overheating and formation of thermal hotspots, in catastrophic cases leading to thermal runaway. Nonhomogenous distribution of current also aggravates electromigration effects and the formation of voids (see, e.g., the Kirkendall effect). Formation of voids causes localized nonh ...
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Kirkendall Voiding
The Kirkendall effect is the motion of the interface between two metals that occurs as a consequence of the difference in diffusion rates of the metal atoms. The effect can be observed for example by placing insoluble markers at the interface between a pure metal and an alloy containing that metal, and heating to a temperature where atomic diffusion is reasonable for the given timescale; the boundary will move relative to the markers. This process was named after Ernest Kirkendall (1914–2005), assistant professor of chemical engineering at Wayne State University from 1941 to 1946. The paper describing the discovery of the effect was published in 1947. The Kirkendall effect has important practical consequences. One of these is the prevention or suppression of voids formed at the boundary interface in various kinds of alloy to metal bonding. These are referred to as Kirkendall voids. History The Kirkendall effect was discovered by Ernest Kirkendall and Alice Smigelskas in 1947 ...
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Soldering
Soldering (; ) is a process in which two or more items are joined by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Origins There is evidence that soldering was employed as early as 5,000 years ago in Mesopotamia. Soldering and brazing are thought to have originated very early in the history of metal-working, probably before 4000 BC. Sumerian swords from were assembled using hard soldering. Soldering was historically used to make jewelry, cookware and cooking tools, assembling stained glass, as well as other uses. ...
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Thermal Conductivity
The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by k, \lambda, or \kappa. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like Rockwool or Styrofoam. Correspondingly, materials of high thermal conductivity are widely used in heat sink applications, and materials of low thermal conductivity are used as thermal insulation. The reciprocal of thermal conductivity is called thermal resistivity. The defining equation for thermal conductivity is \mathbf = - k \nabla T, where \mathbf is the heat flux, k is the thermal conductivity, and \nabla T is the temperature gradient. This is known as Fourier's Law for heat conduction. Although commonly expressed as a scalar, the most general form of th ...
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Thermal Runaway
Thermal runaway describes a process that is accelerated by increased temperature, in turn releasing energy that further increases temperature. Thermal runaway occurs in situations where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback. In chemistry (and chemical engineering), thermal runaway is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar-mass stars, the " he ...
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Whisker (metallurgy)
Metal whiskering is a phenomenon which occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads, causing short circuits. Metal whiskers form in the presence of compressive stress. Germanium, zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem, including changes to the annealing process (heating and cooling), the addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders. Following the Restriction of Hazardous Substances Directive (RoHS), the European Union banned the use of lead in most consumer electronic products from 2006 d ...
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Short Circuits
A short circuit (sometimes abbreviated to short or s/c) is an electrical circuit that allows a current to travel along an unintended path with no or very low electrical impedance. This results in an excessive current flowing through the circuit. The opposite of a short circuit is an "open circuit", which is an infinite resistance between two nodes. Definition A short circuit is an abnormal connection between two nodes of an electric circuit intended to be at different voltages. This results in an electric current limited only by the Thévenin equivalent resistance of the rest of the network which can cause circuit damage, overheating, fire or explosion. Although usually the result of a fault, there are cases where short circuits are caused intentionally, for example, for the purpose of voltage-sensing crowbar circuit protectors. In circuit analysis, a ''short circuit'' is defined as a connection between two nodes that forces them to be at the same voltage. In an 'ideal' sh ...
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Barrier Metal
A diffusion barrier is a thin layer (usually micrometres thick) of metal usually placed between two other metals. It is done to act as a barrier to protect either one of the metals from corrupting the other.. Adhesion of a plated metal layer to its substrate requires a physical interlocking, inter-diffusion of the deposit or a chemical bonding between plate and substrate in order to work. The role of a diffusion barrier is to prevent or to retard the inter-diffusion of the two superposed metals. Therefore, to be effective, a good diffusion barrier requires inertness with respect to adjacent materials. To obtain good adhesion and a diffusion barrier simultaneously, the bonding between layers needs to come from a chemical reaction of limited range at both boundaries. Materials providing good adhesion are not necessarily good diffusion barriers and vice versa. Consequently, there are cases where two or more separate layers must be used to provide a proper interface between substrates. ...
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