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Laser Voltage Prober
The laser voltage probe (LVP) is a laser-based voltage and timing waveform acquisition system which is used to perform failure analysis on flip-chip integrated circuits. The device to be analyzed is de-encapsulated in order to expose the silicon surface. The silicon substrate is thinned mechanically using a back side mechanical thinning tool. The thinned device is then mounted on a movable stage and connected to an electrical stimulus source. Signal measurements are performed through the back side of the device after substrate thinning has been performed. The device being probed must be electrically stimulated using a repeating test pattern, with a trigger pulse provided to the LVP as reference. The operation of the LVP is similar to that of a sampling oscilloscope. Theory of operation The LVP instrument measures voltage waveform signals in the device diffusion regions. Device imaging is accomplished through the use of a laser scanning microscope (LSM). The LVP uses dual infrared ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Waveform
In electronics, acoustics, and related fields, the waveform of a signal is the shape of its graph as a function of time, independent of its time and magnitude scales and of any displacement in time.David Crecraft, David Gorham, ''Electronics'', 2nd ed., , CRC Press, 2002, p. 62 In electronics, the term is usually applied to periodically varying voltages, currents, or electromagnetic fields. In acoustics, it is usually applied to steady periodic sounds—variations of pressure in air or other media. In these cases, the waveform is an attribute that is independent of the frequency, amplitude, or phase shift of the signal. The term can also be used for non-periodic signals, like chirps and pulses. The waveform of an electrical signal can be visualized in an oscilloscope or any other device that can capture and plot its value at various times, with a suitable scales in the time and value axes. The electrocardiograph is a medical device to record the waveform of the ele ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Failure Analysis
Failure analysis is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability. According to Bloch and Geitner, ”machinery failures reveal a reaction chain of cause and effect… usually a deficiency commonly referred to as the symptom…”. failure analysis can save money, lives, and resources if done correctly and acted upon. It is an important discipline in many branches of manufacturing industry, such as the electronics industry, where it is a vital tool used in the development of new products and for the improvement of existing products. The failure analysis process relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods, especially microscopy and spectroscopy. Nondestructive testing (NDT) methods (such as industrial computed tomography scanning) are valuable because the failed products are unaffected by analysis, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer (electronics)
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon Crystalline silicon or (c-Si) Is the crystalline forms of silicon, either polycrystalline silicon (poly-Si, consisting of small crystals), or monocrystalline silicon (mono-Si, a continuous crystal). Crystalline silicon is the dominant semiconduc ... (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate (materials science), substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping (semiconductor), doping, ion implantation, Etching (microfabrication), etching, thin-film deposition of various materials, and Photolithography, photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and Integrated circuit packaging, packaged as an integrated circuit. History I ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Confocal Laser Scanning Microscopy
Confocal microscopy, most frequently confocal laser scanning microscopy (CLSM) or laser confocal scanning microscopy (LCSM), is an optical imaging technique for increasing optical resolution and contrast of a micrograph by means of using a spatial pinhole to block out-of-focus light in image formation. Capturing multiple two-dimensional images at different depths in a sample enables the reconstruction of three-dimensional structures (a process known as optical sectioning) within an object. This technique is used extensively in the scientific and industrial communities and typical applications are in life sciences, semiconductor inspection and materials science. Light travels through the sample under a conventional microscope as far into the specimen as it can penetrate, while a confocal microscope only focuses a smaller beam of light at one narrow depth level at a time. The CLSM achieves a controlled and highly limited depth of field. Basic concept The principle of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Infrared
Infrared (IR), sometimes called infrared light, is electromagnetic radiation (EMR) with wavelengths longer than those of visible light. It is therefore invisible to the human eye. IR is generally understood to encompass wavelengths from around 1 millimeter (300 GHz) to the nominal red edge of the visible spectrum, around 700 nanometers (430 THz). Longer IR wavelengths (30 μm-100 μm) are sometimes included as part of the terahertz radiation range. Almost all black-body radiation from objects near room temperature is at infrared wavelengths. As a form of electromagnetic radiation, IR propagates energy and momentum, exerts radiation pressure, and has properties corresponding to both those of a wave and of a particle, the photon. It was long known that fires emit invisible heat; in 1681 the pioneering experimenter Edme Mariotte showed that glass, though transparent to sunlight, obstructed radiant heat. In 1800 the astronomer Sir William Herschel discovered ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Laser
A laser is a device that emits light through a process of optical amplification based on the stimulated emission of electromagnetic radiation. The word "laser" is an acronym for "light amplification by stimulated emission of radiation". The first laser was built in 1960 by Theodore H. Maiman at Hughes Research Laboratories, based on theoretical work by Charles Hard Townes and Arthur Leonard Schawlow. A laser differs from other sources of light in that it emits light which is ''coherent''. Spatial coherence allows a laser to be focused to a tight spot, enabling applications such as laser cutting and lithography. Spatial coherence also allows a laser beam to stay narrow over great distances (collimation), enabling applications such as laser pointers and lidar (light detection and ranging). Lasers can also have high temporal coherence, which allows them to emit light with a very narrow spectrum. Alternatively, temporal coherence can be used to produce ultrashort pulses of ligh ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electromagnetism
In physics, electromagnetism is an interaction that occurs between particles with electric charge. It is the second-strongest of the four fundamental interactions, after the strong force, and it is the dominant force in the interactions of atoms and molecules. Electromagnetism can be thought of as a combination of electricity and magnetism, two distinct but closely intertwined phenomena. In essence, electric forces occur between any two charged particles, causing an attraction between particles with opposite charges and repulsion between particles with the same charge, while magnetism is an interaction that occurs exclusively between ''moving'' charged particles. These two effects combine to create electromagnetic fields in the vicinity of charge particles, which can exert influence on other particles via the Lorentz force. At high energy, the weak force and electromagnetic force are unified as a single electroweak force. The electromagnetic force is responsible for many o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reliability Engineering
Reliability engineering is a sub-discipline of systems engineering that emphasizes the ability of equipment to function without failure. Reliability describes the ability of a system or component to function under stated conditions for a specified period of time. Reliability is closely related to availability, which is typically described as the ability of a component or system to function at a specified moment or interval of time. The reliability function is theoretically defined as the probability of success at time t, which is denoted R(t). This probability is estimated from detailed (physics of failure) analysis, previous data sets or through reliability testing and reliability modelling. Availability, testability, maintainability and maintenance, repair and operations, maintenance are often defined as a part of "reliability engineering" in reliability programs. Reliability often plays the key role in the cost-effectiveness of systems. Reliability engineering deals with the p ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Analysis
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
