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Laser Direct Structuring
A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part by selective metallization. Applications Key markets for the MID technology are consumer electronic, telecommunication, automotive and medical. A very common application for MIDs are integrated antennas in cellphones and other mobile devices including laptops and netbooks. Manufacturing methods Molded interconnect devices are typically manufactured in these technologies: Laser Direct Structuring (LDS) The LDS process uses a thermoplastic material, doped with a (non-conductive) metallic inorganic compound activated by means of laser. The basic component is single-component injection molded, with practically no restrictions ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Injection Molding
Injection moulding (U.S. spelling: injection molding) is a manufacturing process for producing parts by injecting molten material into a mould, or mold. Injection moulding can be performed with a host of materials mainly including metals (for which the process is called die-casting), glasses, elastomers, confections, and most commonly thermoplastic and thermosetting polymers. Material for the part is fed into a heated barrel, mixed (using a helical screw), and injected into a mould cavity, where it cools and hardens to the configuration of the cavity. After a product is designed, usually by an industrial designer or an engineer, moulds are made by a mould-maker (or toolmaker) from metal, usually either steel or aluminium, and precision-machined to form the features of the desired part. Injection moulding is widely used for manufacturing a variety of parts, from the smallest components to entire body panels of cars. Advances in 3D printing technology, using photopolymers that ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermoplastic
A thermoplastic, or thermosoft plastic, is any plastic polymer material that becomes pliable or moldable at a certain elevated temperature and solidifies upon cooling. Most thermoplastics have a high molecular weight. The polymer chains associate by intermolecular forces, which weaken rapidly with increased temperature, yielding a viscous liquid. In this state, thermoplastics may be reshaped and are typically used to produce parts by various polymer processing techniques such as injection molding, compression molding, calendering, and extrusion. Thermoplastics differ from thermosetting polymers (or "thermosets"), which form irreversible chemical bonds during the curing process. Thermosets do not melt when heated, but typically decompose and do not reform upon cooling. Above its glass transition temperature and below its melting point, the physical properties of a thermoplastic change drastically without an associated phase change. Some thermoplastics do not fully crystallize ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronic Circuit
An electronic circuit is composed of individual electronic components, such as resistors, transistors, capacitors, inductors and diodes, connected by conductive wires or traces through which electric current can flow. It is a type of electrical circuit and to be referred to as ''electronic'', rather than ''electrical'', generally at least one active component must be present. The combination of components and wires allows various simple and complex operations to be performed: signals can be amplified, computations can be performed, and data can be moved from one place to another. Circuits can be constructed of discrete components connected by individual pieces of wire, but today it is much more common to create interconnections by photolithographic techniques on a laminated substrate (a printed circuit board or PCB) and solder the components to these interconnections to create a finished circuit. In an integrated circuit or IC, the components and interconnections are formed on t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics
The field of electronics is a branch of physics and electrical engineering that deals with the emission, behaviour and effects of electrons using electronic devices. Electronics uses active devices to control electron flow by amplification and rectification, which distinguishes it from classical electrical engineering, which only uses passive effects such as resistance, capacitance and inductance to control electric current flow. Electronics has hugely influenced the development of modern society. The central driving force behind the entire electronics industry is the semiconductor industry sector, which has annual sales of over $481 billion as of 2018. The largest industry sector is e-commerce, which generated over $29 trillion in 2017. History and development Electronics has hugely influenced the development of modern society. The identification of the electron in 1897, along with the subsequent invention of the vacuum tube which could amplify and rectify small ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Substrate (materials Science)
Substrate is a term used in materials science and engineering to describe the base material on which processing is conducted. This surface could be used to produce new film or layers of material such as deposited coatings. It could be the base to which paint, adhesives, or adhesive tape is bonded. A typical substrate might be rigid such as metal, concrete, or glass, onto which a coating might be deposited. Flexible substrates are also used. With all coating processes, the condition of the surface of the substrate can strongly affect the bond of subsequent layers. This can include cleanliness, smoothness, surface energy, moisture, etc. Some substrates are anisotropic with surface properties being different depending on the direction: examples include wood and paper products. Coatings Coating can be by a variety of processes: * Adhesives and Adhesive tapes * Coating and printing processes * Chemical vapor deposition and physical vapor deposition * Conversion coating :* A ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Polycarbonate
Polycarbonates (PC) are a group of thermoplastic polymers containing carbonate groups in their chemical structures. Polycarbonates used in engineering are strong, tough materials, and some grades are optically transparent. They are easily worked, molded, and thermoformed. Because of these properties, polycarbonates find many applications. Polycarbonates do not have a unique resin identification code (RIC) and are identified as "Other", 7 on the RIC list. Products made from polycarbonate can contain the precursor monomer bisphenol A (BPA). Structure Carbonate esters have planar OC(OC)2 cores, which confers rigidity. The unique O=C bond is short (1.173 Å in the depicted example), while the C-O bonds are more ether-like (the bond distances of 1.326 Å for the example depicted). Polycarbonates received their name because they are polymers containing carbonate groups (−O−(C=O)−O−). A balance of useful features, including temperature resistance, impact resistance and o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Butadiene
1,3-Butadiene () is the organic compound with the formula (CH2=CH)2. It is a colorless gas that is easily condensed to a liquid. It is important industrially as a precursor to synthetic rubber. The molecule can be viewed as the union of two vinyl groups. It is the simplest conjugated diene. Although butadiene breaks down quickly in the atmosphere, it is nevertheless found in ambient air in urban and suburban areas as a consequence of its constant emission from motor vehicles. The name butadiene can also refer to the isomer, 1,2-butadiene, which is a cumulated diene with structure H2C=C=CH−CH3. This allene has no industrial significance. History In 1863, the French chemist E. Caventou isolated butadiene from the pyrolysis of amyl alcohol. This hydrocarbon was identified as butadiene in 1886, after Henry Edward Armstrong isolated it from among the pyrolysis products of petroleum. In 1910, the Russian chemist Sergei Lebedev polymerized butadiene and obtained a material wit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
