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List Of VIA C3 Microprocessors
The C3 microprocessor from VIA Technologies is a fifth-generation CPU targeted at the desktop and mobile markets. Desktop processors C3 "Samuel 2" (150 nm) * All models support: ''MMX, 3DNow!, LongHaul'' * FPU runs at 50% of core speed "Ezra"/"Ezra-T" (130 nm) * All models support: ''MMX, 3DNow!, LongHaul'' * FPU runs at 50% of core speed "Nehemiah" (130 nm) * All models support: ''MMX, SSE, VIA PadLock (AES, RNG), LongHaul'' Mobile processors C3-M "Ezra"/"Ezra-T" (130 nm) * All models support: ''MMX, 3DNow!, LongHaul'' * FPU runs at 50% of core speed "Nehemiah" (130 nm) * All models support: ''MMX, SSE, VIA PadLock (AES, RNG)'' * VIA PowerSaver supported External links VIA C3 product pageVIA C3-M product pageVIA Processor specification comparison See also * List of VIA microprocessors {{VIA *C3 VIA Via or VIA may refer to the following: Science and technology * MOS Technology 6522, Versatile Interface Adapter * ''Via'' (moth), a genus of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
VIA C3
The VIA C3 is a family of x86 central processing units for personal computers designed by Centaur Technology and sold by VIA Technologies. The different CPU cores are built following the design methodology of Centaur Technology. In addition to x86 instructions, VIA C3 CPUs contain an undocumented Alternate Instruction Set allowing lower-level access to the CPU and in some cases privilege escalation. Cores Samuel 2 and Ezra cores VIA Cyrix III was renamed VIA C3 with the switch to the advanced "Samuel 2" (C5B) core. The addition of an on-die L2 cache improved performance somewhat. As it was not built upon Cyrix technology at all, the new name was just a logical step. To improve power consumption and reduce manufacturing costs, Samuel 2 was produced with 150 nm process technology. The VIA C3 processor continued an emphasis on minimizing power consumption with the next die shrink to a mixed 130/150 nm process. "Ezra" (C5C) and "Ezra-T" (C5N) were only new revisions ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
VIA Technologies
VIA Technologies Inc. (), is a Taiwanese manufacturer of integrated circuits, mainly motherboard chipsets, CPUs, and memory. It was the world's largest independent manufacturer of motherboard chipsets. As a fabless semiconductor company, VIA conducts research and development of its chipsets in-house, then subcontracts the actual (silicon) manufacturing to third-party merchant foundries such as TSMC. History The company was founded in 1987, in Fremont, California, USA by Cher Wang. In 1992, it was decided to move the headquarters to Taipei, Taiwan in order to establish closer partnerships with the substantial and growing IT manufacturing base in Taiwan and neighbouring China. In 1999, VIA acquired most of Cyrix, then a division of National Semiconductor. That same year, VIA acquired Centaur Technology from Integrated Device Technology, marking its entry into the x86 microprocessor market. VIA is the maker of the VIA C3, VIA C7 & VIA Nano processors, and the EPIA platform. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MMX (instruction Set)
MMX is a ''single instruction, multiple data'' (SIMD) instruction set architecture designed by Intel, introduced on January 8, 1997 with its Pentium P5 (microarchitecture) based line of microprocessors, named "Pentium with MMX Technology". It developed out of a similar unit introduced on the Intel i860, and earlier the Intel i750 video pixel processor. MMX is a processor supplementary capability that is supported on IA-32 processors by Intel and other vendors . The New York Times described the initial push, including Super Bowl advertisements, as focused on "a new generation of glitzy multimedia products, including videophones and 3-D video games." MMX has subsequently been extended by several programs by Intel and others: 3DNow!, Streaming SIMD Extensions (SSE), and ongoing revisions of Advanced Vector Extensions (AVX). Overview Naming MMX is officially a meaningless initialism trademarked by Intel; unofficially, the initials have been variously explained as standing fo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3DNow!
3DNow! is a deprecated extension to the x86 instruction set developed by Advanced Micro Devices (AMD). It adds single instruction multiple data (SIMD) instructions to the base x86 instruction set, enabling it to perform vector processing of floating-point vector-operations using Vector registers, which improves the performance of many graphic-intensive applications. The first microprocessor to implement 3DNow was the AMD K6-2, which was introduced in 1998. When the application was appropriate, this raised the speed by about 2–4 times. However, the instruction set never gained much popularity, and AMD announced on August 2010 that support for 3DNow would be dropped in future AMD processors, except for two instructions (the PREFETCH and PREFETCHW instructions). The two instructions are also available in Bay-Trail Intel processors. History 3DNow was developed at a time when 3D graphics were becoming mainstream in PC multimedia and games. Realtime display of 3D graphics depende ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LongHaul
VIA LongHaul is a CPU speed throttling and power saving technology developed by VIA Technologies. By executing specialized instructions, software can exercise fine control on the bus-to-core frequency ratio and CPU core voltage. When the system first boots, the ratio and voltage are set to hardware defaults. While the operating system runs, a ''CPU driver'' controls the throttling according to how much load is put on the CPU. This fine control over the CPU's operating parameters brings LongHaul in contrast to other competing technologies, where a CPU is typically allowed to switch between only two states - one that is fast but power-consuming and one that is slow but uses less power. However LongHaul is considered similar to Transmeta's LongRun technology. There are 3 versions of LongHaul: * Version 1 only supports dynamic frequency scaling and is implemented in the Cyrix III Samuel (C5A) core and C3 Samuel 2 (C5B) stepping 0 core. * Version 2 adds voltage scaling and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Caches
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit (MMU) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Front Side Bus
A front-side bus (FSB) is a computer communication interface ( bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus. The speed of the front side bus is often used as an important measure of the performance of a computer. The original front-side bus architecture has been replaced by HyperTransport, Intel QuickPath Interconnect or Direct Media Interface in modern volume CPUs. History The term came into use by Intel Corporation about the time the Pentium Pro and Pentium II products were announced, in the 1990s. "Front side" refers to the ex ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Multiplier
In computing, the clock multiplier (or CPU multiplier or bus/core ratio) sets the ratio of an internal CPU clock rate to the externally supplied clock. A CPU with a 10x multiplier will thus see 10 internal cycles (produced by PLL-based frequency multiplier circuitry) for every external clock cycle. For example, a system with an external clock of 100 MHz and a 36x clock multiplier will have an internal CPU clock of 3.6 GHz. The external address and data buses of the CPU (often collectively termed front side bus (FSB) in PC contexts) also use the external clock as a fundamental timing base; however, they could also employ a (small) multiple of this base frequency (typically two or four) to transfer data faster. The internal frequency of microprocessors is usually based on FSB frequency. To calculate internal frequency the CPU multiplies bus frequency by a number called the clock multiplier. For calculation, the CPU uses actual bus frequency, and not effective bus freque ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP ra ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket 370
Socket 370 (also known as the PGA370 socket) is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins. Socket 370 was replaced by Socket 423 in 2000. Overview Socket 370 started as a budget oriented platform for 66 MHz FSB PPGA Mendocino Celeron CPUs in late 1998, as the move to on-die L2 cache removed the need for a PCB design as seen on Slot 1. From late 1999 to late 2000 it was Intel's main desktop socket for 100/133 MHz FSB Coppermine Pentium IIIs. In 2001, the Tualatin Pentium III processors brought changes to the infrastructure which required dedicated Tualatin-compatible motherboards; some manufacturers would indicate this with a blue (instead of white) socket. These late sockets were typically compatible with Coppermine processors, but not older Mendocino Celerons. Some motherboards that ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Streaming SIMD Extensions
In computing, Streaming SIMD Extensions (SSE) is a single instruction, multiple data ( SIMD) instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series of Central processing units (CPUs) shortly after the appearance of Advanced Micro Devices (AMD's) 3DNow!. SSE contains 70 new instructions (65 unique mnemonics using 70 encodings), most of which work on single precision floating-point data. SIMD instructions can greatly increase performance when exactly the same operations are to be performed on multiple data objects. Typical applications are digital signal processing and graphics processing. Intel's first IA-32 SIMD effort was the MMX instruction set. MMX had two main problems: it re-used existing x87 floating-point registers making the CPUs unable to work on both floating-point and SIMD data at the same time, and it only worked on integers. SSE floating-point instructions operate on a new independent register set ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PowerSaver
VIA LongHaul is a CPU speed throttling and power saving technology developed by VIA Technologies. By executing specialized instructions, software can exercise fine control on the bus-to-core frequency ratio and CPU core voltage. When the system first boots, the ratio and voltage are set to hardware defaults. While the operating system runs, a ''CPU driver'' controls the throttling according to how much load is put on the CPU. This fine control over the CPU's operating parameters brings LongHaul in contrast to other competing technologies, where a CPU is typically allowed to switch between only two states - one that is fast but power-consuming and one that is slow but uses less power. However LongHaul is considered similar to Transmeta's LongRun technology. There are 3 versions of LongHaul: * Version 1 only supports dynamic frequency scaling and is implemented in the Cyrix III Samuel (C5A) core and C3 Samuel 2 (C5B) stepping 0 core. * Version 2 adds voltage scaling and is i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
