|
Intel Xe
Intel Xe (stylized as Xe and pronounced as two separate letters, abbreviation for "eXascale for everyone"), earlier known unofficially as Gen12, is a GPU architecture developed by Intel. Intel Xe includes a new instruction set architecture. The Xe GPU family consists of a series of microarchitectures, ranging from integrated/low power (Xe-LP), to enthusiast/high performance gaming (Xe-HPG), datacenter/high performance (Xe-HP) and high performance computing (Xe-HPC). History Intel's first attempt at a dedicated graphics card was the Intel740, released in February 1998. The Intel740 was considered unsuccessful due to its performance which was lower than market expectations, causing Intel to cease development on future discrete graphics products. However, its technology lived on in the Intel Extreme Graphics lineup. Intel made another attempt with the Larrabee architecture before canceling it in 2009; this time, the technology developed was used in the Xeon Phi, which was disco ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (''int''egrated and ''el''ectronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Radeon
Radeon () is a brand of computer products, including graphics processing units, random-access memory, RAM disk software, and solid-state drives, produced by Radeon Technologies Group, a division of AMD. The brand was launched in 2000 by ATI Technologies, which was acquired by AMD in 2006 for US$5.4 billion. Radeon Graphics Radeon Graphics is the successor to the ATI Rage, Rage line. Three different families of microarchitectures can be roughly distinguished, the pipeline (computing), fixed-pipeline family, the unified shader model-families of TeraScale (microarchitecture), TeraScale and Graphics Core Next. ATI/AMD have developed different technologies, such as TruForm, HyperMemory, HyperZ, AMD XGP, XGP, AMD Eyefinity, Eyefinity for multi-monitor setups, AMD PowerPlay, PowerPlay for power-saving, AMD CrossFireX, CrossFire (for multi-GPU) or AMD Hybrid Graphics, Hybrid Graphics. A range of Semiconductor intellectual property core, SIP blocks is also to be found on certain mo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ray-tracing Hardware
Ray-tracing hardware is special-purpose computer hardware designed for accelerating ray tracing calculations. Introduction: Ray tracing and rasterization The problem of rendering 3D graphics can be conceptually presented as finding all intersections between a set of " primitives" (typically triangles or polygons) and a set of "rays" (typically one or more per pixel). Up to 2010, all typical graphic acceleration boards, called graphics processing units (GPUs), used rasterization algorithms. The ray tracing algorithm solves the rendering problem in a different way. In each step, it finds all intersections of a ray with a set of relevant primitives of the scene. Both approaches have their own benefits and drawbacks. Rasterization can be performed using devices based on a stream computing model, one triangle at the time, and access to the complete scene is needed only once. The drawback of rasterization is that non-local effects, required for an accurate simulation of a scene, s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
FP64
Double-precision floating-point format (sometimes called FP64 or float64) is a floating-point number format, usually occupying 64 bits in computer memory; it represents a wide dynamic range of numeric values by using a floating radix point. Floating point is used to represent fractional values, or when a wider range is needed than is provided by fixed point (of the same bit width), even if at the cost of precision. Double precision may be chosen when the range or precision of single precision would be insufficient. In the IEEE 754-2008 standard, the 64-bit base-2 format is officially referred to as binary64; it was called double in IEEE 754-1985. IEEE 754 specifies additional floating-point formats, including 32-bit base-2 ''single precision'' and, more recently, base-10 representations. One of the first programming languages to provide single- and double-precision floating-point data types was Fortran. Before the widespread adoption of IEEE 754-1985, the representation and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Term (logic)
In mathematical logic, a term denotes a mathematical object while a formula denotes a mathematical fact. In particular, terms appear as components of a formula. This is analogous to natural language, where a noun phrase refers to an object and a whole sentence refers to a fact. A first-order term is recursively constructed from constant symbols, variables and function symbols. An expression formed by applying a predicate symbol to an appropriate number of terms is called an atomic formula, which evaluates to true or false in bivalent logics, given an interpretation. For example, is a term built from the constant 1, the variable , and the binary function symbols and ; it is part of the atomic formula which evaluates to true for each real-numbered value of . Besides in logic, terms play important roles in universal algebra, and rewriting systems. Formal definition Given a set ''V'' of variable symbols, a set ''C'' of constant symbols and sets ''F''''n'' of ''n''-ary ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Arithmetic Logic Unit
In computing, an arithmetic logic unit (ALU) is a combinational digital circuit that performs arithmetic and bitwise operations on integer binary numbers. This is in contrast to a floating-point unit (FPU), which operates on floating point numbers. It is a fundamental building block of many types of computing circuits, including the central processing unit (CPU) of computers, FPUs, and graphics processing units (GPUs). The inputs to an ALU are the data to be operated on, called operands, and a code indicating the operation to be performed; the ALU's output is the result of the performed operation. In many designs, the ALU also has status inputs or outputs, or both, which convey information about a previous operation or the current operation, respectively, between the ALU and external status registers. Signals An ALU has a variety of input and output nets, which are the electrical conductors used to convey digital signals between the ALU and external circuitry. When an ALU i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microarchitecture
In computer engineering, microarchitecture, also called computer organization and sometimes abbreviated as µarch or uarch, is the way a given instruction set architecture (ISA) is implemented in a particular processor. A given ISA may be implemented with different microarchitectures; implementations may vary due to different goals of a given design or due to shifts in technology. Computer architecture is the combination of microarchitecture and instruction set architecture. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the instructions, execution model, processor registers, address and data formats among other things. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less de ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3D Die Stacking
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global ( package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; 3D heterogeneous integration; and 3D ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Foveros
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global ( package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; 3D heterogeneous integration; and 3 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
7 Nanometer
In semiconductor manufacturing, the International Technology Roadmap for Semiconductors defines the 7 nm process as the MOSFET technology node following the 10 nm node. It is based on FinFET (fin field-effect transistor) technology, a type of multi-gate MOSFET technology. Taiwan Semiconductor Manufacturing Company (TSMC) began production of 256 Mbit SRAM memory chips using a 7 nm process called N7 in June 2016, before Samsung began mass production of their 7 nm process called 7LPP devices in 2018. The first mainstream 7 nm mobile processor intended for mass market use, the Apple A12 Bionic, was released at Apple's September 2018 event. Although Huawei announced its own 7 nm processor before the Apple A12 Bionic, the Kirin 980 on August 31, 2018, the Apple A12 Bionic was released for public, mass market use to consumers before the Kirin 980. Both chips are manufactured by TSMC. AMD has released their " Rome" (EPYC 2) processors for serve ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
10 Nanometer
In semiconductor fabrication, the International Technology Roadmap for Semiconductors (ITRS) defines the 10 nm process as the MOSFET technology node following the 14 nm node. 10 nm class denotes chips made using process technologies between 10 and 20 nm. All production 10 nm processes are based on FinFET (fin field-effect transistor) technology, a type of multi-gate MOSFET technology that is a non-planar evolution of planar silicon CMOS technology. Samsung first started their production of 10 nm-class chips in 2013 for their multi-level cell (MLC) flash memory chips, followed by their SoCs using their 10 nm process in 2016. TSMC began commercial production of 10 nm chips in 2016, and Intel later began production of 10nm chips in 2018. Since 2009, however, "node" has become a commercial name for marketing purposes that indicates new generations of process technologies, without any relation to gate length, metal pitch or gate pitch. For example, GlobalFoundri ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Autonomous Driving
A self-driving car, also known as an autonomous car, driver-less car, or robotic car (robo-car), is a car that is capable of traveling without human input.Xie, S.; Hu, J.; Bhowmick, P.; Ding, Z.; Arvin, F.,Distributed Motion Planning for Safe Autonomous Vehicle Overtaking via Artificial Potential Field IEEE Transactions on Intelligent Transportation Systems, 2022. Self-driving cars use sensors to perceive their surroundings, such as optical and thermographic cameras, radar, lidar, ultrasound/ sonar, GPS, odometry and inertial measurement units. Control systems interpret sensory information to create a three-dimensional model of the surroundings. Based on the model, the car identifies appropriate navigation paths, and strategies for managing traffic controls (stop signs, etc.) and obstacles.Hu, J.; Bhowmick, P.; Jang, I.; Arvin, F.; Lanzon, A.,A Decentralized Cluster Formation Containment Framework for Multirobot Systems IEEE Transactions on Robotics, 2021. Once the tec ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
