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Espresso (microprocessor)
Espresso is the codename of the 32-bit central processing unit (CPU) used in Nintendo's Wii U video game console. It was designed by IBM, and was produced using a 45 nanometer, 45 nm silicon-on-insulator process. The Espresso chip resides together with a Graphics processing unit, GPU from Advanced Micro Devices, AMD on an multi-chip module, MCM manufactured by Renesas Electronics, Renesas. It was revealed at Electronic Entertainment Expo 2011, E3 2011 in June 2011 and released in November 2012. Design IBM and Nintendo have revealed that the Espresso processor is a PowerPC-based microprocessor with three cores on a single chip to reduce power consumption and increase speed. The CPU and the graphics processor are placed on a single substrate as a multi-chip module (MCM) to reduce complexity, increase the communication speed between the chips, further reduce power consumption and reduce cost and space required. The two chips were assembled to the complete MCM by Renesas in Japan ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
POWER7
POWER7 is a family of superscalar multi-core microprocessors based on the Power ISA 2.06 instruction set architecture released in 2010 that succeeded the POWER6 and POWER6+. POWER7 was developed by IBM at several sites including IBM's Rochester, MN; Austin, TX; Essex Junction, VT; T. J. Watson Research Center, NY; Bromont, QC and IBM Deutschland Research & Development GmbH, Böblingen, Germany laboratories. IBM announced servers based on POWER7 on 8 February 2010. History IBM won a $244 million DARPA contract in November 2006 to develop a petascale supercomputer architecture before the end of 2010 in the HPCS project. The contract also states that the architecture shall be available commercially. IBM's proposal, PERCS (Productive, Easy-to-use, Reliable Computer System), which won them the contract, is based on the POWER7 processor, AIX operating system and General Parallel File System. One feature that IBM and DARPA collaborated on is modifying the addressing and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multiprocessing
Multiprocessing is the use of two or more central processing units (CPUs) within a single computer system. The term also refers to the ability of a system to support more than one processor or the ability to allocate tasks between them. There are many variations on this basic theme, and the definition of multiprocessing can vary with context, mostly as a function of how CPUs are defined ( multiple cores on one die, multiple dies in one package, multiple packages in one system unit, etc.). According to some on-line dictionaries, a multiprocessor is a computer system having two or more processing units (multiple processors) each sharing main memory and peripherals, in order to simultaneously process programs. A 2009 textbook defined multiprocessor system similarly, but noting that the processors may share "some or all of the system’s memory and I/O facilities"; it also gave tightly coupled system as a synonymous term. At the operating system level, ''multiprocessing'' is som ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PowerPC 7xx
The PowerPC 7xx is a family of third generation 32-bit PowerPC microprocessors designed and manufactured by IBM and Motorola (spun off as Freescale Semiconductor bought by NXP Semiconductors). This family is called the PowerPC G3 by its well-known customer Apple Inc., which introduced it on November 10, 1997. The term "PowerPC G3" is often, and incorrectly, imagined to be a microprocessor when in fact a number of microprocessors from different vendors have been used. Such designations were applied to Macintosh computers such as the PowerBook G3, the multicolored iMacs, iBooks and several desktops, including both the Beige and Blue and White Power Macintosh G3s. The low power requirements and small size made the processors ideal for laptops and the name lived out its last days at Apple in the iBook. The 7xx family is also widely used in embedded devices like printers, routers, storage devices, spacecraft, and video game consoles. The 7xx family had its shortcomings, namely lack ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Gekko (microprocessor)
Gekko is a superscalar out-of-order 32-bit PowerPC microprocessor custom-made by IBM in 2000 for Nintendo to use as the Central processing unit, CPU in their Sixth generation of video game consoles, sixth generation game console, the GameCube, and later the Triforce (arcade system board), Triforce Arcade Board. Development Gekko's role in the game system was to facilitate game scripting, Artificial Intelligence, physics and collision detection, custom graphics lighting effects and geometry such as smooth transformations, and moving graphics data through the system. The project was announced in 1999 when IBM and Nintendo agreed to a dollar contract (IBM's largest ever single order) for a CPU running at approximately 400 MHz. IBM chose to modify their existing PowerPC 7xx#PowerPC 750CXe, PowerPC 750CXe processor to suit Nintendo's needs, such as tight and balanced operation alongside the "Flipper" graphics processor. The customization was to the bus architecture, Direct memor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Product Teardown
A product teardown, or simply teardown, is the act of disassembling a product, such that it helps to identify its component parts, chip & system functionality, and component costing information. For products having 'secret' technology, such as the Mikoyan-Gurevich MiG-25, the process may be secret. For others, including consumer electronics, the results are typically disseminated through photographs and component lists so that others can make use of the information without having to disassemble the product themselves. This information is important to designers of semiconductors, displays, batteries, packaging companies, integrated design firms, and semiconductor fabs, and the systems they operate within. This information can be of interest to hobbyists, but can also be used commercially by the technical community to find out, for example, what semiconductor components are being utilized in consumer electronic products, such as the Wii video game console or Apple's iPhone. Such know ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Cache
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit (MMU) w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
EDRAM
Embedded DRAM (eDRAM) is dynamic random-access memory (DRAM) integrated on the same die or multi-chip module (MCM) of an application-specific integrated circuit (ASIC) or microprocessor. eDRAM's cost-per-bit is higher when compared to equivalent standalone DRAM chips used as external memory, but the performance advantages of placing eDRAM onto the same chip as the processor outweigh the cost disadvantages in many applications. In performance and size, eDRAM is positioned between level 3 cache and conventional DRAM on the memory bus, and effectively functions as a level 4 cache, though architectural descriptions may not explicitly refer to it in those terms. Embedding memory on the ASIC or processor allows for much wider buses and higher operation speeds, and due to much higher density of DRAM in comparison to SRAM, larger amounts of memory can be installed on smaller chips if eDRAM is used instead of eSRAM. eDRAM requires additional fab process steps compared with embedded SR ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon On Insulator
In semiconductor manufacturing, silicon on insulator (SOI) technology is fabrication of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator, typically silicon dioxide or sapphire (these types of devices are called silicon on sapphire, or SOS). The choice of insulator depends largely on intended application, with sapphire being used for high-performance radio frequency (RF) and radiation-sensitive applications, and silicon dioxide for diminished short-channel effects in other microelectronics devices. The insulating layer and topmost silicon layer also vary widely with application. Industry need SOI technology is one of several manufacturing strategies to allow the continued miniaturization of microelectronic devices, colloquially referred to as ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
East Fishkill, New York
East Fishkill is a town on the southern border of Dutchess County, New York, United States. The population was 29,707 at the 2020 census. The town was once the eastern portion of the town of Fishkill. Hudson Valley Research Park is located in the town. The site once known as IBM East Fishkill, once housed 27 divisions and 4,700 regular employees for IBM Microelectronics, which latter became a part of GlobalFoundries. IBM produced microchips at this facility and it also house the advanced, automated processor fabrication facility where IBM's "Cell" processor was co-developed. History The Wiccopee, a sub-tribe of the Wappinger Native Americans, once lived in what is now the East Fishkill hamlet of Wiccopee. One early European settler arrived around 1759. Platt Rogers Spencer, the inventor of the leading U.S. business-handwriting style of the 19th Century, was born in the area in 1800. The town of East Fishkill was established in 1849 from the eastern part of the town of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wii U CPU GPU
The Wii ( ) is a home video game console developed and marketed by Nintendo. It was released on November 19, 2006, in North America and in December 2006 for most other regions of the world. It is Nintendo's fifth major home game console, following the GameCube and is a seventh-generation console alongside Microsoft's Xbox 360 and Sony's PlayStation 3. In developing the Wii, Nintendo president Satoru Iwata directed the company to avoid competing with Microsoft and Sony on computational graphics and power and instead to target a broader demographic of players through novel gameplay. Game designers Shigeru Miyamoto and Genyo Takeda led the console's development under the codename Revolution. The primary controller for the Wii is the Wii Remote, a wireless controller with both motion sensing and traditional controls which can be used as a pointing device towards the television screen or for gesture recognition. The Wii was Nintendo's first home console to directly support Inter ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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